We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Cleaning agents.
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Cleaning agents Product List and Ranking from 428 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Dec 31, 2025~Jan 27, 2026
This ranking is based on the number of page views on our site.

Cleaning agents Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Dec 31, 2025~Jan 27, 2026
This ranking is based on the number of page views on our site.

  1. ゼストロンジャパン Kanagawa//Chemical
  2. NCH Japan(日本エヌ・シー・エイチ株式会社) Tokyo//Other manufacturing
  3. カネコ化学 Saitama//Chemical
  4. 4 中部 Aichi//Trading company/Wholesale
  5. 5 アルボース 東京支店  Tokyo//Pharmaceuticals and Biotechnology

Cleaning agents Product ranking

Last Updated: Aggregation Period:Dec 31, 2025~Jan 27, 2026
This ranking is based on the number of page views on our site.

  1. Disinfectant and cleaning agent "Albos Sanitizer EX" アルボース 東京支店 
  2. Water-soluble degreasing cleaner "ND-165" NCH Japan(日本エヌ・シー・エイチ株式会社)
  3. Chlorinated alkaline cleaner for forming in food factories "Topaz CL3" エコラボ フード&ビバレッジ事業部
  4. 4 Fluorine-based cleaning agent "AMOLEA AS-300"
  5. 4 Cleaning agent 日本整備

Cleaning agents Product List

931~945 item / All 1654 items

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Pitfalls of Flux Cleaning with Solvent-Based Cleaners

Are you overlooking ion residues? An explanation of the pitfalls of flux cleaning.

Organic solvents, which are used in various fields, are currently an indispensable part of the chemical industry, and it is difficult to completely stop their use. In recent years, due to technological advancements and corporate efforts in various industries, the amount of organic solvents used and their atmospheric emissions have been significantly reduced. However, in the flux cleaning of electronic devices in Japan, cleaning agents primarily based on organic solvents are widely used. However, flux cleaning has essentially transformed into "complex residue cleaning," and while solvent-based cleaning agents are very effective against organic components such as rosin, they are almost unable to dissolve ionic substances or insoluble metal salts, making removal by "dissolution" methods difficult. *For more detailed information, please refer to the related links. For further details, please check the PDF materials or feel free to contact us.*

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Examples of technical challenges related to 5G

Behind the scenes of 5G development by the responsible company! Introducing cleaning know-how.

"5G," which has gained even more attention due to the new coronavirus. In Japan, commercial services started in the spring of 2020, and it is said to have an impact not only on mobile phones but also in various fields such as automobiles, industrial equipment, and healthcare. Since it is a technology that has evolved further from 4G, it is easy to imagine that there were many challenges in its development. Curious about the background, I spoke with companies involved in the development of 5G. *For more details, you can view the related links. Please refer to the PDF materials or feel free to contact us for more information.*

  • Technical and Reference Books
  • Cleaning agents

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Examples of technical challenges related to 5G [Joint Research]

We will introduce an example of how to actually solve the technical challenges associated with 5G!

On this page, we will discuss how to solve the technical challenges associated with 5G, providing an example of a solution. In the previous discussion, we learned that there are cases in 5G-related work where failure can occur if cleaning is not performed. Now, regarding "how to clean," there are important points to consider in the case of 5G work. *For detailed information, please refer to the related links. For more information, please check the PDF materials or feel free to contact us.*

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Relationship between implementation components and ion residues [Joint research with Mr. Hiroki]

By selecting cleaning solder paste and flux, you can ensure more reliable cleanliness!

The theme of this discussion is ions, which are essential for electronic devices. However, unintended ions can remain on the device surface, between electrodes, or in low stand-off areas, resulting in "ion residue." Moreover, since these residues can be supplied from various contamination pathways that include not only raw material factors but also environmental factors, achieving a residual amount of zero is technically very challenging. In this instance, we have collaborated with solder manufacturers to assess the ion residue levels for each implemented component. *For more detailed information, please refer to the related links. *The PDF document is a technical resource that explains the issues and analysis methods related to ion residue.

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Effects of morphological changes in flux residues after soldering on cleanability.

[Joint Research] Joint research on the effects of morphological changes on washability! Detailed explanations and images are presented.

The no-clean solder paste, which continues to evolve, generates significant heat in fields such as 5G devices and high-power devices for electric vehicles (EVs). As environmental burdens increase, it is necessary to pay attention to long-term changes even in stabilized flux residues. Recent market trends have led to the miniaturization of high-performance electronic devices, resulting in reduced distances between components. This, along with the demand for high-speed calculations and increased capacity, has resulted in high currents and voltages. Consequently, even slight flux residues that were previously not problematic can pose various risks, making cleaning necessary in high-reliability devices, even for no-clean flux residues. Together with Mr. Hiroki, who is developing high-performance solder paste, we conducted joint research on the morphological changes of flux residues after soldering and their impact on cleanability. *For more details, please refer to the related links. *The PDF document is a technical material explaining the evolution and challenges of power devices.

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Verification of the cleaning properties of Sn-Bi low melting point solder paste - Joint Research

Published solutions to challenges in the formation of metal salts (Bi salts)! We conducted joint verification of cleaning performance.

The Sn-Bi solder paste has various advantages, but in high-reliability fields, there are situations where cleaning is required, and one of the cleaning challenges is the formation of metal salts (Bi salts) after sintering. Bi salts can potentially cause migration issues, are difficult to dissolve in organic solvents, and make cleaning challenging. To address the issue of Bi salt formation, we conducted a joint verification of the cleaning properties of the low-melting-point Sn-Bi solder paste developed by Japan Superior Inc. *For more details, please refer to the related link. *The PDF document is a technical material that explains the evolution and challenges of power devices.

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Is there no cleaning agent that is non-flammable and takes safety and environmental considerations into account?

Introducing examples of project improvements regarding cleaning agents that consider safety and environmental aspects!

Organic solvents, used in various fields, are currently an indispensable part of the chemical industry, and it is difficult to completely stop their use. In the cleaning sector as well, while the amount of organic solvents used has been decreasing, they are still used extensively. However, recent legal reforms and global circumstances have accelerated the movement to reduce the use of organic solvents, making it essential to reassess their usage. *For detailed case information, please refer to the related links. For more information, please check the PDF materials or feel free to contact us.*

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  • 引火性がなく、安全面・環境面に配慮した洗浄剤はないのだろうか3.JPG
  • Cleaning agents
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No more failures! How to choose a flux cleaner [Materials available]

Attention those struggling with flux cleaning! The key to flux cleaning lies in "selecting the right cleaning agent"!

This document explains how to choose flux cleaning agents. It provides specific examples of key points to consider when selecting a flux cleaning agent and highlights the aspects to focus on. It also includes important considerations for water-based cleaning agents, such as controlling evaporation loss and variations in water content, as well as examples of non-cleaning type flux cleaning cases, so please take a moment to read it. [Contents (partial)] ■ Key points when choosing flux cleaning agents ■ Types of flux cleaning agents ■ Important considerations when examining water-based cleaning agents ■ Examples of non-cleaning type flux cleaning *For more details, please refer to the PDF document or feel free to contact us.

  • Cleaning agents
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Evaluation Methods for Flux Cleaning / Added Value [Seminar Materials]

An explanation of the latest cleanliness analysis methods and the added value of using flux cleaning agents!

This document provides a detailed explanation of evaluation methods and added value in flux cleaning. It introduces "cleanliness analysis in flux cleaning," as well as "substances to be analyzed," "the impact of residual organic matter," and "the pathways and effects of ion contamination." Additionally, it includes an introduction to Zestron and examples of analytical methods. We encourage you to read it. 【Contents (partial)】 ■ Introduction to Zestron ■ Cleanliness analysis in flux cleaning ■ Substances to be analyzed (flux residues) ■ Substances to be analyzed (residues during sintering) ■ Impact of residual organic matter *For more details, please download the PDF or feel free to contact us.

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Evaluation of cleanliness after cleaning: Analysis methods for flux residues and residues after sintering bonding.

In the cleaning of electronic devices, various factors are intertwined! An explanation of the importance of cleanliness evaluation.

In recent years, the miniaturization and high density of electronic devices have progressed, and along with this, the evolution of the bonding materials used has also coincided, making contamination more complex. In particular, in fields such as automotive, aerospace, space, and high-capacity communication, there is an increasing number of cases that require high reliability, and concurrently, there is a demand for reliable cleaning from the perspective of quality assurance. Inadequate cleaning can lead to issues such as poor wire bonding, poor adhesion of resin in molding, and the occurrence of migration, which is a well-known fact. However, in recent years, there have been many cases where defects occur in later processes despite passing inspections, and we have seen an increase in inquiries to our company regarding this issue. Why do such cases arise? This time, we will explain the importance of cleanliness evaluation after cleaning. *For more detailed information, please refer to the related links. For further inquiries, feel free to contact us.*

  • Cleaning agents
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Troubles with Flux Cleaning Due to High-Density Component Mounting [Case Study]

Along with a case study on cleaning defects due to high-density implementation, we will also provide guidance on methods for restructuring the cleaning process!

We would like to introduce a case study on the investigation of factors leading to cleaning failures due to flux cleaning troubles caused by the high density of component mounting. With the increase in the density of component mounting, a change in the solder paste used was made, but there have been reports of defects believed to be caused by cleaning issues. Based on the information gathered, we inferred the current situation. We conducted an analysis and evaluation of the hypotheses and proposed both temporary and permanent measures tailored to the customer's circumstances based on the results. [Case Overview] ■ Issues - Cleaning performance of flux in low stand-off areas ■ Conclusion - Stable operation is difficult under the current cleaning conditions ■ Permanent improvement measures and proposals - Review of cleaning agents and cleaning processes suitable for the work shape and flux *For more details, please download the PDF or feel free to contact us.

  • Cleaning agents
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What is water-soluble flux? An explanation of water-soluble flux residues and analysis methods.

The role and applications of water-soluble flux! We will explain residues, analytical methods, and cleaning methods.

Water-soluble flux is a flux based on water, using water-soluble polymers such as polyoxyethylene alkyl ether. Currently, rosin-based flux is the mainstream for soldering in electronics assembly in Japan, but due to the increasing environmental awareness such as the SDGs, there is a movement to explore the transition to water-soluble flux, which is expected to reduce VOCs. *For more details, you can view the related links. Please feel free to contact us for more information.

  • Other polymer materials
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Is a cleaning agent really unnecessary? Cleaning verification of water-soluble flux / Joint research with Hiroki.

Is a cleaning agent really unnecessary? Information on the cleaning verification results of water-soluble flux.

In current electronics assembly in Japan, rosin-based flux is predominantly used for soldering. However, due to the promotion of the SDGs and the increasing interest in reducing environmental impact, there is an active evaluation of water-soluble flux, which is expected to reduce VOC emissions and cleaning burdens. This time, we will present an investigation into the actual cleaning situation of water-soluble flux, which is recognized as easier to clean than rosin-based flux. *For detailed information, please refer to the related links. For more details, you can download the PDF or feel free to contact us.*

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  • Cleaning agents
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Removal of sinter agent residue + tack agent, joint research with Mr. McDermid.

Explaining the cleaning effect of complex organic substances after using the currently popular sintering agent! Joint research with Mr. McDermid.

In recent years, the advancement of electronic devices has led to a demand for advanced bonding technologies that can withstand high heat, large currents, and high voltages. In particular, in power devices, there are increasing cases where conventional solder types do not provide sufficient performance. While high Pb solder and Au/Sn solder can be applied, the use of "sintered bonding" is expanding due to environmental regulations and cost considerations, as it can form a high-density bonding layer. This article examines effective cleaning methods utilizing spray cleaning and ultrasonic cleaning, and introduces the features and application examples of cleaning agents VIGON PE 305N and VIGON PE 216A for power electronics. *For detailed content of the article, please refer to the related links. For more information, you can download the PDF or feel free to contact us.

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Basic Knowledge of Flux Cleaning ver.2 [Technical Document]

A must-read for those who want to start flux cleaning! "Why wash? How to choose? How to analyze?" can be understood in this one book!

This document explains the key points for considering "flux cleaning methods," as well as the examination of "cleaning and rinsing processes," "drying processes," and the evaluation (analysis) of residues. It is recommended for those who want to start flux cleaning and for those who wish to gain a comprehensive understanding from cleaning to analysis. 【Contents (partial)】 ■ What is flux cleaning? ■ The purpose of flux cleaning and the fields where cleaning is required ■ Types of flux cleaning agents/methods and selection methods ■ The importance and methods of residue evaluation (analysis), etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Cleaning agents
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