Silver nanoparticles for low temperature and low pressure/no pressure sintering.
Achieve a dense silver sintered layer at low temperature and low pressure / without applied pressure! A lineup of silver nanoparticles ranging from nano to submicron diameter.
We would like to introduce the new development product "Silver Nanoparticles" from Osaka Soda Co., Ltd. By applying silver nanoparticle synthesis technology, we have created a lineup of silver nanoparticles with particle sizes not available in conventional commercial products, while maintaining high low-temperature sinterability. As an application example, by combining with commercially available silver particles to achieve a densely packed design, we can achieve high reliability, bonding strength, and conductivity with a dense and low-shrinkage sintered bonding layer even under low-temperature and no-pressure bonding conditions. 【Features of the added silver sintered layer】 ■ High thermal conductivity ■ Low electrical resistance ■ High bonding strength ■ Improved thermal reliability *For more details, please refer to the PDF document or feel free to contact us.
- Company:OsakaSodaCO.,LTD. Development&Commercialization Div.
- Price:Other