更新日： 集計期間:Jul 16, 2025～Aug 12, 2025
※当サイトの各ページの閲覧回数を元に算出したランキングです。
1～12 件を表示 ／ 全 12 件
We consistently carry out everything from crystal growth of single crystal sapphire to cutting, grinding and polishing, PSS processing, GaN epitaxial growth, and special processing!
In the doujin industry, we mainly provide sapphire materials using the Kyropoulos method. Our sapphire substrates are produced in domestic factories as well as through contract manufacturing with reputable overseas manufacturers.
A high-current substrate suitable for miniaturized power devices!
The "Hybrid Copper Thickness Coexistence Substrate" is a high-current substrate that allows for the coexistence of 300μm thick copper foil and 70μm thin copper foil within the same layer, enabling switching between them. It achieves a reduction in assembly processes and component count, making it suitable for power devices represented by GaN and SiC, which are becoming more compact. 【Features】 ■ Switchable between 300μm and 70μm ■ 300μm and 70μm can be interwoven ■ Combination of copper inlays is possible *For more details, please download the PDF or feel free to contact us.
With a rich lineup of copper foil thicknesses, we can accommodate current values from a few amperes to several hundred amperes!
The "High Current Substrate" is a printed circuit board that can carry large currents ranging from several tens to several hundred amperes, featuring thick copper foil. We offer "Ultra Thick Copper High Current Substrates" that use copper thicknesses of 300μm, 400μm, and 500μm, exceeding the conventional copper thickness of 105 to 240μm, as well as "Irregular Copper Thickness Coexisting Substrates" suitable for power devices represented by GaN and SiC, which are becoming more compact. 【Features】 - In the case of 300μm, coexistence with 50μm thin copper foil is possible in the same layer. - For thicknesses of 500μm or more, it is possible to draw copper foil out of the substrate from the inner or outer layers. - Exposure within the substrate is also possible. - Terminal processing, bending processing, and three-dimensional shaping of the substrate are possible. *For more details, please download the PDF or feel free to contact us.
We offer single crystal lithium niobate (LN / LiNbO3) ingots, wafers, and special processing.
Product Name: Single Crystal Lithium Niobate (LN / LiNbO3) Size: Φ2”, Φ3”, Φ4”, Φ6” Orientation: Specifiable Thickness: 250um, 350um, 500um, Specifiable Finish: Single-sided mirror, Double-sided mirror, Others Quantity: 10 pieces or more, Mass production available Manufacturing: Made in Japan, Made in China
Consistent production from crystal growth to processing in-house. High-quality crystal substrate surfaces without processing distortion.
【Optimal for Epitaxial Growth】 Oxide substrates for thin film growth have been contributing to advancements in science and technology since the 1980s, providing substrates such as SrTiO3 and sapphire for high-temperature superconducting thin films and GaN. For epitaxial growth substrates, the crystal quality, surface smoothness, flatness, and the presence or absence of crystal lattice strain at the very surface are crucial. Our company has achieved consistent in-house production from crystal growth to processing through years of technological accumulation. With our high-precision processing technology, we continue to provide high-quality crystal substrate surfaces. We always keep standard specifications in stock and deliver them within approximately 10 days after order placement. We also offer custom-made options for surface orientation, shape, and off-angle according to your needs, so we handle products with specifications not listed in our lineup. Please feel free to contact us. *For more details, please inquire or refer to our catalog.*
Gallium nitride (GaN) is a very hard and mechanically stable wide-bandgap semiconductor.
Gallium nitride (GaN) is a very hard and mechanically stable wide-bandgap semiconductor. Due to its higher breakdown voltage, faster switching speed, higher thermal conductivity, and lower on-resistance, GaN-based power devices are significantly superior to silicon-based devices.
This is the original LED backlight power supply board from Kenik System.
The "KSLBC-4(D4)" is an LED backlight power supply board for SVGA and VGA LCDs manufactured by Densitron. 【Features】 - It can be easily configured with a general-purpose microcontroller for ON/OFF and brightness adjustment. - It uses devices with built-in overvoltage protection, so even if the LED is disconnected, the device is protected. - It is compact and lightweight, measuring 67×20mm.
We accept artwork design for various types of circuit boards, including high-frequency impedance control boards and power supply boards.
We specialize in the design of impedance control PCBs, with proven experience in high-frequency PCBs ranging from 10GHz to 40GHz and high-speed transmission PCBs from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component assembly and propose the optimal layout.
![Control board with GPS module [High precision positioning] [Under development]](https://image.mono.ipros.com/public/product/image/c9c/2000703811/IPROS21290008569350756215.png?w=280&h=280)
Developing a control board equipped with a high-precision positioning GPS module.
■Equipment using a positioning system with centimeter-level accuracy (under development) - Achieves high-precision positioning through GNSS + RTK. - GNSS (Global Navigation Satellite System): Global navigation satellite system - GPS (USA), QZSS (Japan), Galileo (Europe), etc. - RTK (Real Time Kinematic): Relative positioning utilizing ground reference stations - Positioning data from GNSS satellites is received by ground reference stations and mobile stations, and the mobile station uses correction data from the reference station to adjust the positioning data, achieving centimeter-level accuracy.
This is a substrate with unique high heat dissipation properties developed by Daiwa Kogyo Co., Ltd.
"DPGA" stands for "Daiwa Process Global Advance," which is a process developed independently by Daiwa Industrial that uses metal Cu bumps for interlayer wiring connections. A substrate with high heat dissipation characteristics enables high brightness and long lifespan of LEDs, as well as miniaturization of heat sinks. 【Features】 ○ Interlayer connection using metal pillars (copper bumps) → Achieves low resistance, high connection reliability, and high thermal conductivity ○ Copper bumps can be of any shape and size → For cylindrical shapes, diameters can range from 0.3 to 4.00 mm ○ Mixing of copper bumps of different sizes is possible ○ Improved thinness, lightness, and rigidity → Minimum board thickness: 0.3 mm, using prepreg for the insulation layer ○ Maximizes the functionality of LEDs → Ideal for LED substrates (liquid crystal panels, lighting) and automotive substrates For more details, please contact us or download the catalog.
The size after cutting is perfect for small cases like those used for commercial sweets.
It is a double-sided land, but there are no through holes. It is possible to increase the mounting density.
We accept artwork design for various types of boards, including high-frequency impedance control boards and power supply boards.
We specialize in the design of impedance control PCBs, with proven experience in high-frequency boards ranging from 10GHz to 40GHz and high-speed transmission boards from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component mounting and propose the optimal layout.
