Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
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Gallium nitride (GaN) is a very hard and mechanically stable wide-bandgap semiconductor.
Gallium nitride (GaN) is a very hard and mechanically stable wide-bandgap semiconductor. Due to its higher breakdown voltage, faster switching speed, higher thermal conductivity, and lower on-resistance, GaN-based power devices are significantly superior to silicon-based devices.
Able to product GaN at low cost by forming of nitride semiconductor crystal boules
Recently, III-nitride semiconductors (GaN and InGaN) have been attracting attention as semiconductor materials for light-emitting devices such as LED and lasers. This nitride semiconductor has a bandgap energy with wide range wavelengths from infrared to ultraviolet light, and it is a promising material for blue & green LED and semiconductor lasers with UV to infrared region emission wavelengths. However, in the case of nitride semiconductors, the equilibrium vapor pressure between the gas and solid phases of nitrogen is much higher than the conventional III-V materials, so it is not possible to fabricate GaN single crystal substrates at low cost. Another option is to use freestanding GaN substrates, but the current fabrication techniques are costly. This invention is able to fabricate nitride semiconductor freestanding substrates with low threading dislocation density at a low cost. This invention comprises a total of seven steps, from the process of forming a buffer layer having a nitride semiconductor on the growing substrate main surface, to the process of fabricating a plurality of nitride semiconductor freestanding substrates.
We consistently carry out everything from crystal growth of single crystal sapphire to cutting, grinding and polishing, PSS processing, GaN epitaxial growth, and special processing!
In the doujin industry, we mainly provide sapphire materials using the Kyropoulos method. Our sapphire substrates are produced in domestic factories as well as through contract manufacturing with reputable overseas manufacturers.
A high-current substrate suitable for miniaturized power devices!
The "Hybrid Copper Thickness Coexistence Substrate" is a high-current substrate that allows for the coexistence of 300μm thick copper foil and 70μm thin copper foil within the same layer, enabling switching between them. It achieves a reduction in assembly processes and component count, making it suitable for power devices represented by GaN and SiC, which are becoming more compact. 【Features】 ■ Switchable between 300μm and 70μm ■ 300μm and 70μm can be interwoven ■ Combination of copper inlays is possible *For more details, please download the PDF or feel free to contact us.
With a rich lineup of copper foil thicknesses, we can accommodate current values from a few amperes to several hundred amperes!
The "High Current Substrate" is a printed circuit board that can carry large currents ranging from several tens to several hundred amperes, featuring thick copper foil. We offer "Ultra Thick Copper High Current Substrates" that use copper thicknesses of 300μm, 400μm, and 500μm, exceeding the conventional copper thickness of 105 to 240μm, as well as "Irregular Copper Thickness Coexisting Substrates" suitable for power devices represented by GaN and SiC, which are becoming more compact. 【Features】 - In the case of 300μm, coexistence with 50μm thin copper foil is possible in the same layer. - For thicknesses of 500μm or more, it is possible to draw copper foil out of the substrate from the inner or outer layers. - Exposure within the substrate is also possible. - Terminal processing, bending processing, and three-dimensional shaping of the substrate are possible. *For more details, please download the PDF or feel free to contact us.
We offer single crystal lithium niobate (LN / LiNbO3) ingots, wafers, and special processing.
Product Name: Single Crystal Lithium Niobate (LN / LiNbO3) Size: Φ2”, Φ3”, Φ4”, Φ6” Orientation: Specifiable Thickness: 250um, 350um, 500um, Specifiable Finish: Single-sided mirror, Double-sided mirror, Others Quantity: 10 pieces or more, Mass production available Manufacturing: Made in Japan, Made in China
We respond to the various needs for printed circuit boards required in the development of electronic components and the production process!
We would like to introduce our "Printed Circuit Boards for Electronic Component Evaluation." We can offer various printed circuit boards required at each stage of the engineering chain and value chain for electronic component manufacturers. We provide a seamless service for all tasks related to printed circuit board development. With the LDI process, both patterns and solder resist (SR) can be finished with high precision. 【Benefits for Customers】 ■ We can provide a seamless service for all tasks related to printed circuit board development. ■ The LDI (Laser Direct Imaging) process allows for high-precision finishing of both patterns and solder resist (SR). ■ There is no concept of end-of-life (EOL) due to the absence of original artwork, film plates, and screen plates, allowing for orders to be placed at any time. *For more details, please download the PDF or feel free to contact us.
Consistent production from crystal growth to processing in-house. High-quality crystal substrate surfaces without processing distortion.
【Optimal for Epitaxial Growth】 Oxide substrates for thin film growth have been contributing to advancements in science and technology since the 1980s, providing substrates such as SrTiO3 and sapphire for high-temperature superconducting thin films and GaN. For epitaxial growth substrates, the crystal quality, surface smoothness, flatness, and the presence or absence of crystal lattice strain at the very surface are crucial. Our company has achieved consistent in-house production from crystal growth to processing through years of technological accumulation. With our high-precision processing technology, we continue to provide high-quality crystal substrate surfaces. We always keep standard specifications in stock and deliver them within approximately 10 days after order placement. We also offer custom-made options for surface orientation, shape, and off-angle according to your needs, so we handle products with specifications not listed in our lineup. Please feel free to contact us. *For more details, please inquire or refer to our catalog.*
![[Research Material] Global Market for Gallium Nitride (GaN) Substrates](https://image.mono.ipros.com/public/product/image/934/2001463577/IPROS75731221439146869495.jpeg?w=280&h=280)
World Market for Gallium Nitride (GaN) Substrates: Sapphire on GaN, Si on GaN, SiC on GaN, GaN on GaN, Others, ...
This research report (Global Gallium Nitride (GaN) Substrates Market) investigates and analyzes the current status and outlook for the global market of gallium nitride (GaN) substrates over the next five years. It includes information on the overview of the global gallium nitride (GaN) substrates market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the gallium nitride (GaN) substrates market include Sapphire on GaN, Si on GaN, SiC on GaN, GaN on GaN, and others, while the segments by application cover medical, automotive, consumer electronics, general lighting, and military/defense. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of gallium nitride (GaN) substrates. The report also includes the market share of major companies in the gallium nitride (GaN) substrates market, product and business overviews, and sales performance.
Latest polishing technology for various GaN/SiC related materials with high hardness and brittleness.
★What does the future hold for technologies that support large-diameter processing and mass production techniques? ★We will also introduce the characteristics of the residual processing altered layer remaining during SiC wafer processing, its impact on subsequent processes, and analysis techniques for the altered layer. ★We are currently conducting a pre-content request service! We welcome your practical challenges! 【Venue】 Tekno Kawasaki, 5th Floor, 5th Training Room【Kanagawa, Kawasaki】 【Date and Time】 September 17, 2013 (Tuesday) 11:00-15:45 【Instructors】 Part 1: Dr. Tomohisa Kato, Team Leader and Senior Researcher, Advanced Power Electronics Research Center, National Institute of Advanced Industrial Science and Technology (AIST) Here is the homepage of the Advanced Power Electronics Research Center. Part 2: Representative from Namiki Precision Jewel Co., Ltd., NJC Technology Research Institute Part 3: Professor Kazuto Yamauchi, Graduate School of Engineering, Osaka University
We provide custom structure MBE/MOCVD epitaxial growth on compound semiconductor epitaxial InP substrates.
We provide custom structure MOCVD epitaxial growth on GaAs substrates ranging from 2 inches to 6 inches. We offer comprehensive services for GaAs epitaxial substrates to companies, universities, and scientific research institutions, including epitaxial structure design, epitaxial materials, and testing analysis.
This is the original LED backlight power supply board from Kenik System.
The "KSLBC-4(D4)" is an LED backlight power supply board for SVGA and VGA LCDs manufactured by Densitron. 【Features】 - It can be easily configured with a general-purpose microcontroller for ON/OFF and brightness adjustment. - It uses devices with built-in overvoltage protection, so even if the LED is disconnected, the device is protected. - It is compact and lightweight, measuring 67×20mm.
![Development board for Qseven module [ROM-DB7500]](https://image.mono.ipros.com/public/product/image/60e/2000513511/IPROS97028402398666720535.jpeg?w=280&h=280)
Development board for RISC Qseven module
- 24-bit LVDS panel support - 1 PCIe x1 - 1 SATA, 4 UART, 1 RJ-45, 4 USB 2.0 (with 1 OTG) - HD audio codec - Dual CAN bus - Supports VGA and HDMI output - Onboard SD card slot, SIM card slot RoHS COMPLIANT 2002
A measuring device for locating cable faults and determining their causes! Ideal for wiring checks.
We will investigate the location of wiring troubles (disconnection or short circuit). Since it is possible to measure the installation length from the cable end, it is also effective for inventory management of wire materials. --------------------------------------------------------------------------- Koga Electronics Co., Ltd. 2-9-19 Minami-hara, Hiratsuka City, Kanagawa Prefecture TEL: 0463-34-2334 info@kogadenshi.co.jp Facebook page: http://www.facebook.com/kogadenshi
![[Hardware Development Achievements] 64ch FPIX Board](https://image.mono.ipros.com/public/product/image/96d/2000610317/IPROS15520091796991262499.png?w=280&h=280)
The created histogram is transferred to the PC via SiTCP! It has a structure with a heat-dissipating aluminum block placed at the bottom.
We assisted with KEK's FPIX project. This is a substrate developed in the measurement instrument development room to collect signals from a Si-APD chip, where the signals are sampled at 0.5 ns by an FPGA and histogrammed within the FPGA. The created histogram is transferred to a PC via SiTCP. To efficiently dissipate heat from components like the FPGA, most of the components are placed on the underside, and a heat-dissipating aluminum block is structured on the bottom. 【Overview of Achievements】 ■ Service: Hardware Development ■ Client: High Energy Accelerator Research Organization ■ Location: KEK PF *For more details, please refer to the related link page or feel free to contact us.
Through thorough discussions with our clients, we will carry out design and manufacturing that meets your requests and ensures your satisfaction. Of course, our aftercare is also comprehensive!
We mainly handle circuit board design and manufacturing, logic circuit design, and mechanical design and manufacturing. 【Development Examples】 - P-THIN-GEM A neutron detector capable of measuring two-dimensional images of materials using neutrons and TOF (Time-Of-Flight) information. - 8ch-5Gsps-Digitizer Writes analog signals to analog memory at speeds of up to 5Gsps. - BRoaD III A module that facilitates the verification of signal logic, input switching, and comparison of outputs from multiple logic circuits. - ADC-SiTCP An ADC board capable of digitizing 16-channel balanced analog inputs at 40Msps. - Acrylic chamber for moisture supply A discharge experiment case for Kinki University. An acrylic case that allows observation of discharges while supplying moisture. ★ We specialize in circuit design using FPGA (VeriLog) and the development of devices incorporating hardware TCP. *For more details, please feel free to contact us.
We accept artwork design for various types of circuit boards, including high-frequency impedance control boards and power supply boards.
We specialize in the design of impedance control PCBs, with proven experience in high-frequency PCBs ranging from 10GHz to 40GHz and high-speed transmission PCBs from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component assembly and propose the optimal layout.
![Control board with GPS module [High precision positioning] [Under development]](https://image.mono.ipros.com/public/product/image/c9c/2000703811/IPROS21290008569350756215.png?w=280&h=280)
Developing a control board equipped with a high-precision positioning GPS module.
■Equipment using a positioning system with centimeter-level accuracy (under development) - Achieves high-precision positioning through GNSS + RTK. - GNSS (Global Navigation Satellite System): Global navigation satellite system - GPS (USA), QZSS (Japan), Galileo (Europe), etc. - RTK (Real Time Kinematic): Relative positioning utilizing ground reference stations - Positioning data from GNSS satellites is received by ground reference stations and mobile stations, and the mobile station uses correction data from the reference station to adjust the positioning data, achieving centimeter-level accuracy.
This is a substrate with unique high heat dissipation properties developed by Daiwa Kogyo Co., Ltd.
"DPGA" stands for "Daiwa Process Global Advance," which is a process developed independently by Daiwa Industrial that uses metal Cu bumps for interlayer wiring connections. A substrate with high heat dissipation characteristics enables high brightness and long lifespan of LEDs, as well as miniaturization of heat sinks. 【Features】 ○ Interlayer connection using metal pillars (copper bumps) → Achieves low resistance, high connection reliability, and high thermal conductivity ○ Copper bumps can be of any shape and size → For cylindrical shapes, diameters can range from 0.3 to 4.00 mm ○ Mixing of copper bumps of different sizes is possible ○ Improved thinness, lightness, and rigidity → Minimum board thickness: 0.3 mm, using prepreg for the insulation layer ○ Maximizes the functionality of LEDs → Ideal for LED substrates (liquid crystal panels, lighting) and automotive substrates For more details, please contact us or download the catalog.
PCI Express board capable of high-capacity data transmission and reception using high-speed serial communication.
The "SY-KUS-01" is a PCI Express board equipped with a Xilinx Kintex UltraScale FPGA. It enables high-speed serial communication for large-capacity data transmission and reception. It features two channels of DDR4 as external memory. It is equipped with the FPGA XCKU035-2FFVA1156C, and options for 025, 040, and 060 are also available. Additionally, it includes two QSPI (totaling 512Mbit). 256Mbit can be used as user space. 【Features】 ■ PCI Express (supports up to Gen3 x 8) ■ Oscillator ・ Equipped with 100MHz, 200MHz, and 250MHz ■ Two channels of DDR4 (1 channel = 32Gbit 64bit_DataBus) ■ SFP+ 4ch ■ MMCX 2Lane (Tx/Rx) + RefCLK ■ 8-pin PinHeader external interface *For more details, please refer to the PDF document or feel free to contact us.
The size after cutting is perfect for small cases like those used for commercial sweets.
It is a double-sided land, but there are no through holes. It is possible to increase the mounting density.
We provide board development solutions.
We provide planning and development solutions for electronic device development through a comprehensive technical approach from both hardware and software. With our accumulated technology and the latest electronics technology, we respond to various requests in hardware development and help realize our customers' product visions.
It is possible to produce a "super high quality" aluminum nitride film on inexpensive sapphire substrates!
Ultraviolet light-emitting devices are widely attracting attention as next-generation light sources for applications such as alternatives to fluorescent lamps, high-density DVDs, biochemical lasers, decomposition of pollutants using photocatalysts, He-Cd lasers, and alternatives to mercury lamps. These ultraviolet light-emitting devices consist of AlGaN-based nitride semiconductors, known as wide-gap semiconductors, which are layered on heterogeneous substrates such as sapphire. However, there have been challenges with the AlN films grown on sapphire, which contain numerous threading dislocations and exhibit poor quality. The present invention significantly improves the crystallinity of the AlN films through a simple method of thermally treating substrates with AlN films grown on sapphire in an N2/CO mixed gas.
![Development board for SMARC module [ROM-DB5900]](https://image.mono.ipros.com/public/product/image/237/2000513507/IPROS57489130307249225772.jpeg?w=280&h=280)
Development board for RISC SMARC module
- Compatible with SGeT SMARC CPU module board - 3 display outputs: VGA, HDMI, 24-bit LVDS - 1 SATA / SATA-DOM, 1 RJ-45, 2 USB 2.0, 2 CAN bus, 4 UART, 12 GPIO - 1 PCIe x 1 and 2 miniPCIe slots - Two MIPI interfaces for camera modules - Onboard eMMC flash 4 GB, SD card, SIM card slot - HD audio codec and SPDIF support - Supports 12V DC and lithium-ion battery power input
![Development board for RTX 2.0 module [ROM-DB3900]](https://image.mono.ipros.com/public/product/image/970/2000513504/IPROS32539789301511764796.jpeg?w=280&h=280)
Development board for RISC RTX2.0 module
- Compatible with RTX 2.0 CPU module board - 3 display outputs: VGA, HDMI, 24-bit LVDS - 1 SATA / SATA-DOM, 1 RJ-45, 1 USB 2.0 / 3.0, 2 CAN buses, 4 UARTs, 10 GPIOs - 2 PCIe slots - 2 MIPI interfaces for camera modules - Onboard eMMC flash 4 GB, SD card, SIM card slot - HD I2S audio codec
We accept artwork design for various types of boards, including high-frequency impedance control boards and power supply boards.
We specialize in the design of impedance control PCBs, with proven experience in high-frequency boards ranging from 10GHz to 40GHz and high-speed transmission boards from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component mounting and propose the optimal layout.
![We will be exhibiting at the Kyushu Semiconductor Industry Exhibition! Printed Circuit Boards [SHOWA]](https://image.mono.ipros.com/public/product/image/535/2001406449/IPROS63580453184450196076.png?w=280&h=280)
Anyway, it's fast! Leave the printed circuit boards to 【SHOWA】!
Our company is one of Japan's leading ultra-fast printed circuit board manufacturers. We possess top-level equipment and specialize in the production of high-difficulty circuit boards. With over 30 years of industry experience, we currently have business dealings with more than 2,200 companies in Japan. Of course, in addition to circuit board manufacturing, we can also accommodate customer requests for AW design and component mounting. 【Build-up Boards】⇒ We can handle narrow pitch BGA mounting, multi-layer builds, and any layer configurations. 【Heat Dissipation】⇒ We can accommodate aluminum base boards, high thermal conductivity CEM-3, and copper inlay boards. 【Thick Copper Boards】⇒ We can handle high current boards, thicker plating in through holes, and automotive boards. 【Flexible Boards】⇒ We can accommodate FPC, multi-layer FPC, rigid FPC, and transparent polyimide FPC. 【High Frequency】⇒ We have standard stock of Megtron 6 (manufactured by Panasonic) and have processing experience with many low dielectric constant materials. 【Special Processing】⇒ We can also accommodate bump formation and back drilling. ↓ Please also visit our website https://www.showanet.jp/ We look forward to hearing from you.
