We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 42 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. null/null
  4. 4 アイン 本社工場 Nagano//Electronic Components and Semiconductors
  5. 5 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
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Substrate Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  2. Handbook for Circuit Board Noise Countermeasures グロース
  3. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  4. 4 FPC - "Technical Information" - Updated September 2025 太洋テクノレックス 本社　和歌山
  5. 4 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社

Substrate Product List

1711～1725 item / All 1823 items

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World Market for Indium Tin Oxide (ITO) Coated Substrates

World Market for Indium Tin Oxide (ITO) Coated Substrates

World Market for Indium Tin Oxide (ITO) Coated Substrates: ITO Coated Slides & Cover Slips, ITO Coated ...

This research report (Global Indium Tin Oxide (ITO) Coated Substrates Market) investigates and analyzes the current status and outlook for the global market of indium tin oxide (ITO) coated substrates over the next five years. It includes information on the overview of the global indium tin oxide (ITO) coated substrates market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include ITO coated slides & cover slips, ITO coated cover slips, ITO coated slides, and ITO coated glass plates, while the segments by application cover electrochromic displays, EMI shielding, solar cells, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of indium tin oxide (ITO) coated substrates.

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[Research Material] Global Market for Aluminum Substrates

[Research Material] Global Market for Aluminum Substrates

Global Market for Aluminum Substrates: Below 1mm, 1mm to 2mm, Above 2mm, Heat Sinks, Power Electronics, LED Lighting, Others

This research report (Global Aluminum Substrates Market) investigates and analyzes the current state and outlook for the global aluminum substrates market over the next five years. It includes information on the overview of the global aluminum substrates market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the aluminum substrates market include those under 1mm, 1mm to 2mm, and over 2mm, while the segments by application cover heat sinks, power electronics, LED lighting, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of aluminum substrates. It also includes the market share of major companies in the aluminum substrates sector, product and business overviews, and sales performance.

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[Research Document] Global Market for Thick Film Substrates

[Research Document] Global Market for Thick Film Substrates

World Market for Thick Film Substrates: Single-layer Thick Film Substrates, Multi-layer Thick Film Substrates, Chip Resistors, Electronic Modules, Others

This research report (Global Thick Film Substrates Market) investigates and analyzes the current state and outlook for the global thick film substrates market over the next five years. It includes information on the overview of the global thick film substrates market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include single-layer thick film substrates and multi-layer thick film substrates, while the segments by application focus on chip resistors, electronic modules, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of thick film substrates. It also includes the market share of major companies in the thick film substrates sector, product and business overviews, and sales performance.

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[Research Material] Global Market for FPC (Flexible Printed Circuit Boards)

[Research Material] Global Market for FPC (Flexible Printed Circuit Boards)

World Market for FPC (Flexible Printed Circuit Boards): Single-sided Circuits, Double-sided Circuits, Multi-layer Circuits, Rigid-flex Circuits, Medical, Aerospace & ...

This research report (Global FPC Market) investigates and analyzes the current state of the global market for FPC (Flexible Printed Circuit Boards) and its outlook for the next five years. It includes information on the overview of the global FPC market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the FPC market by type include single-sided circuits, double-sided circuits, multilayer circuits, and rigid-flex circuits, while the segments by application cover medical, aerospace & defense/military, consumer electronics, automotive, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of FPC (Flexible Printed Circuit Boards). It also includes the market share of major companies in the FPC (Flexible Printed Circuit Boards) sector, product and business overviews, and sales performance.

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Piezoelectric buzzer

Piezoelectric buzzer

Adding pronunciation functions to home appliances! Introducing pronunciation components that incorporate piezoelectric elements into the casing.

We would like to introduce the "Piezoelectric Buzzer" handled by Sansen Electronics Co., Ltd. This is a sound-emitting component that incorporates a piezoelectric element into its housing and has a built-in oscillation circuit, allowing it to generate sound pressure when a DC voltage is applied. It has high sound pressure and can operate in high-temperature environments. Additionally, products are available in sizes ranging from 10mm to 50mm. 【Features】 ■ Lightweight ■ Thin ■ Capable of producing various sounds, including single tones and pulse sounds ■ High sound pressure ■ Can operate in high-temperature environments ■ OEM *You can download the English version of the catalog. *For more details, please feel free to contact us.

  • Piezoelectric Devices
  • Sound Parts

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[Market Report] Global Market for Ceramic Balls

[Market Report] Global Market for Ceramic Balls

Shaping Progress: The Global Market for Ceramic Balls Pioneering Precision and Performance

The global ceramic ball market is ushering in a new era of technological advancement, redefining industries with its exceptional precision, durability, and unparalleled performance. As a cornerstone of technological innovation, ceramic balls are shaping a world where excellence and efficiency converge. In a world where precision is paramount, ceramic balls take center stage. These spherical marvels are designed with nanometer-level accuracy, offering outstanding roundness and surface finish. From advanced bearings to cutting-edge electronics, ceramic balls ensure unmatched precision. For application methods, please check the [PDF download] button or apply directly through the related links.

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[Market Report] Global Market for Ceramic Substrates

[Market Report] Global Market for Ceramic Substrates

Evolving Technology: Opening the Path to Innovation in the Global Ceramic Substrate Market

The global ceramic substrate market has emerged as a driving force behind technological advancements, enabling innovation across various industries. Ceramic substrates, with their exceptional thermal, electrical, and mechanical properties, are shaping the future of electronics, automotive, and aerospace. Known for their high thermal conductivity, low thermal expansion, and excellent electrical insulation, ceramic substrates are revolutionizing the manufacturing of electronic components. These substrates provide a stable platform for integrating semiconductors, LEDs, sensors, and other electronic devices, unlocking the potential for miniaturization, lightweight design, and high efficiency in products. For application methods, please check the [PDF download] button or apply directly through the related links.

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OKI Circuit Technology Implementation Services

OKI Circuit Technology Implementation Services

Combining OKI's technology and skills with your products to realize the development of new products! Please feel free to consult with us.

At OKI, we provide high-quality support for large, high-density substrates and short-term production of a wide variety of small quantities. This is a comprehensive production contract service that leverages the design and production technologies cultivated in the information and communication manufacturing sector. By combining OKI's technology and skills with your products, we realize the development of new products. Please feel free to consult with us. 【Features】 ■ Procurement of materials can be accepted ■ Comprehensive support from development to implementation ■ Low-cost solutions for 0402 chips and manual soldering ■ Comprehensive production contract service utilizing design and production technologies *For more details, please refer to the PDF materials or feel free to contact us.

  • Other contract services

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Proposal for thermal management of electronic devices and solutions for heat dissipation.

Proposal for thermal management of electronic devices and solutions for heat dissipation.

Mass production of copper coin printed circuit boards is possible for high multilayer substrates that require heat dissipation and thermal management. High heat dissipation is achieved with a uniquely developed copper coin structure.

Our company is capable of providing copper coin※ (heat dissipation structure) wiring boards. With the advancement of 5G communication devices, thermal management of high-speed, high-frequency components has become a challenge. Additionally, as devices become more compact, semiconductors and electronic components are mounted on substrates at high density, and a fanless structure that eliminates fans and heat sinks within the device is required for low power consumption. Copper coin printed circuit boards can achieve an advanced "heat dissipation structure" that efficiently dissipates the heat generated by electronic components within a limited area. ※Copper coin: A material shaped into a cylindrical form, significantly improving the thermal conductivity of the substrate compared to thermal vias. 【Features】 <Development> - Realization of embedding copper coins directly beneath heat-generating components on high-layer-count substrates. - Ensuring high reliability by embedding cylindrical copper using a unique method that minimizes load. - Dramatic improvement in the thermal conductivity of the substrate due to the copper coin structure. - Unique development of equipment for embedding copper coins, allowing flexible adaptation to various coin sizes. - Comprehensive support for thermal simulation, prototyping, and mass production. - Capability for fanless housing design to achieve space-saving and high-efficiency heat dissipation. - Significant improvement in heat dissipation when used in conjunction with thermal management components such as heat pipes and thermal conductive sheets.

  • Circuit board design and manufacturing

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【OMRON：C500-IA121】

【OMRON：C500-IA121】

【Support for Electronic Component Procurement】 We support the urgent procurement of discontinued products (EOL products) and hard-to-obtain electronic components and semiconductors! We have established a thorough inspection system.

Are you looking for this model number product? ■Manufacturer: OMRON ■Model number: C500-IA121 Owen Corporation swiftly procures electronic components that have become difficult to obtain due to production discontinuation or delivery issues from a global network. We will definitely issue a quotation, so you can confirm the details before placing an order, providing peace of mind. A veteran inspector who has monitored market distribution inventory for over 20 years conducts inspections, and only products that pass inspection are shipped. All delivered items include an inspection report. 【Our Inspection System】 ■X-ray Inspection Non-destructive testing to check internal structures and detect counterfeit or inferior products. ■Microscope Carefully checks for lead bending and any discrepancies in printed fonts. ■Digital Caliper Measures dimensions to the hundredth of a millimeter to detect cleverly crafted counterfeits. ■Curve Tracer Displays the voltage and current characteristic waveforms between terminals on the screen to detect defective products. ★Please visit our website from the link below. ★You can view our company brochure from the download button below. ▼For other model numbers you can inquire about, please refer to the lineup below.

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Development status and market outlook of the 2008 next-generation COF (New Etch/Semi-Additive/Low CTE-PI)

Development status and market outlook of the 2008 next-generation COF (New Etch/Semi-Additive/Low CTE-PI)

Development Status and Market Outlook of 2008 Next-Generation COF (New Etching/Semi-Additive/Low CTE-PI)

LCD panels have grown the market due to high image quality and low prices. There is also a strong demand for these requirements in related components, and naturally, low cost and high functionality are also required for LDI and COF. To address these somewhat conflicting needs, next-generation COF technology is becoming essential.

  • Other semiconductors
  • LCD display
  • Printed Circuit Board

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"Cost reduction with minimal initial investment" capable of handling everything from prototype circuit boards to mass production.

"Cost reduction with minimal initial investment" capable of handling everything from prototype circuit boards to mass production.

"We want to keep costs down, but we don't want to compromise on the quality of the circuit board." We will respond to such requests! We will help reduce costs with minimal initial investment.

At PC Electronics, we cover the entire process of electronic components, from product development to rapid parts procurement, printed circuit board manufacturing, circuit design, assembly, production, and quality control. Moreover, we can assist in cost reduction with minimal initial investment. Please check as conditions may vary depending on quantity and specifications. Additionally, because we are not only responsible for a part of the process but also have a comprehensive understanding of all stages, we maintain a quality that you can trust. We provide flexible support from any stage while achieving high quality. If you have requests to reduce costs while maintaining the quality of the circuit boards, please feel free to consult with us! *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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Plax Inc. Company Profile

Plax Inc. Company Profile

We respond to various customer needs with detailed services from development to manufacturing! We can accommodate requests from any stage of the process.

Plax provides consistent support from prototype development to mass production of electronic devices. We respond to various requests, including electronic device development, printed circuit board design, simulation, board manufacturing, component procurement, prototype assembly, and mass production assembly. Please feel free to contact us when you need our services. 【One-Stop Solution for Electronic Device Development】 1. Electronic device development 2. Printed circuit board design and simulation 3. Board manufacturing 4. Component procurement 5. Prototype assembly 6. Mass production assembly *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Prototype Services

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