Electrical processing/discharge machining technology for semiconductors
We will solve the challenges of micro-hole processing!
In the semiconductor industry, the precision of fine hole processing has become crucial due to the increasing density of devices. Specifically, the ability to process fine holes with high precision in wafers and substrates significantly affects product performance. Traditional processing methods may struggle to achieve high-quality fine hole machining due to issues such as tool wear and positional accuracy. Our electrical discharge machining technology enables the processing of complex-shaped fine holes in conductive materials, contributing to solving our customers' challenges. 【Application Scenarios】 - Fine hole processing of semiconductor wafers - Precision hole processing of electronic components - Fine machining of mold parts 【Benefits of Implementation】 - Achievement of high-precision fine hole processing - Capability to process complex shapes - Compatibility with a variety of materials
- Company:トムラス
- Price:Other