Introducing technology that handles the polishing of over hundreds of types of semiconductor materials! We are showcasing the polishing processes, cleaning, and processing techniques for various wafers with photos and analysis examples!
This document introduces the polishing processes, cleaning, and processing technologies for various wafers from Japan Exceed, using photographs and analysis examples.
Through years of experience in polishing processing and repeated unique research and development, we have achieved high-level technical capabilities in handling various materials known as single crystals, and we have now become a provider of polishing for over several hundred types of semiconductor materials.
We include the polishing process of the polishing processing, special Si processing using thinning technology, and processing materials. Our company responds to the polishing needs of various processing materials.
【List of Processing Materials】
■ Oxide materials: LiTaO3 (LT), LiNbO3 (LN), ZnO, quartz, sapphire, regenerated sapphire, etc.
■ Compound materials: GaN, SiC, GaP, GaAs, GaSb, ZnS, ZnTe, etc.
■ Metal materials: SUS, Au, Ag, Cu, W, Ti, Al, etc.
■ Others: Ge, C, MnZn ferrite, TeO2, resin materials, etc.
【Contents Included (Excerpt)】
■ Polishing processing process (representative examples)
■ Introduction to the polishing process
■ Introduction to the cleaning process
■ Special Si processing
*For more details, please refer to the PDF document or feel free to contact us.
