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Substrate(aln) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
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Substrate Product List

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AlN slice substrate

AlN slice substrate

Various types of metallization are possible! Introducing AlN substrates with unique firing and processing technologies.

We would like to introduce the "AlN Slice Substrate" handled by Furukawa Electric. It has high electrical insulation properties and supports various metallizations. It has a thermal expansion coefficient that matches silicon, making it resistant to thermal shock and capable of withstanding rapid heating and cooling. 【Features】 ■ High thermal conductivity and emissivity, providing excellent heat dissipation ■ Thermal expansion coefficient that matches silicon ■ Resistant to thermal shock and capable of withstanding rapid heating and cooling ■ High electrical insulation properties ■ Supports various metallizations *For more details, please refer to the PDF document or feel free to contact us.

  • others

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High thermal conductivity ceramic substrate

High thermal conductivity ceramic substrate

High thermal conductivity alumina (Al2O3) substrate, AlN substrate

● Alumina (Al2O3) substrate Thickness: 0.38mm and above Metallization: MoMn, W, Ni, Ag, Au ● AlN substrate Thermal conductivity 170W/m·k and above Thickness: 0.38mm and above Metallization: Cu, Ti/W, Pt, Ag, Au We will challenge at a low cost.

  • Company：ルータ
  • Price：Less than 10,000 yen
  • Fine Ceramics

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Thin film circuit substrate (submount/carrier) *Technical materials available for free!

Thin film circuit substrate (submount/carrier) *Technical materials available for free!

Application of film formation technology and thin film processing technology to submounts with increasing demand!

Our company applies and develops the film formation and thin film processing technologies cultivated in the manufacturing of thin film magnetic heads (HDD, FDD) and optical prism components to create thin film electrodes, resistive films, and solder films tailored to substrates such as ceramic substrates, forming them into high-precision fine circuit patterns. We are also capable of patterning on three-dimensional surfaces and thick film Cu plating. Our customers use our products not only in Japan but also in various countries around the world, including Asia and Europe and the Americas. We will continue to develop new technologies in the future. ■ Standard substrate materials (thermal conductivity W/m·K) AlN (170~230) AlN/Cu (~270) SiC (~370) ■ Applications Laser diode (LD) mounting substrates Light-emitting diode (LED) mounting substrates Photodiode (PD) mounting substrates ■ Laser market applications Visible light semiconductor lasers Optical communication (FTTx, data centers, mobile base stations) Consumer industrial applications (sensors, LiDAR, laser processing, medical) Lighting (projectors, automotive headlights), etc.

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  • Circuit board design and manufacturing

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AMB substrate

AMB substrate

High insulation, heat dissipation, and reliability! Thick copper ceramic substrates for power devices.

The "AMB substrate" is a substrate that joins thick copper to ceramics using the AMB (Active Metal Brazing) method. It is a thick copper ceramic substrate for power devices that has high insulation, heat dissipation, and reliability. 【Specifications】 ■ Base material: Silicon nitride (Si₃N₄) 　　　　Aluminum nitride (AlN) 　　　　Alumina (Al₂O₃) ■ Conductor thickness: 300 to 1000 μm *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board

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Free sample giveaway! Overseas ceramic substrate

Free sample giveaway! Overseas ceramic substrate

Proposal for stable procurement of overseas-made ceramic substrates!

Narasaki Sangyo Co., Ltd. will propose overseas-manufactured ceramic substrates through our overseas subsidiaries! ● Domestic procurement is unstable ● We would like to consider new procurement sources ● We want to reduce costs with lower-grade overseas products If you are facing any of these issues, please feel free to contact us! Customers who download our materials will receive alumina substrate samples free of charge!

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  • Fine Ceramics

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Composite Material MMC for Solar Cell Manufacturing Equipment

Composite Material MMC for Solar Cell Manufacturing Equipment

High thermal conductivity surpassing ceramics! Achieving low thermal expansion comparable to silicon!

By combining SiC ceramics with metallic silicon, we have achieved high thermal conductivity that surpasses ceramics and low thermal expansion comparable to silicon. Thermal conductivity that exceeds SiC and AlN! By changing the composite ratio, various properties can be realized. Surface treatment (plating) is possible, and it can also be used for electrostatic chucks. It can be made larger than ceramics. We also offer a combination of SiC and aluminum. For more details, please refer to the PDF catalog.

  • Ceramics
  • Fine Ceramics
  • Other metal materials

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High-Temperature Co-fired Ceramic Multilayer Substrate (HTCC)

High-Temperature Co-fired Ceramic Multilayer Substrate (HTCC)

Solder with excellent heat resistance for plating electrodes! Achieving high reliability, high density, and multifunctional products for various applications!

We realize the commercialization of various high-density and multifunctional products for applications such as ceramic heaters, optical communication packages, LED packages, sensor packages, and SMD packages.

  • High frequency/microwave parts

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DPC substrate

DPC substrate

High heat resistance and high strength! Ceramic wiring board using DPC plating method.

The "DPC substrate" is a ceramic wiring substrate that offers higher heat resistance and strength than conventional thick-film printed circuit boards. It is a substrate using the DPC (Direct Plated Copper) plating method, compatible with various materials such as alumina (Al₂O₃), aluminum nitride (AlN), silicon nitride (Si₃N₄), and glass. 【Specifications】 ■ Base material: Compatible with various materials including alumina, aluminum nitride, silicon nitride, and glass ■ Conductor thickness: 10 to 100 μm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Thick copper base, AMB substrate printed circuit board for power modules.

Thick copper base, AMB substrate printed circuit board for power modules.

Leave it to us for circuit boards for power modules! We manufacture thick copper base wiring boards and boards that bond thick copper to ceramics using the AMB method.

We would like to introduce the "Thick Copper Base Wiring Boards" and "AMB Boards" that we handle. The "Thick Copper Base Wiring Board" is available with three grades of insulation layers. We manufacture thick copper base boards for power modules as an alternative to DBC boards and AMB boards (high thermal conductivity and high current). We also handle "AMB Boards," which are thick copper boards bonded to ceramics using the AMB method. These thick copper ceramic boards are designed for power devices and offer high insulation, heat dissipation, and reliability. We can accommodate small quantities, so please feel free to consult with us. 【Specifications of Thick Copper Base Wiring Boards (Partial)】 <Insulation Layer> ■ Thermal Conductivity: 10.0 W/m·K Thickness: 120 μm ■ Young's Modulus: 53 GPa ■ Copper Thickness (Base): 0.5, 1.0, 1.5, 2.0, 3.0 mm ■ Copper Thickness (Wiring): 0.2, 0.3, 0.5, 0.8, 1.0 mm *For more details, please download the PDF or feel free to contact us.

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  • Printed Circuit Board

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Electronic Ceramics (Thin film integrated circuit components & Substrates)

Electronic Ceramics (Thin film integrated circuit components & Substrates)

A thin film integrated circuit pattern will be formed on a ceramic substrate.

By using alumina with a purity of 99.9%, we provide fine circuit patterns (line/space=30um/30um) that enable operation in the 30GHz band required for next-generation wireless communication systems. 【Thin Film Integrated Circuits】 We pattern integrated circuits on various ceramic substrates. ●Side patterns (over 0.3t), and AuSn solder patterns is possible. ● Simultaneous mounting of conductors, thin film resistors, and thin film inductors is possible. ● The combination of our unique 99.9% alumina substrate and fine patterns allows for the formation of circuits with low dielectric loss and low noise in high-frequency bands. ● For substrate materials, we also accommodate aluminum nitride (ALN) substrates, quartz substrates, and more. 【High-Quality Alumina Substrates】 ● Dense ● The three-point bending strength is 660MPa, which is significantly higher than conventional products (about twice as much). ● Excellent electrical properties with low dielectric loss in high-frequency bands.

  • High frequency/microwave parts
  • Fine Ceramics
  • Circuit board design and manufacturing

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Characteristics and Applications of Various Ceramic Substrates

Characteristics and Applications of Various Ceramic Substrates

Consistent production from manufacturing ceramics substrates with low dielectric loss in the microwave band, microwave dielectric substrates, to the formation of thin film patterns.

【High-Quality Alumina Substrate】 ○ Dense ○ The three-point bending strength is 660 MPa, which is significantly higher, about twice that of conventional products ○ Excellent electrical properties with low dielectric loss in the high-frequency range 【Zirconia Substrate】 ○ High strength and high toughness ○ Large elastic deformation capacity in bendable ceramics 【High Dielectric Substrate】 ○ Due to its high relative permittivity, it enables miniaturization of high-frequency circuits compared to alumina substrates ○ Low dielectric loss even in the high-frequency range 【Thin Film Integrated Circuit】 (Circuit formation on various ceramic substrates) ○ Formation of air bridges, side patterns (0.5t or more), and AuSn solder patterns is possible ○ Simultaneous mounting of conductors, thin-film resistors, and thin-film inductors is possible ○ By combining a unique 99.9% alumina substrate with fine patterns, it enables the formation of low-loss and low-noise circuits in the high-frequency range ○ Substrate materials also include high dielectric substrates, aluminum nitride substrates (AlN substrates), and quartz substrates.

  • High frequency/microwave parts
  • Fine Ceramics

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Thin-film integrated circuit components

Thin-film integrated circuit components

Consistent production from low-loss ceramic substrates in the microwave band to thin film pattern formation. Providing high-quality products at low prices and short delivery times, from prototyping to mass production.

We provide thin film integrated circuit components with circuit formation on substrates that have undergone various through-hole processing and slitting. 【Features】 ○ Formation of side patterns (0.38t or more) and AuSn solder patterns ○ Simultaneous mounting of conductors, thin film resistors, and thin film inductors ○ Low loss and low noise circuit formation in high-frequency bands made possible by the combination of our unique 99.9% alumina substrate and fine patterns ○ Substrate materials: Aluminum nitride substrates (AlN substrates), quartz substrates, etc. ○ Total technology development, quality assurance, and problem-solving made possible by being a substrate manufacturer ○ We provide quality according to product functions and specifications, and we respond quickly to short delivery times and design changes. For other functions and details, please contact us.

  • Other electronic parts

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GNSS High Gain LNA NJG1187A-A

GNSS High Gain LNA NJG1187A-A

AEC-Q100 grade 2 and VDA 6.3 automotive component standard compliant GNSS high-gain LNA

We have strengthened our lineup of products that comply with AEC-Q100*1 grade 2 and VDA6.3*2, capable of realizing GNSS multi-band. The NJG1187A-A is a low noise amplifier (LNA) product characterized by high gain and low noise figure, supporting the 1.5 GHz band (1559–1610 MHz) and the 1.1–1.2 GHz band (1164 MHz–1300 MHz), contributing to improved reception sensitivity and reduced positioning time for GNSS receivers. Additionally, since the matching of the first and second stage LNAs is done outside the package, the circuit configuration can be flexibly changed according to the application. The package of this product adopts a wettable flank package, making it easier to implement automatic visual inspection. *1 AEC-Q100 is a global standard for the reliability of automotive electronic components. *2 VDA6.3 is a process audit standardized by the German Automotive Industry Association.

  • Other semiconductors

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