Etching Product List and Ranking from 31 Manufacturers, Suppliers and Companies

Braille etching

The technology of braille etching is a patented product of Toho! The integration of patterns and braille enhances design quality!

The technology of dot engraving is our patented product, which, unlike traditional embossing methods, allows for the creation of highly designed braille plates by integrating patterns and braille. For more details, please contact us or download the catalog.

High quality, short delivery time - Features of metal etching

It is characterized by high quality, short delivery times, and good cost performance.

Shinkou Photo Service Co., Ltd.'s metal etching is characterized by high quality, short delivery times, and excellent cost performance. We have received positive feedback from many customers. Metal etching offers numerous advantages, such as no distortion or burrs, and compatibility with almost all metals. Because it is processed through scientific corrosion, it avoids burrs, distortion, and work hardening, allowing for high-precision processing. We can achieve high-precision processing for most metal materials, including stainless steel, copper alloys (copper, phosphor bronze, beryllium copper, etc.), iron, nickel, and aluminum. Compared to precision press processing, there is no need for molds, resulting in lower initial costs. Additionally, changes to drawings are easy. For small lot items like prototypes, we can produce them in just four days. Please contact us for more details.

Mesh filter

Round hole filters and honeycomb mesh, etc.! You can create freely shaped designs.

Introducing the "Mesh Filter by Etching" manufactured by Meltech Co., Ltd. We already have mesh colors available through welding, but this is a flat product made using a different method (etching process). Since it does not fray, there is no concern about metal debris or injuries, and because there is no weaving, there is no deformation of holes due to mesh openings, preventing the entry of foreign substances beyond specifications. 【Features】 ■ No fraying... Since it does not fray, there is no concern about hole deformation or the generation of metal debris and injuries. ■ No mesh openings... Because there is no weaving, there is no deformation of holes due to mesh openings, preventing the entry of foreign substances beyond specifications. ■ No clogging... The flat surface prevents the entrapment and clogging of powders, making cleaning easy. ■ Custom design... We can create custom shapes for outer frames, hole shapes, hole diameters, etc. ■ Reduction of initial costs... No expensive jigs are required. *For more details, please refer to the PDF document or feel free to contact us.

Etching of stainless steel plates

By etching, you can create high-definition unevenness on the stainless steel surface to express designs, patterns, and textures such as design drawings and photographs.

After using screen printing technology or photo plate technology to print and transfer pattern diagrams or images onto stainless steel plates, the areas not masked are dissolved with etching solution to create fine irregularities, expressing designs and textures on the stainless steel plates. When the etched stainless steel is colored with fine colors or Noies, the shadows of the fine irregularities are enhanced, making the etched patterns stand out even more. The etching methods include general printing etching and photo etching, which allows for high-definition expression. *If you provide digital data, we can also create custom designs for etching as per your request. *For more details, please refer to the catalog or feel free to contact us.

Three-dimensional finishing method for aluminum (etching method)

After anodizing aluminum, cover the parts of the surface that you want to remain as a three-dimensional image with a corrosion-resistant protective film, and then immerse it in a solution that dissolves aluminum. The unprotected unwanted parts will be removed (etching process, see figure), resulting in the desired three-dimensional image. Since the dissolved area reveals the raw aluminum, further anodizing can be applied to this part, and if necessary, it can also be dyed. In this way, three-dimensional images or text can be obtained, and by combining the differences in gloss and matte finishes due to the pre-treatment of the image and the base material, along with dyeing, decorative reliefs and nameplates with rich design can be achieved.

Hyper Etching

It is possible to achieve further miniaturization with two-fluid technology.

Hyper etching, which combines super etching and unique dual-fluid technology, achieves the same finish on both sides while accommodating cutting-edge fine pitch.

Puriken Co., Ltd. Printed Circuit Board Etching (Inner Layer)

Ferric chloride etching solution has a fast etching speed and high viscosity, which results in excellent precision!

Our company performs "etching (inner layer)" using process equipment. In the plating room, unnecessary copper parts are chemically dissolved. After the etching is completed and the conductor pattern is finished, the unnecessary etching resist (partial protective mask) is removed, resulting in a copper pattern. 【Characteristics of Ferric Chloride Etching Solution】 ■ Fast etching speed ■ High viscosity ■ Excellent etching precision ■ Recyclable *For more details, please refer to the PDF document or feel free to contact us.

Purikenn Co., Ltd. Printed Circuit Board Etching (Outer Layer)

Chemically dissolve the unnecessary copper! After completing the conductor pattern, peel off to reveal the copper foil pattern.

Our company performs "etching (outer layer)" using process equipment. In the plating room, the unnecessary parts of the copper are chemically dissolved. After etching and completing the conductor pattern, the etching resist (partial protective mask) is no longer needed, so it is removed, resulting in the copper foil pattern. 【Process】 ■ Etching ■ Stripping *For more details, please refer to the PDF document or feel free to contact us.

Photoetching

Microfabrication for glass substrates, optical films, and various high-performance films!

We would like to introduce our "Photo Etching" services. Using precision photographic technology, we offer integrated processing of fine precision photography on glass substrates, quartz, silicon, films, and wafer deposition films. We also accept fine processing of optical system films, including high-resolution films, and various high-performance optical films. Additionally, we process original plates and photomasks using laser direct drawing. Please feel free to contact us when you need our services. 【Lineup】 ■ Metal film photo etching (Cr, Cr2O3, Al, Au, Cu, Ni, and others) - Reticles, charts, scales, encoder slits, electrodes ■ Thin film photo etching - Lift-off, SiO2 diffraction gratings, ITO ■ Glass substrate etching - Observation slide glass, flow paths, diffusion plates (transmittance control available) *For more details, please refer to the PDF document or feel free to contact us.

Various aspects of etching

Various aspects of etching

This time, we would like you to know about various aspects of etching. - What is etching? - Advantages and disadvantages of etching - Etching techniques Please take a look, and if you have any questions, feel free to consult with us at Equal.

Etching

We can also process a variety of substrates with complex and intricate patterns.

We will create complex and intricate patterns using methods such as etching, lift-off, mask processing, and precision screen printing on the formed thin film. We can accommodate a variety of substrates including glass, metal, ceramics, silicon, and resins (PET film, acrylic, polyimide).

Aluminum processing technology Super Etching "Alumirion"

Achieving deep super etching up to 0.2 in depth!

- Achieved super etching with sharp edges deeper than other companies' processing (up to 0.2 in roughness). - Achieved high-resolution pattern super etching with standard etching (roughness of 0.05 to 0.15 mm).

Silicon etching

Silicon etching

Introducing Photo Precision Co., Ltd., which contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as its core technology. "Silicon Etching" Overview A technology that etches the silicon substrate itself to form three-dimensional structures. ■□■ Features ■□■ ■ Utilizing the crystal orientation of silicon, it enables groove processing with flat groove walls (anisotropic etching). V-shaped and rectangular grooves can be formed. ■ Depending on the type of etching solution, rounded edges can be created on the groove walls, allowing for isotropic etching as well. ■□■ Types of Processing ■□■ ■ V-Groove Processing - Using silicon material with a <100> surface orientation, V-shaped grooves are formed. - The angle of the slope is always the same (54.7°). ■ Rectangular Groove Processing - Using silicon material with a <110> surface orientation, rectangular grooves are formed. - Due to the crystal structure, the direction of the grooves tilts at 54.7° relative to the side surface. ■ Isotropic - Etching progresses uniformly in all directions. For more details, please download the catalog or contact us.

Glass etching

Glass etching

Glass etching does not have the directionality of Si wafers, but the range of material and work dimensions is very broad, and it is used in various fields. For more details, please feel free to "contact us."

[Must-See for Engineers!!] MEMS-related Photo Etching Technical Documentation Collection

A collection of technical materials that consolidates useful information for research and development related to MEMS, where technological development is advancing, is available for free!

MEMS, centered around photofabrication and micromachine technology, is expected to thrive in various application fields. We are pleased to announce the comprehensive release of a "Technical Data Collection" that includes numerous processing and application technologies. This collection is filled with information on essential technologies such as "photoetching," which is a fundamental technology in MEMS and display device substrates; "dicing processing," a technique for accurately cutting out circuits formed on silicon wafers into chips; and "bump formation," which is indispensable for various mounting technologies such as CSP, BGA, and flip chips. For more details, please contact us or refer to the catalog.