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Plasma Equipment Product List and Ranking from 66 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Mar 18, 2026~Apr 14, 2026
This ranking is based on the number of page views on our site.

Plasma Equipment Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Mar 18, 2026~Apr 14, 2026
This ranking is based on the number of page views on our site.

  1. 魁半導体 Kyoto//Educational and Research Institutions
  2. JFEプラントエンジ Tokyo//others
  3. ジャパンクリエイト Saitama//Testing, Analysis and Measurement
  4. 4 null/null
  5. 5 アクア Kyoto//Research and development equipment and devices

Plasma Equipment Product ranking

Last Updated: Aggregation Period:Mar 18, 2026~Apr 14, 2026
This ranking is based on the number of page views on our site.

  1. Digital Oil Checker "Wendy" JFEプラントエンジ
  2. Handheld Atmospheric Pressure Plasma Treatment Device "Piezo Brush PZ3"
  3. Dry etching device RIE-10NR (parallel plate type RIE device) サムコ
  4. 4 Atmospheric pressure plasma treatment device for powders ジェイ・サイエンス・ラボ 本社
  5. 5 Small tabletop plasma inner wall treatment device "IPSOLON" 泉工業

Plasma Equipment Product List

121~150 item / All 200 items

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Small equipment using plasma technology

We also support systems and equipment that include plasma technology.

Small equipment using plasma technology We also accommodate systems and equipment that include plasma technology. 【Example Specifications (Equipment Configuration)】 ◇ Touch panel control Film winding speed adjustment Tension control Plasma power adjustment Gas flow rate adjustment, etc. ◇ Continuous processing of film using R to R Primary processing with atmospheric pressure plasma Adjustable plasma irradiation position ◇ Secondary processing with a spray coater Adjustable coating amount Adjustable spray position ◇ Tertiary processing with heater heating Adjustable heating temperature Adjustable distance between heater and film Please feel free to consult us regarding specifications. Additionally, if you require experiments conducted by our technical staff, we can accommodate this for an optional fee. For any other questions, please do not hesitate to contact us.

  • Plasma Generator
  • Plasma Equipment

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Medium-sized vacuum plasma device [Easy operation with one-touch functionality]

A large vacuum plasma device specialized for surface modification! With easy one-touch operation, it can be easily used even by beginners. It has been widely adopted in universities and other institutions!

This is a large vacuum plasma device specialized for surface modification. It features a one-touch full-auto function and an auto-leak function, making it very easy to handle, even for beginners with vacuum equipment. It operates on a standard AC100V outlet, allowing for use in various situations. Additionally, it is very easy to maintain. The chamber size can also be customized to meet your requirements.

  • Vacuum Equipment
  • Plasma Equipment

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Medical and bio plasma equipment

In recent years, the application of plasma technology in the medical bio field has been advancing. We are introducing two models that are perfect for such research and development!

The unique phenomena of plasma are being utilized in the medical field. Applications are advancing in the development of high-performance medical materials through surface modification and treatment (such as cell culture dishes), sterilization and disinfection purposes, and adhesion enhancement through improved hydrophilicity. This product achieves a compact size, one-touch operability, and an affordable price range that is easy to introduce. ☆Products - Desktop Vacuum Plasma Device YHS-R Plasma is discharged in a vacuum chamber to uniformly treat the material surface. *Search for YHS-R - Pen-type Atmospheric Pressure Plasma Device P500-SM Generates plasma at low temperature and without charge damage in atmospheric pressure. It can be easily used with one touch. *Search for P500-SM ☆Effects - Surface modification / hydrophilic treatment / cell culture / sterilization / adhesion enhancement, etc... ☆Features - Simple one-touch operability - Compact size - Equipment rental and contract processing are available. - Free processing support for first-time users. For more details, please download the catalog.

  • Printed Circuit Board
  • Plasma Equipment

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Plasma Technology Data Presentation (Kai Semiconductor)

Technical documents on plasma, including surface changes of various materials (such as gold, resin, glass), surface composition from XPS measurements, and changes over time, are compiled.

Table of Contents 1. What is Plasma!? 2. Principles of Surface Modification 3. Effects of Plasma Treatment 4. Surface Composition 5. Time-dependent Changes 6. Introduction of Applications 7. Vacuum and Atmospheric Pressure Plasma 8. Tube Plasma 9. Powder Plasma Treatment 10. Technical Scope of Correspondence

  • Other cleaning machines
  • Plasma Equipment

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Hydrophilic, cleaning, adhesion enhancement 'Rotary Vacuum Plasma Device'

A rotary plasma device that can simultaneously process the surface modification (hydrophilicity, cleaning, adhesion enhancement) of "powders and solid surfaces" in a dry manner! Contributing to new technology development and cost reduction.

A rotary vacuum plasma device that utilizes the high reactivity of plasma for various surface treatment applications such as "hydrophilization," "cleaning," and "adhesion enhancement" for a wide range of materials including "powders and solid surfaces"! Conventional plasma devices could not treat contact areas such as the bottom surface where the sample does not touch the plasma, requiring a flipping process. This product allows for uniform plasma treatment across the entire surface of the sample by rotating the chamber. 【Features】 - Equipped with a rotating chamber for bulk processing of the entire surface. - Reduced processing time and cost savings through bulk treatment! - Even treatment of contact areas between samples without inconsistencies. - Surface modification for powders and small samples! Birth of a new technology. - Easy operability with detachable chamber, angle adjustment, rotation speed adjustment, and power adjustment, etc. 【Applications】 - Strengthening adhesion for various resin molded products such as O-rings. - Uniform surface modification for medical needles and tubes. - General applications for enhancing hydrophilicity and dispersibility of various powders. - Strengthening coating adhesion for fine particles such as capacitors, etc. We offer free demo processing.

  • Other semiconductor manufacturing equipment
  • Plasma Equipment

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High-capacity vacuum plasma device: YHS-MS

You can use it for surface modification and cleaning of large samples and a large number of samples♪

Utilizing the high reactivity of plasma to solve issues such as adhesion and bonding enhancement to various materials like resin, metal, glass, and fiber, improvement of hydrophilicity, and removal of organic substances! This model can introduce various gases such as oxygen, nitrogen, argon, and helium. Additionally, it is equipped with power adjustment, gas flow control, and pressure adjustment on the front panel, allowing irradiation under various conditions. The electrode (shelf) size is 400mm.

  • Other semiconductor manufacturing equipment
  • Plasma Equipment

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Tabletop Direct-Type Atmospheric Pressure Plasma Device TK-50

Low-cost small device!

●Low cost ●Compact - Space-saving, easy to place in laboratories - Easy to combine with other equipment - Good maneuverability with integrated processing and operation units ●Simple structure - Easy maintenance and inspection - Easy replacement of electrodes (consumables) ●Uniformity - More uniform than handheld corona treatment ●Processing efficiency - No vacuum exhaust required compared to vacuum plasma treatment ●Running costs - Usable without gas supply

  • Other cleaning machines
  • Plasma Equipment

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Pricing set at about 1/3 of the conventional cost! Tabletop vacuum plasma device.

Organic matter removal and cleaning possible! A more stable process is achieved compared to types that treat with residual atmosphere without introducing gas.

Our vacuum plasma products are used in a wide range of research applications, including cleaning, etching, and thin film formation. The gas introduction type "YHS-G" supports multiple gas introductions and allows for flow rate adjustments and precise setting of processing conditions, making it a high-performance product utilized in both research and production environments. We have now added the "YHS-O" to our product lineup, which limits gas introduction to oxygen and has been newly developed by reviewing the functions and structure of the main unit. It is offered at approximately one-third the price of our conventional products, and we have also made it possible to shorten delivery times. Furthermore, it achieves a more stable process compared to types that treat using residual atmosphere without gas introduction. [Application Examples] ■ Removal and cleaning of organic materials → Dry cleaning of experimental tools and pre-treatment before adhesion ■ Surface activation and hydroxyl group addition → In the bio and medical fields, such as cell culture containers ■ Bonding without using adhesives for PDMS and glass → Fabrication of microchannels *Please contact us or download the catalog from the link below for more information.

  • Other machine elements
  • Plasma Equipment

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Low-temperature pen-type atmospheric pressure plasma device BARRIER-20

Low-temperature and low-flow atmospheric pressure plasma treatment is possible! Surface modification: Stable generation of plasma without charge damage in an atmospheric pressure environment!

- There is almost no damage from heat. - It can be used with various gases such as air, nitrogen, argon, and helium. - It operates on an AC100V outlet, making it usable in various situations. - It can also be used as a laboratory device. - Dimensions (excluding protrusions) (mm) 260(W) × 280(D) × 139(H) - Maintenance is also easy.

  • Plasma Generator
  • Plasma Equipment

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Vacuum device for substrate parallel plate plasma processing equipment PC-RIE series

Processable substrate size 550×650 mm. Achieves zero waste liquid and low running costs.

The "PC-RIE series" can perform processing such as ashing, desmearing, surface modification, and F-type gas etching for medium-sized LCD substrates, printed circuit boards, and more. Customers can choose a version that suits their needs, ranging from a manually operated research and development type chamber to a fully automated system with an atmospheric gate, transport mechanism, and cassette station. 【Features】 ○ Vacuum plasma technology provides a better environment compared to conventional processing → Cleaning, no waste liquid ○ Low running costs ○ Usable substrate size: 550×650 mm For more details, please download the catalog or contact us.

  • Plasma surface treatment equipment
  • Vacuum Equipment
  • Plasma Equipment

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Vacuum device for plasma treatment for parallel plate evaluation

Widely used in fine anisotropic processing such as semiconductor, liquid crystal fine patterning, and DNA chip manufacturing.

You can choose a version that suits your needs, ranging from a manually operated research and development type chamber with atmospheric gates, transport mechanisms, and cassette stations to a fully automated system. We emphasize process reproducibility and standardly equip our systems with chillers for electrode temperature control and APC, and we can add turbo pumps compatible with high vacuum processes. 【Features】 ○ RIE plasma etching equipment ○ Capable of anisotropic etching of silicon wafers up to 6 inches and small square substrates ○ Equipment for 8 and 12 inches can also be designed For more details, please download the catalog or contact us.

  • Plasma surface treatment equipment
  • Vacuum Equipment
  • Plasma Equipment

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CVD equipment

CVD equipment

●Features This device is a thin film fabrication apparatus using the CVD method, which supplies raw material gases (gases, liquids, solids) to the CVD reaction chamber, causing chemical reactions to occur in the gas phase or on the surface of the substrate material, and utilizing gas-phase reactions and surface reactions to deposit the desired thin film material onto the substrate. Methods for chemically activating the raw material gases (exciting them) include thermal, plasma, and optical (laser, ultraviolet, etc.), with corresponding devices such as thermal CVD, plasma CVD, and optical CVD.

  • Analytical Equipment and Devices
  • Other laboratory equipment and containers
  • Plasma Equipment

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High Current Generation Power Supply 'PS-HB0097'

The cooling method adopts natural air cooling! It is a high-current power supply equipped with a power indicator lamp and an ammeter.

The PS-HB0097 is a high-current power supply that incorporates a manual slider and a current-generating transformer into a case. It uses natural air cooling (rated for 20 minutes of continuous use). A breaker is provided for the ON/OFF control of the input power and for overcurrent protection, along with a power lamp and an ammeter. 【Features】 ■ Incorporates a manual slider and a current-generating transformer into the case ■ Includes a breaker for ON/OFF control of the input power and for overcurrent protection ■ Equipped with a power lamp and an ammeter *For more details, please refer to the related link page or feel free to contact us.

  • Power Supplies
  • Plasma Equipment

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Atmospheric Pressure Plasma Device "Precise Series"

50% performance increase compared to conventional systems! Atmospheric pressure plasma device with low N2 consumption (approximately 45% reduction).

The atmospheric pressure plasma device "Precise Series" is based on nitrogen gas and utilizes dielectric barrier discharge to isolate the workpiece from the electromagnetic field area, using only the radicals excited within the reactor. This allows for continuous processing without damaging the workpiece. Additionally, even when the workpiece is charged, it is discharged, and there is no particle adhesion in the air after processing. 【Features】 ○ Low-temperature processing ○ Damage-free ○ No need for an ionizer device before ESD-free processing ○ Maintenance-free for 2 years ○ Compact and lightweight (compared to other companies: approximately 1/2 or less in volume ratio, approximately 1/3 or less in weight ratio) ○ Semi-permanent long lifespan dielectric electrodes ○ Particle-free ○ Uniform processing for a wide range of workpieces For more details, please contact us or download the catalog.

  • Plasma surface treatment equipment
  • Plasma Equipment

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Atmospheric Pressure Plasma Device "AP Plasma Precise II"

Damage-free, particle-free atmospheric pressure plasma device

The atmospheric pressure plasma device "AP Plasma Precise II" is based on nitrogen gas and utilizes dielectric barrier discharge to isolate the workpiece from the electromagnetic field area, using only the radicals excited within the reactor. This allows for continuous processing without damaging the workpiece. Additionally, even when the workpiece is charged, it can be neutralized, and there is no particle adhesion in the air after processing. 【Features】 ○ No need for electrode replacement (dielectric part) ○ Wide processing range (100 mm to 3000 mm) ○ No damage to the processing surface due to the downstream electrode configuration. ○ Maintenance only every two years For more details, please contact us or download the catalog.

  • Plasma surface treatment equipment
  • Plasma Equipment

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How to Choose an Atmospheric Pressure Plasma Device That You Can't Ask About Now *Explanatory Materials Provided

Introducing the basics of plasma devices, including "treatment forms" of atmospheric pressure plasma devices and "unique features of our equipment"! Technical materials available.

Here, we focus on explaining an atmospheric pressure plasma device that generates pure bulk plasma, rather than devices using corona treatment or arcs. By using a special electrode structure and applying high-frequency power to the electrodes based on nitrogen gas and noble gases, high-density plasma is generated. The high-density reactive species produced impart functional groups, hydroxyl groups, and amine groups to the work surface, enabling treatments such as wettability enhancement, coating performance improvement, and organic material removal. By changing the added gas, selectively generated molecules can be produced, allowing for treatments such as hydrophobization, reduction, thin film volume adjustments, and dry etching. Additionally, performing plasma treatment before cleaning processes or plating treatments activates the treated surface, enhancing reactivity with chemical solutions, improving cleaning performance, and aiding in the removal of bubbles. Considering the nature of the work and the conditions for the next process, I hope this summary serves as a reference for optimizing the selection of atmospheric pressure plasma devices. Furthermore, regarding adhesive-free bonding without the use of adhesives, I believe that bonding technology based on molecular bonding with copper foil can reduce transmission loss and contribute to the manufacturing of FCCL for 5G and 6G applications.

  • Plasma surface treatment equipment
  • Plasma Equipment

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How to Choose an Atmospheric Pressure Plasma Device That You Can't Ask About Now!

Introducing the "treatable plasma processing width" of our atmospheric pressure plasma device, along with "unique features of our equipment"!

On this page, we focus on atmospheric pressure plasma devices that generate pure bulk plasma, rather than devices that use corona treatment or arcs. We hope this will serve as a reference for optimizing the selection of atmospheric pressure plasma devices, taking into account the nature of the workpieces (items to be treated) and the conditions for the next process. Regarding adhesive-free bonding using oxygen radicals, OH radicals for dry cleaning, and hydrophilic treatment of functional groups, we primarily focus on molecular bonding between copper foil and substrates, enabling bonding that eliminates edge effects. We believe this can contribute to printed circuit boards and assembly processes for future 5G and 6G applications, such as FCCL. Additionally, it can be applied to shorten the impregnation process of electrolytes in lithium-ion batteries and to achieve damage-free direct bonding of dissimilar materials during electrode formation. For more details, please refer to the related links below. [Contents] ■ Purpose of use (treatments possible with atmospheric pressure plasma devices) ■ The treatment forms of atmospheric pressure plasma devices can be broadly classified into three types ■ Workpieces and plasma forms ■ Unique features of our devices (downstream type) ■ Internal schematic diagram of dielectric barrier discharge (DBD) *For more details, please feel free to contact us.

  • Plasma Generator
  • Plasma Equipment

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[Atmospheric Pressure Plasma Device - Example of Problem Solving] Superhydrophilicity Treatment on Teflon Surface

Successful superhydrophilization of Teflon (PTFE/PFA) using an atmospheric pressure plasma device, achieving a contact angle near 5 degrees (in pure water).

We would like to introduce a case study of problem-solving using an atmospheric pressure plasma device. Recently, we successfully achieved surface modification of fluoropolymer (PTFE, PFA) to a contact angle close to 5 degrees (in pure water). Previously, the maximum value was around 50 degrees, but this was realized through optimization of recipes and other factors. By cutting the C-F bonds on the Teflon surface with plasma and terminating them with hydrophilic groups or functional groups, we achieved superhydrophilicity. We are confident that this will contribute to direct adhesion to FCCL copper foil for 6G applications in the future.

  • Plasma surface treatment equipment
  • Plasma Equipment

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Plasma treatment device (multi-purpose plasma etcher)

Plasma processing device (multi-purpose plasma etcher)

This device is a multipurpose single-sheet plasma unit that is effective for etching polyimide-based resins, nitride films, ashing (ash removal) of photoresists, and surface modification, using parallel plate high-frequency plasma. It supports wafer sizes from 50 to 200 mm (2 to 8 inches) and is compatible with BGA, CSP, and other formats. The plasma mode can be switched between DP mode and RIE mode via the operation panel. Additionally, it allows for the retrofitting of a transport unit, making it ideal for experimental and research facilities.

  • Etching Equipment
  • Ashing device
  • Other processing machines
  • Plasma Equipment

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Digital Oil Checker Wendy Rental

Lightweight and compact design. Allows for easy lubrication oil diagnosis on-site.

The Digital Oil Checker Wendy is an extremely simple lubrication oil diagnostic tool that detects contaminants such as dirt and moisture that cloud the machine's lubricating oil, using a principle based on optical sensors. It allows for diagnosis without the need to extract oil from the on-site oil tank. It can instantly determine oil contamination on the spot, and with a lightweight and compact body weighing only 200g, it is effective for quick measurements in the field. For more details, please contact us.

  • Other measurement, recording and measuring instruments
  • Plasma Equipment

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Nikko Create High-Pressure Spray Cleaning Machine

Compact cleaning machines installed in large numbers on the vehicle parts assembly line.

The entry and exit points are in the same location, and the precision of car parts has been increasing year by year, with demands for reduced noise and improved durability. This cleaning machine performs the final cleaning before assembly, which affects the precision of the parts.

  • Other cleaning machines
  • Plasma Equipment

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Atmospheric Pressure Plasma Treatment Device 'NJZ-2820'

An atmospheric pressure plasma treatment device that enables stable plasma treatment at atmospheric pressure! The miniaturization of the device makes it easy to integrate into production lines!

The atmospheric pressure plasma treatment device "NJZ-2820" is an optimal device for integration into production lines and production equipment, thanks to its high-efficiency plasma head. It enables stable plasma treatment at atmospheric pressure and reduces running costs by plasma-activating compressed air. The miniaturization of the device also makes it easy to integrate into production lines. 【Features】 ■ Generates high-density plasma using 2.45GHz microwaves ■ Allows plasma generation only when needed with quick ignition ■ Achieves miniaturization and cost reduction of the device *Please consult us regarding low-temperature plasma (below 70°C) and thermal treatment plasma using oxygen. *For more details, please request documentation or view the PDF data available for download.

  • Plasma Generator
  • Plasma surface treatment equipment
  • High frequency/microwave parts
  • Plasma Equipment

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Batch-type plasma processing device WPA-600S

A sequencer that is low-cost yet equipped with high performance, capable of managing various assembly conditions and offering excellent cost performance.

We have adopted a compact power matching method, achieving faster plasma matching. By reducing the matching time, we have minimized charge-up damage to the device during plasma ignition. Additionally, we have achieved space-saving design with only the PUMP outside of the main unit.

  • Other inspection equipment and devices
  • Plasma Equipment

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Plasma treatment device WLP600S

Compatible with 6-inch and 8-inch wafers! Plasma processing equipment using a parallel plate method.

The WLP600S is a plasma processing device using a parallel plate method. It supports 6-inch and 8-inch wafers, achieving low cost and space-saving design. The two types of plasma modes, DP (Direct Plasma) mode and RIE (Reactive Ion Etching) mode, can be switched using only the controls on the panel, making it suitable for various applications such as etching polyimide-based resins and surface modification of photoresists. 【Features】 ○ Easy plasma mode switching ○ High-speed responsiveness ○ Space-efficient footprint ○ Compatibility with a wide variety of processes ○ High customization options For more details, please contact us or download the catalog.

  • Plasma surface treatment equipment
  • Plasma Equipment

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Freshness preservation film evaluation data (evidence)

Functional film that prolongs the freshness of food through antioxidant, anti-mold, and anti-fog properties! Experimental results have been released.

We have published a collection of evaluation data (evidence) regarding the "Freshness Preservation Film I-SCH." We aim to further assist in solving various challenges, such as reducing food waste and addressing labor shortages through improved work efficiency. We invite you to take a look at the evaluation data and feel free to contact us. [Contents Included] 1. Lemons 2. Bread and Confectionery 3. Citrus (Kanpei) 4. Strawberries 5. Grapes 6. Rust Prevention Effect *For more details, please download the catalog or feel free to contact us.

  • plastic
  • Plasma Equipment

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CVD device "Nano Carbon Deposition Device"

Three types of sedimentation devices are available! Please choose according to your needs.

We would like to introduce the "Nano Carbon Deposition Device" handled by Katagiri Engineering Co., Ltd. This product is a CVD device capable of synthesizing nano carbon materials. In addition to the "CND-050LP," we offer a large-area nano carbon deposition device, the "LCND-200," and a PN nano carbon deposition device, the "NCD-050W." You can choose according to your application. 【Features】 ■ Capable of synthesizing nano carbon materials ■ Three types in the lineup ■ Selectable based on application *For more details, please refer to the PDF document or feel free to contact us.

  • CVD Equipment
  • Plasma Equipment

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Remote Atmospheric Pressure Plasma Treatment Device

Has numerous achievements in leading companies in Asia.

The plasma generation section and the processing section are completely separated. The processing is carried out using only radical components. ■ Processing Targets Modification of the target work surface (improvement of bonding strength, enhancement of adhesion) Removal of organic substances from the target work surface 【Features】 ■ Reduces damage to the processed film due to chemical processing using only radicals without electron or ion attacks ■ Ideal for processing conductive films and glass after electrode formation ■ Various reaction gases can be used: CDA (Clean Dry Air), N2, O2, Ar, etc. For more details, please contact us.

  • Other physicochemical equipment
  • Plasma surface treatment equipment
  • Plasma Generator
  • Plasma Equipment

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Plasma treatment device: Proposing surface treatment and smear removal.

Many achievements with major Asian electronics manufacturers! We propose surface treatment in various fields!

Hitachi High-Technologies Corporation offers plasma equipment with a proven track record among major electronic device manufacturers in Asia. We propose surface treatment solutions in various fields, including desmear equipment suitable for removing smears from small-diameter rigid and flexible printed circuit boards. 【Features】 ■ Desmear Equipment - For removing smears from small-diameter rigid and flexible printed circuit boards Cleaning application: Enhancing hydrophilicity before the plating process of printed circuit boards ■ Vacuum Plasma Cleaner - For removing residues after resist stripping and for pre-treatment before IC bonding ■ Atmospheric Plasma - For removing organic substances, surface modification, and surface roughening of films and glass substrates *For more details, please refer to the PDF materials or feel free to contact us.

  • Plasma surface treatment equipment
  • Other physicochemical equipment
  • Plasma Equipment

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Inline plasma treatment device

High-speed, uniform, double-sided processing for pre-treatment before plating and for pre-treatment before adhering materials such as LCP and PTFE.

The "inline plasma treatment device" can be used for pre-treatment before attaching low transmission loss substrates for high-speed communication, as well as for removing residues from desmear and dry film. It also supports inline transport. <Product Features> 1. High speed and high uniformity for both sides 2. Compatible with automatic transport 3. Uniform cooling within the surface *For more details, please download the PDF or contact us.

  • Other semiconductors
  • Plasma Equipment

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