Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
31～45 item / All 49 items
Polycrystalline diamond slurry
Features ◆ Uses in-house synthesis, purification, classification, and harmonization technology (GRISH products). ◆ High dispersion, resistant to scratching. ◆ High polishing rate and excellent surface finish. ◆ Ensures quality stability between lots. ◆ Capable of offering a wide range of product lineup.
High-quality domestic slurry manufactured by Nitta Dupont Co., Ltd.
The "Machplaner(TM) series" is a versatile slurry that is effective for various substrates. We offer a lineup that meets customer needs, including high polishing rates for various difficult-to-polish materials. Please feel free to contact us with your requests. 【Overview】 ■ Supports a wide range of substrate polishing, including glass and sapphire substrates that require high-quality surfaces ■ Achieves both reduced surface roughness and high polishing rates ■ Dilutable and maintains high performance and long life even during circulation use *For more details, please download the PDF or feel free to contact us.
Slurry for primary, secondary, finishing, and edge polishing of silicon wafers.
The "Nanopure(TM) Series" is a high-quality polishing slurry for silicon wafers manufactured by Nitta Dupont Co., Ltd. It consistently demonstrates excellent polishing performance, including high flatness, low defects, and high productivity. Please feel free to contact us if you have any inquiries. 【Overview】 - Suitable for primary, secondary, and final polishing of silicon wafers, as well as edge polishing - Alkaline colloidal silica-based slurry - Consistently exhibits high polishing rates, high flatness, and low defectivity - A rich lineup that matches various applications *For more details, please download the PDF or feel free to contact us.
Fumed silica slurry for oxidation film engineering
The "ILD(TM) Series" is a CMP slurry for oxide films that uses fumed silica. It is an industry-standard slurry that achieves a high polishing rate and reduces scratches and impurities, which is difficult to achieve with conventional colloidal silica slurries, and can also be used for glass-epoxy polishing. [Overview] - Suitable for oxide film process polishing requiring low scratch performance - KOH/ammonia-based - Overwhelming reduction of metallic impurities - High mechanical polishing characteristics *For more details, please download the PDF or feel free to contact us.
![Diamond slurry [World-class quality]](https://image.mono.ipros.com/public/product/image/4d8/2000371340/IPROS29344916011417462124.jpeg?w=280&h=280)
The highest quality slurry proudly offered by Pureon. We will propose the best option for our customers based on their work, applications, desired polishing rate, and surface quality.
Micro Diamond, which has contributed to customers through precision classification, has acquired the American CMP-related company Eminess Technology and has become Pureon. In addition to the high-quality diamond-related products developed so far, know-how regarding final finishing CMP will also be accumulated in-house. Pureon continues to synthesize the world's largest polycrystalline diamonds in the American desert and manages the crushing, cleaning, and classification of both single and polycrystalline diamonds in-house to produce final products. Similarly, the slurries are provided based on high-precision classified in-house diamond powders, using oil-based and water-based liquids. We offer tailor-made products that can be customized according to your requirements, as well as standard ready-made products. We are pleased to propose the most suitable slurry for your applications.
Oil-based slurry formulated according to customer requirements such as diamond type, particle size, and concentration. Please use it to build the optimal polishing process!
The "Type SPO" is an oil-based diamond slurry designed for wrapping and polishing sapphire, ceramics, and metals. Our specially formulated additives provide the best polishing performance while achieving the highest polishing rates. 【Features】 ■ Achieves a polishing rate 25% higher than other oil-based slurries The polishing rate is dramatically higher compared to other oil-based slurries. ■ High-performance stabilizers prevent the sedimentation of diamond particles Prevents the sedimentation of diamond particles, making the work process efficient and stable. * For equipment and applications equipped with stirring devices, slurries without stabilizers can be provided. * For more details, please refer to the PDF document or feel free to contact us.
Ideal for customers who want to improve the polishing rate and surface roughness of current water-based slurries with high lubricity and low drying characteristics.
SPG suspension is completely water-soluble and does not dry out when exposed to air, making it an ideal product as a substitute for oil-based polishing liquids. The excellent lubricity of SPG allows for high lap pressure, achieving a high polishing rate. SPG suspension is optimal for lapping and polishing with metal plates (cast iron plates, copper plates, tin plates, composite materials). When used in conjunction with polishing pads, please check for compatibility. SPG suspension can be customized to meet your specification requirements. The composition of the suspension includes selecting (1) carrier liquid, (2) diamond concentration, (3) type of diamond, and abrasive size.
Glycol-based diamond slurry that improves cutting speed and achieves high reproducibility for multi-wire saws. Water-soluble, easy to clean, and environmentally friendly!
WSG is a glycol-based diamond slurry suitable for high-performance multi-wire saws. It can be used immediately upon arrival. Our unique additives promote adhesion between the slurry and the wire, enhancing cutting speed. 【Features】 ■ Tailor-made specifications You can freely choose the type of diamond, particle size, and concentration. ■ High polishing rate It has optimal adhesion to the wire, maintaining a high polishing rate. ■ High reproducibility Thanks to our unique formulation, no dispersion processing is required. ■ Water-soluble, environmentally friendly, and easy to maintain *For more details, please feel free to contact us.
Focusing on the adjustment and evaluation of fine particles and slurries! New cases in each category as well!
This book describes the manufacturing technology of lithium-ion batteries and all-solid-state batteries. Focusing on the adjustment and evaluation of fine particles and slurries, it introduces battery manufacturing technology. Experts from various research fields explain the fundamental theories and general principles. In the individual chapters, new case studies are presented classified by powder, positive electrodes, negative electrodes, binders, slurries, conductive additives, separators, analysis, and all-solid-state batteries. [Features] - Introduces battery manufacturing technology focusing on the adjustment and evaluation of fine particles and slurries - Experts from various research fields explain fundamental theories and general principles - New case studies are presented in individual chapters classified by powder, positive electrodes, negative electrodes, binders, slurries, conductive additives, separators, analysis, and all-solid-state batteries *When applying, please download the order form from the PDF download. *For more details, please refer to the PDF materials or feel free to contact us.
The sizes range from submicron to 10 μm. They are used in various materials such as silicon chips, optical devices, and metal parts.
Qual Diamond Hydrocolloid Explosive Polycrystalline Diamond Slurry is an aqueous formulation. The slurry is a dispersion of explosive polycrystalline diamond particles in an aqueous liquid. Thanks to a unique surface modification technology, it can prevent the aggregation of diamond particles. Sizes are available from submicron to 10μm. It is widely used for lapping and precision polishing. It is extensively used for lapping and precision polishing of various materials such as silicon chips, optical devices, and metal products.
Qual Diamond's "high-pressure high-temperature polycrystalline diamond slurry" is a water-based formulation.
Slurry is a dispersion of high-pressure, high-temperature polycrystalline diamond particles in an aqueous liquid. Our unique surface modification technology prevents the aggregation of diamond particles. The sizes range from 1μm to 60μm. There are differences in the number of contact points, edges, and the results of fine finishing between single crystal diamond slurry and crushed polycrystalline diamond slurry.
The CMP market revenue is projected to reach 3.6 billion dollars by 2025! Covering CMP consumables and supply chains for semiconductor device manufacturing!
CMP slurries and pads are extremely important in semiconductor manufacturing. This is because process integration requires the production of thin, uniform planar layers to build device structures across the entire semiconductor wafer. The number of steps in the CMP process continues to increase with each new generation of device technology. New device technologies are characterized by more layers, new materials, stricter process control requirements, and new techniques for advanced packaging. These manufacturing challenges necessitate the development of new CMP slurries and pads. Techcet's market research report "CMP Slurry and Pad Market Report CMR 2025-2026" examines market drivers, forecasts by application for slurries and pads, market share, and abrasive suppliers, with a particular focus on advanced packaging. *For more details on the report, please see the following URL:* https://www.dri.co.jp/auto/report/techcet/techccmpcons.html
![[Research Material] World Market for Chemical Polishing Liquids](https://image.mono.ipros.com/public/product/image/495/2001458575/IPROS45690047829413630502.jpeg?w=280&h=280)
World Market for Chemical Polishing Liquids: Alumina Slurry, Colloidal Silica Slurry, Ceria Slurry, Silicon Wafers, Optical Substrates, Disk ...
This research report (Global Chemical Polishing Fluid Market) investigates and analyzes the current state and outlook for the global market of chemical polishing fluids over the next five years. It includes information on the overview of the global chemical polishing fluid market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the chemical polishing fluid market focus on alumina slurries, colloidal silica slurries, and ceria slurries, while the segments by application target silicon wafers, optical substrates, disk drive components, and others. The regional segments calculate the market size of chemical polishing fluids by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the chemical polishing fluid sector, product and business overviews, and sales performance.
Stable quality is a characteristic! Introducing the properties of "alumina" and "silica" as well as the polishing targets!
Our company conducts slurry development and manufacturing based on the experience we have cultivated since our founding. "CMP slurry" is composed of chemical solutions and nano-sized abrasive particles, characterized by minimal generation of coarse particles and good particle dispersion, ensuring stable quality. We offer "alumina," which provides excellent cleaning properties and a fast polishing rate, and "silica," which achieves damage-free results with high surface roughness. 【Features】 <Alumina> ■ Properties: Excellent cleaning properties and fast polishing rate ■ Polishing targets: Resins, compound ceramics <Silica> ■ Properties: Damage-free with high surface roughness ■ Polishing targets: Oxide films, metal film resins, glass *For more details, please refer to the PDF document or feel free to contact us.
