Dry-type dicer board cutting machine 'SAM-CT1520D' *Test cutting
Cutting the substrate with the blade rotating at a high speed of up to 200mm/sec! No need for water or fixing UV tape, reducing costs.
The dry-type dicer SAM-CT1520D achieves sharp cutting surfaces without applying stress by rotating the blade at high speed to cut the substrate. (Cutting speed: 20mm/sec to 200mm/sec, cutting width: 0.1mm to 0.5mm) Thanks to a powerful dust collection system, the adhesion of chips to the substrate is minimal. Since no water is used, water supply and drainage facilities are not required, making it environmentally friendly and reducing running costs. *Test cutting is also available.* 【Features】 ■ High-speed and high-precision cutting ■ Environmental measures and reduction of running costs ■ Safe cutting and workpiece decharging ■ High operability *For more details, please refer to the materials by clicking the "PDF Download" button.* *If you wish to conduct a demonstration with a demo machine, please check "Request for Demo" when contacting us via "Web Inquiry."*
- Company:SAYAKA Co. Ltd.
- Price:Other