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package - メーカー・企業362社の製品一覧とランキング

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packageのメーカー・企業ランキング

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  1. パナソニック アドバンストテクノロジー Osaka//IT/Telecommunications
  2. null/null
  3. フィルネクスト 本社 Kyoto//Resin/Plastic
  4. 4 株式会社ハイブリッチ／ビス Tokyo//IT/Telecommunications
  5. 5 新東工業 Aichi//Industrial Machinery
企業ランキングへ

packageの製品ランキング

更新日： 集計期間:Oct 22, 2025～Nov 18, 2025
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  1. Autonomous Mobile Robot Software Package '@mobi' パナソニック アドバンストテクノロジー
  2. Efforts for environmental measures! Sustainable packaging that considers nature.
  3. Microwave-compatible retort package "Retort Microwave Bag" フィルネクスト 本社
  4. 4 Autonomous Mobile Package Software @mobi 2.6 パナソニック アドバンストテクノロジー
  5. 5 Embedded AI package "Device Brain" for Mitsubishi Electric sequencers. たけびし

packageの製品一覧

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表示件数
EC/Online Shopping Integrated Package 'eltexDC'

EC/Online Shopping Integrated Package 'eltexDC'

Expand your business with EC and online sales!

"eltexDC" supports orders from multiple channels, not only from the EC front but also from phone, postcard, and fax orders. It comes standard with full fulfillment features for order management, inventory management, accounts receivable management, and shipping instructions, covering all the necessary operations for EC and mail-order businesses. 【Features】 ■ Centralized management of EC/mail-order business information ■ User-friendly business interface ■ Comprehensive subscription sales management features ■ Diverse promotional features *For more details, please download the PDF or feel free to contact us.

  • Software (middle, driver, security, etc.)

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Hanging Package Celine Type "Beroncho Type"

Hanging Package Celine Type "Beroncho Type"

Cost reduction is possible! We also offer bags compatible with top-loading, bottom-loading, and automatic packaging machines.

The "Beroncho Type" of the Celine type features a double-layer structure in its main film, allowing for a large amount of information to be printed on the inside when peeled back. This eliminates the hassle of printing on separate sheets and enclosing them for instruction manuals, enabling cost reduction. There are also bags compatible with top-loading, bottom-loading, and automatic packaging machines (YZ-100). 【Features】 ■ The main film has a double-layer structure, allowing for a large amount of information to be printed on the inside when peeled back. ■ This eliminates the hassle of printing on separate sheets and enclosing them for instruction manuals, enabling cost reduction. ■ Bags compatible with top-loading, bottom-loading, and automatic packaging machines (YZ-100) are also available. *For more details, please refer to the PDF materials or feel free to contact us.

  • Other packaging materials
  • Packaging Bags

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"Hanging Package" Celine Type 'U Type'

"Hanging Package" Celine Type 'U Type'

A tote-style package that can hold heavy items like liquid containers and bottles!

The "U type" of the Celine type is a handheld method that allows for the packaging of heavy items such as liquid containers and bottles. It can be used for various cosmetics, as well as decorative items, shampoos, and conditioners. If you are looking for hanging packages, please feel free to contact us. 【Features】 ■ Handheld method that allows for the packaging of heavy items such as liquid containers and bottles ■ Usable for various cosmetics, cosmetic tools, decorative items, shampoos, and conditioners *For more details, please refer to the PDF materials or feel free to contact us.

  • Other packaging materials
  • Packaging Bags

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[Data] ABIST's Anomaly Detection

[Data] ABIST's Anomaly Detection

AI for everyone, in both business and private life! We will introduce various features.

This document is an introduction to "AI-Plant Bamboo," handled by Abisto Co., Ltd. It includes information on the "hurdles of anomaly detection" for the anomaly detection package AI-Plant Bamboo, as well as "features of AI-Plant Bamboo" and "anomaly detection from the data acquisition phase." Please feel free to download and take a look. 【Contents】 ■ Anomaly Detection Package AI-Plant Bamboo ・Hurdles of Anomaly Detection ・AI-Plant Bamboo ・Features of AI-Plant Bamboo (1/3) ・Features of AI-Plant Bamboo (2/3) ・Features of AI-Plant Bamboo (3/3) *For more details, please refer to the PDF document or feel free to contact us.

  • Other information systems
  • Production Management System

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[Data] Operation Monitoring Package

[Data] Operation Monitoring Package

Operate signal and production completion signal interception without wiring work! Achieve low-cost operation monitoring of existing equipment and eliminate paperwork!

This document introduces the "Operational Monitoring Package," which enables operational monitoring without modifications to existing equipment and can be implemented step by step. It covers the importance of operational monitoring, including four requirements to maximize cost-effectiveness, as well as examples of digital twin applications utilizing this package. We leverage our expertise in manufacturing sites and information systems to support the construction of smart factories. 【Contents】 ■ Company Overview ■ Importance of Operational Monitoring ■ Steps for Implementing the Operational Monitoring Package ■ Examples of Digital Twin Applications Using the Operational Monitoring Package ■ Applications of the Operational Monitoring Package *For more details, please refer to the PDF document or feel free to contact us.

  • others

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3D implementation contributes to miniaturization and high density.

3D implementation contributes to miniaturization and high density.

We contribute to miniaturization of products through 3D implementation technologies such as PoP (Package on Package) implementation.

PoP technology is adopted in products that require miniaturization and high density, such as smartphones and digital still cameras, and our company has achieved a cumulative production record of over 100 million units to date. Additionally, we possess technologies for stacking substrates beyond PoP, enabling us to respond to product miniaturization. 【Features】 ■ By stacking two semiconductor packages, it is possible to reduce the footprint on the substrate. ■ By using wiring between the upper and lower packages, we can shorten the wiring length compared to wiring on the substrate, enabling high-speed wiring. ■ By using tested packages with guaranteed quality, we can reduce the failure rate compared to SiP. ■ We can also accommodate substrate stacking beyond PoP. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Back office department business reform package

Back office department business reform package

A business reform package that allows you to experience business transformation with a small start.

Our company utilizes process mining to visualize business operations, allowing us to accurately analyze the bottlenecks in our clients' operations and provide suitable business reform measures. We also have a track record of automating tasks such as data entry and duplicate checks between the system managing the recruitment of temporary workers and the system managing already registered temporary workers by newly introducing RPA. Please feel free to consult us if you have any requests. 【Package Details】 ■ Business Visualization - Process Mining - Detailed Hearings - Workflow Analysis ■ Measure Selection - As-Is To-Be Design - Cost-Effectiveness Estimation ■ Measure Implementation - Standardization/Streamlining - Systematization - RPA Implementation *For more details, please download the PDF or contact us.

  • 企業：PLAY
  • 価格：Other
  • Other services
  • Other information systems

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Kurassem-WH *For the automation of wire harness manufacturing!

Kurassem-WH *For the automation of wire harness manufacturing!

This is a robot package that automates the process from "taking one out of the bundle → crimping the terminal → inserting the terminal into the connector."

"Kurassem-WH" consists of a 3D high-speed vision sensor "Kurasense," a dedicated robot hand "Kurabotte," a unit for extracting one wire harness, a robot stand, safety fences, etc. (as a complete set), and is based on an industrial vertical multi-joint robot package. The work robot can accommodate vertical multi-joint robots from various manufacturers, allowing you to choose according to the environment of the installation site. It automates the wire harness manufacturing process by extracting wires one by one from the wire bundle, crimping terminals onto wire ends, inserting terminals into connectors, and inserting wires into circuit boards using robots. We propose robot packages for low-volume production processes with a variety of products and for customers who manufacture in-house. Additionally, instead of terminal crimping, we can customize for soldering, characteristic testing, resistance welding, and other customer requests. Please feel free to contact us.

  • Assembly robot

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Original package

Original package

We support the creation of original packaging tailored to our customers' needs, from containers, boxes, paper, bags, to labels and films.

Original package (custom order product)

  • Signs, banners, lanterns, and curtains
  • Vacuum Cooling Machine
  • Food cleaning agent

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