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Electron microscope Product List and Ranking from 37 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Feb 04, 2026~Mar 03, 2026
This ranking is based on the number of page views on our site.

Electron microscope Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Feb 04, 2026~Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. アズサイエンス 松本本社 Nagano//Trading company/Wholesale
  2. 一般財団法人材料科学技術振興財団 MST Tokyo//Testing, Analysis and Measurement
  3. ロンビック Mie//Resin/Plastic
  4. 4 アイテス Shiga//Electronic Components and Semiconductors
  5. 5 関西電力送配電 技術試験センター Hyogo//Electricity, Gas and Water Industry

Electron microscope Product ranking

Last Updated: Aggregation Period:Feb 04, 2026~Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. In various fields such as the semiconductor industry, polymer material development and research, and quality control! アズサイエンス 松本本社
  2. [Introduction of Testing Equipment] Multi-Angle Lens VHX-D510 関西電力送配電 技術試験センター
  3. Observation of Cellulose Nanofibers (CNF) - Examples of SEM and TEM Observations ロンビック
  4. 4 JEM-1400Flash Electron Microscope アズサイエンス 松本本社
  5. 5 JEM-ARM200F NEOARM Atomic Resolution Analytical Electron Microscope アズサイエンス 松本本社

Electron microscope Product List

91~120 item / All 155 items

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Basic Analysis Methods for Things that are Similar Yet Different

Introducing the flow from optical microscope observation with a wide range of applications to SEM observation and EDX elemental analysis!

We will introduce the flow from basic and widely applicable optical microscope observation to SEM observation and EDX elemental analysis. Observation using an optical microscope is one of the fundamental observation techniques, allowing for quick examination of general shapes and other features. Its advantage lies in the ability to obtain color information, making it effective for observing abnormalities associated with corrosion and other changes. In this document, we also provide detailed explanations of "observation using SEM" and "elemental analysis using EDX" with the help of photos and graphs. We encourage you to read it. [Contents] ■ Observation using an optical microscope ■ Observation using SEM ■ Elemental analysis using EDX *For more details, please refer to the PDF document or feel free to contact us.

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  • Other contract services
  • Electron microscope

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Scanning Electron Microscopy (SEM)

High magnification observation (up to about 300,000 times) is possible.

SEM is a technique that allows for obtaining contrast based on the information from electrons emitted from a sample when an electron beam is directed at it, revealing the sample's surface roughness and compositional differences. - High magnification observation (up to about 500,000 times) is possible with simple operation. - Observation of secondary electron (SE) images, backscattered electron (BSE) images, and transmitted electron (TE) images is possible. - Observation can be conducted within an acceleration voltage range of 0.1 to 30 kV. - Samples up to 6 inches can be loaded into the device (depending on the equipment). - By combining options with SEM, various types of information can be obtained: - Elemental analysis using an EDX detector is possible. - Measurement of electron beam induced current (EBIC) allows for evaluation of the junction position and shape in semiconductors. - Crystal information can be obtained using electron backscatter diffraction (EBSD) method. - Three-dimensional structural information can be acquired through repeated FIB processing and SEM observation (Slice & View). - Cooling observation and atmosphere-controlled observation are available.

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  • Electron microscope

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[Analysis Case] Observation of the Buffer Layer Interface in CIGS Thin-Film Solar Cells

Crystal structure evaluation of the Zn(S, O, OH)/CIGS junction interface using ultra-high resolution STEM.

By directly observing the junction interface using a Cs collector-equipped STEM device, it is possible to evaluate the crystal structure at the atomic level. In this study, we conducted HAADF-STEM imaging of the buffer layer/CIGS interface using Zn(S, O, OH) in the buffer layer of CIGS thin-film solar cells and evaluated the structure. As a result, it was suggested that the crystal structure at the junction is unclear compared to samples using CdS as the buffer layer, indicating that it is not an epitaxial junction.

  • Other contract services
  • Electron microscope

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[Analysis Case] Visualization of Strain at Heterojunction Interfaces in Compounds

Lattice image analysis using the FFTM method

The Fast Fourier Transform Mapping method is a technique that performs a Fourier transform on high-resolution TEM images to analyze and visualize the minute lattice distortions of crystals from the spot positions of the FFT pattern. Through FFTM analysis, it is possible to (1) analyze lattice distortions in the x and y directions of the image, (2) analyze lattice distortions in the crystal plane direction, (3) analyze the distribution of crystal plane spacing and crystal plane orientation, (4) display the data distribution as a histogram, and (5) detect distortions of 0.5% with a spatial resolution of 5 nm. An example of its application to compound heterojunction multilayer film samples is presented.

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  • Electron microscope

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[Analysis Case] Evaluation of pn Junction and Grain Structure of CIGS Film

Electron beam induced current method and crystal orientation analysis using SEM.

CIGS thin-film polycrystalline solar cells are expected to be low-cost next-generation solar cells. Development is underway for large-area and high-quality production. To evaluate the characteristics of the polycrystalline thin film, we conducted assessments of the pn junction using EBIC and crystal grain evaluation using EBSD on the same cross-section. We prepared a cross-section of the CIGS film and measured the open-circuit voltage (EBIC) by scanning an electron beam, visualizing the in-plane distribution of the open-circuit voltage. Additionally, by measuring EBSD on the same surface, we correlated the distribution of the open-circuit voltage with the crystal grains.

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  • Electron microscope

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[Analysis Case] Evaluation of Crystal Grains in CIGS Film

Crystal orientation analysis using SEM.

CIGS thin-film polycrystalline solar cells are being developed as next-generation solar cells expected to achieve low cost, large area, and high quality, and crystal information is required in this process. The EBSD method allows for the evaluation of crystal grains in CIGS films. The crystal information obtained from the EBSD method mainly includes orientation and grain size.

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  • Electron microscope

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[Analysis Case] Structural Observation of the Hall Side Wall ONO Film

Planar TEM observation of specific areas using the FIB method.

By using FIB technology that allows for processing at the nanoscale, it is possible to perform planar TEM observations of specific areas. This enables the confirmation of the ONO three-layer structure (silicon oxide film / silicon nitride film / silicon oxide film) of the capacitor insulating film on the sidewall of the hole, which is difficult to verify through cross-sectional observations.

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  • Electron microscope

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Spherical aberration correction function

TEM: Transmission Electron Microscopy

In a STEM device equipped with a spherical aberration correction function (Cs corrector), high-resolution observation and high-sensitivity analysis at the atomic level are possible. The resolution is approximately 0.10 nm.

  • Contract Analysis
  • Electron microscope

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[Analysis Case] Evaluation of the Structure and Dispersion of Microparticles in Liquid

Observation of cross-sectional structure of liquid samples using cryo-SEM.

When evaluating the particle size and structure of fine particles dispersed in a liquid, conventional methods involved drying the liquid to extract the fine particles as a powder, which were then measured using an electron microscope. However, this method was not suitable for investigating how fine particles are actually dispersed in the liquid used. Therefore, we will introduce a case where cryo-processing and SEM observation were performed to directly evaluate how fine particles are dispersed within a liquid sample.

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  • Electron microscope

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[Analysis Case] Elemental Analysis of Eyeshadow Components using TEM, EDX, and EELS

Capable of nano-order morphological observation and elemental analysis.

Transmission electron microscopy (TEM) allows for morphological observation and elemental analysis on the order of μm to nm. Since eyeshadows are aggregates of solid particles, we conducted the analysis directly using TEM. After TEM observation, we performed EDX analysis on specific areas within the field of view to estimate the materials based on the constituent elements. Furthermore, it is possible to distinguish crystal types through EELS analysis.

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  • Electron microscope

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[Analysis Case] Structural Evaluation of Fine Transistors

High-resolution TEM observation using Cs-corrected TEM

By using a Cs-corrected TEM device that compensates for spherical aberration, it is possible to observe the cross-sectional structure of devices with high resolution. This case presents data from high-resolution (HR)-TEM observation and EDX elemental distribution analysis of commercially available MPU transistor components. Even for fine multilayer structures like FinFETs, it is possible to clearly observe the structure and elemental distribution of the devices using a Cs-corrected TEM.

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  • Electron microscope

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[Analysis Case] Morphological Observation and Component Analysis of Solid Polymer Fuel Cell Catalyst Materials

Evaluation of catalyst particles using SEM, STEM, and EDX.

The electrodes of fuel cells are supported by Pt particles or Pt alloy (such as PtRu) particles on carbon. Due to the fine structure of these catalyst particles, which are on the order of a few nanometers, SEM and TEM analyses are used for morphological observation and compositional analysis. In addition to evaluations in the initial state, degradation after current application has been reported, including modulation of alloy composition, Ru leaching, and an increase in catalyst particle size; high spatial resolution HAADF observation and EDX analysis are very effective for these evaluations. Furthermore, SEM observation allows for the confirmation of the shape of the carbon support and the state of the catalyst particles.

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  • Electron microscope

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[Analysis Case] Evaluation of Crystal Defects in SiC Power Devices Using PL and TEM

High-resolution TEM observation of crystal defects detected by PL mapping.

In PL (photoluminescence) mapping, it is possible to identify the positions of crystal defects from the luminescent areas. Furthermore, by performing high-resolution STEM observation (HAADF-STEM images) at the same locations, we can capture stacking defects. In this case study, we investigated commercially available SiC power devices using PL mapping and STEM. After identifying the positions of stacking defects through PL mapping, we conducted μ-sampling at the defect edge and performed cross-sectional STEM observation.

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  • Electron microscope

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[Analysis Case] STEM/EDX and Image Simulation for Crystal Structure Evaluation

The evaluation of the crystal structure can be performed based on the STEM images and the results of atomic composition measurements.

By measuring the sample, it is possible to evaluate the crystal structure through the combination of results obtained and simulations. This document introduces a case study in which the crystal structure is discussed by comparing the results obtained from HAADF-STEM and EDX measurements on polycrystalline neodymium magnets with simulated images using the respective measurement conditions. The combination of measurement results and computational simulation results allows for a deeper understanding of the crystal structure.

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  • magnet
  • Memory
  • Electron microscope

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[Analysis Case] Structural Analysis of DRAM Chips using TEM and SEM

Reverse engineering of DRAM on the product's internal substrate.

We will conduct a comprehensive analysis of DRAM, a representative memory, from product level to device microstructure analysis through TEM observation. By performing appearance observation, layer analysis, and Slice & View, we will grasp the overall structure, control the FIB processing position at the nanoscale, and observe the microstructure of the memory section through TEM imaging after thin section formation.

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  • Memory
  • Electron microscope

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[Analysis Case] Extraction of Active Material from Battery Cathode Material and Data Analysis

We determined the particle size of active substances from SEM images using deep learning and data analysis.

Deep learning enables the extraction of target objects from images. Additionally, by analyzing the regions corresponding to the obtained targets, information can be obtained in numerical form. In this instance, we used deep learning to extract active material particles and detect cracks in cross-sectional SEM images of battery cathode materials. Extraction is also possible for 3D data, such as Slice&View data. We extracted particles with and without cracks from the 3D data and calculated their respective particle sizes. Measurement methods: SEM, Slice&View, computational science, AI, data analysis Product fields: Solar cells, secondary batteries, fuel cells Analysis purposes: Structural evaluation, shape evaluation, failure analysis, defect analysis For more details, please download the materials or contact us.

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[Analysis Case] Composition Analysis of Particles on a Wafer

Shape observation and simple quantitative analysis using SEM-EDX.

Control of particles in the semiconductor wafer manufacturing process is extremely important for ensuring wafer quality. In this case study, we estimated what the particles were on a Si wafer through SEM observation, EDX analysis, and simple quantification. The SEM equipment, which has high spatial resolution in the submicron range and can scan areas of several centimeters, allows for rapid inference of what the particles on the wafer are based on shape and composition information, enabling quick identification of the generation process. Analysis linked to coordinate data from defect inspection equipment is also possible.

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  • Wafer
  • Other semiconductor manufacturing equipment
  • Electron microscope

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[Analysis Case] Composite Analysis of Specific Areas within Electronic Devices (C0572)

Non-destructive assessment of specific areas inside the device! Evaluation of detailed structure and composition information of specific areas through cross-sectional observation.

Our company offers technologies suitable for structural evaluation of electronic devices, and we propose analytical methods tailored to the observation field and objectives. In a case where we investigated specific areas of a device using X-ray CT and FIB-SEM, we first used X-ray CT to observe the internal structure of the entire sample and identify specific areas. Next, we used FIB-SEM to confirm the detailed structure of the specific structures identified on the vias. 【Measurement and Processing Methods】 ■[SEM] Scanning Electron Microscopy ■[SEM-EDX] Energy Dispersive X-ray Spectroscopy (SEM) ■X-ray CT Method ■[FIB] Focused Ion Beam Processing *For more details, please download the PDF or feel free to contact us.

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  • Electron microscope

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[Analysis Case] SEM Observation of Wide-Area Cross-Section Using Xe-PFIB

Observation of cross-sections with an accuracy of several tens of nanometers and a size of several hundred micrometers is possible!

We offer wide-area cross-sectional SEM observation (C0610) using Xe-PFIB. The metal bonding that electrically connects the electrodes of integrated circuits, electrodes, printed circuit boards, and semiconductor packages has a diameter of several tens of μm to several hundred μm. With Xe-PFIB (Xe-Plasma Focused Ion Beam), we can target processing positions on the order of several tens of nm and create cross-sections of several hundred μm square, allowing for a detailed understanding of the entire view at the center of the bonding. 【Measurement and Processing Methods】 ■ [SEM] Scanning Electron Microscopy ■ X-ray CT Method ■ [FIB] Focused Ion Beam Processing *For more details, please download the PDF or feel free to contact us.

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  • Electron microscope

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[Analysis Case] (S)TEM Observation of Polymer Materials Using Electronic Staining

We will introduce examples of observing polymer materials using SEM-STEM and (S)TEM!

Our organization offers (S)TEM observation of polymer materials using electron staining. Since polymer materials are composed of light elements, it is difficult to obtain clear contrast in (S)TEM observations. Staining can enhance the contrast for such materials. This document introduces examples of staining and observation using a method called electron staining with ruthenium tetroxide (RuO4), osmium tetroxide (OsO4), and phosphotungstic acid (H3[P(W3O10)4]·xH2O, abbreviated as PTA). [Measurement and Processing Methods] ■ [(S)TEM] (Scanning) Transmission Electron Microscopy ■ Others *For more details, please download the PDF or feel free to contact us.

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  • Electron microscope

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[Analysis Case] Fine Structure of Hair Cross-Section (S)TEM Analysis

We will introduce examples of observations of hair cell membrane complexes (CMC)!

Our organization offers (S)TEM analysis of the fine structure of hair cross-sections. The hair cell membrane complex (CMC) serves as a pathway for chemicals during processes such as bleaching and dyeing hair. In particular, the CMC between the cuticle layers has a three-layer structure, which we have visualized. We present a case where osmium tetroxide (OsO4) was used for electron staining targeting unsaturated fatty acids in lipids, followed by TEM observation and STEM-EDX analysis. [Measurement and Processing Methods] ■ [(S)TEM] Scanning Transmission Electron Microscopy ■ [TEM-EDX] Energy Dispersive X-ray Spectroscopy (TEM) ■ Ultramicrotome processing ■ Others *For more details, please download the PDF or feel free to contact us.

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  • Electron microscope

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Collection of Case Studies on Cross-Section Observation and Structural Analysis (e.g., FE-SEM/EBSD) 2

We will introduce various cases of micro-section machining and analysis, residual stress measurement, and more using ion milling, FE-SEM, EBSD, etc. The materials are available for download.

In this case study collection, we will introduce examples related to "cross-sectional observation and structural analysis." Starting with the analysis case of "Evaluation of aluminum sputter films using EBSD," we also include numerous examples such as the purpose, methods, samples, and results of "Cross-sectional processing of micro areas by ion milling," and the purpose, methods, and results of "Residual stress measurement of solder cross-sections." Additionally, we present orientation evaluations, cross-sectional observation results, and measurements. We encourage you to read through it. 【Contents】 ■ Evaluation of aluminum sputter films using EBSD ■ Cross-sectional processing of micro areas by ion milling ■ Residual stress measurement of solder cross-sections ■ Residual stress measurement of wire ■ Cooling (cryo) ion milling cross-sectional processing *For more details, please refer to the PDF document or feel free to contact us.

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  • Other polymer materials
  • Other metal materials
  • Electron microscope

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Observation of the cutting edge surface of single crystal diamond chips.

Scanning Electron Microscope (SEM) ■Industry: Automotive (Prototype) / Semiconductor / Robotics

The cutting edge surface of single crystal diamond chips was observed using a scanning electron microscope (SEM). The cutting edge surface of PCD (polycrystalline diamond) was also observed and compared. The differences in the fine surface roughness were clearly confirmed. How this difference affects the machining process is yet to be determined. *For more details, please refer to the PDF document or feel free to contact us.*

  • Other machine elements
  • Processing Contract
  • Electron microscope

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Scanning Electron Microscope (SEM) Observation

Observation of non-conductive samples without deposition is possible! Scanning electron microscopy is ideal for surface observation of fibers and similar materials.

A "Scanning Electron Microscope (SEM)" is a device that irradiates and scans a finely focused electron beam on a sample, detects secondary and backscattered electrons, and displays their intensity as an image on a monitor to obtain magnified images of the object. Although it is not suitable for high magnification observation due to reduced image quality, it can use low vacuum mode, allowing for non-coating observation of difficult-to-conduct samples. [Observation Items] ■ Surface observation at magnifications of 5 to 300,000 times ■ Elemental analysis (B to U) using an energy-dispersive X-ray spectrometer (EDS) as an accessory ■ Element identification in micro-regions (qualitative and semi-quantitative analysis) *For more details, please refer to the catalog or feel free to contact us.

  • Analytical Equipment and Devices
  • Electron microscope

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Transmission Electron Microscopy (TEM) Observation

Electron microscope observation capable of identifying crystalline substances and analyzing crystal orientations! Applicable to all types of metallic materials.

The "Transmission Electron Microscope (TEM)" irradiates a sample with a high-voltage electron beam and obtains transmission electron images and electron diffraction patterns by magnifying the electrons that have passed through the sample using electromagnetic lenses. In transmission electron images, features such as grain boundaries, defects, strain, and the presence of precipitates can be observed, while electron diffraction patterns allow for the identification of crystalline materials and the analysis of crystal orientation. 【Features】 ■ Observation at magnifications from 1,000 to 1,000,000 times ■ Element identification in ultra-micro regions through EDS analysis (qualitative and semi-quantitative analysis of elements from C to U) ■ Identification of crystalline materials and analysis of crystal orientation *For more details, please refer to the catalog or feel free to contact us.

  • Analytical Equipment and Devices
  • Electron microscope

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Superior Corporation Business Introduction

We are striving for extreme business development in the fields of healthcare and information to meet the social needs of the 21st century!

Superior Co., Ltd. is a company that specializes in the manufacturing of special coils as a professional in precision winding, and also engages in the assembly of machinery, including the assembly of electron microscope units and ultra-precision assembly of semiconductor-related units. Additionally, we accept orders for integrated services from design to manufacturing of resin processing for cleaning tanks used in semiconductor manufacturing equipment and rationalization machinery and equipment. 【Business Activities】 ■ Special coil manufacturing ■ Machinery assembly ■ Resin processing related to industrial machinery ■ Precision parts processing *For more details, please refer to our catalog or feel free to contact us.

  • Inductor Coil
  • Electron microscope
  • Electron microscope

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Technical Information Magazine 202001-01 in-situ STEM

The technical information magazine The TRC News provides the latest information on analytical techniques that are useful for research and development, solving production troubles, and quality control.

**Abstract** In recent years, there has been a growing demand for high-sensitivity and low-power consumption devices, leading to increased attention on magnetic memory and magnetic sensors in the field of spintronics. These devices widely utilize the MTJ (magnetic tunnel junction) structure due to its ability to achieve high magnetoresistance effects. The MTJ structure consists of thin layered films on the order of a few nanometers, where the film thickness, roughness, and crystallinity at the atomic level significantly influence the properties. Additionally, since the magnetic characteristics change with annealing temperature, this paper presents a case study using in-situ TEM to analyze the changes in crystallinity and elemental distribution during heating at the nanometer level. **Table of Contents** 1. Introduction 2. Samples and Evaluation Methods 3-1. Changes in Crystallinity 3-2. Analysis of Crystal Orientation 3-3. Analysis of In-Plane Crystal Orientation 4. Conclusion 5. Acknowledgments 6. Closing Remarks

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  • Technical and Reference Books
  • Electron microscope

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Technical Information Magazine 201910-03 In-situ Heating Method

The technical information magazine The TRC News provides the latest information on analytical techniques that are useful for research and development, solving production troubles, and quality control.

**Abstract** Regarding the LIB positive electrode active material LiCoO2, gas analysis using TPD-MS and two in-situ heating methods (in-situ heating TEM) were employed to investigate the relationship between the gases emitted from LiCoO2 particles during heating and the changes in morphology, organization, and structure. The results demonstrated that gas generation is closely related to structural changes. Changes similar to charge-discharge behavior were also observed, and a series of measurements with temperature as a parameter provided important insights for analyzing actual materials. Additionally, it was shown that microscopic structural changes (such as the formation of domain structures), which cannot be detected without high resolution (approximately 40 nm field of view), can be visualized and quantitatively analyzed using ASTAR* (with *ASTAR being a registered trademark of NanoMEGAS) at a field of view of over 1 μm. **Table of Contents** 1. Introduction 2. Experimental Methods 3. Observation of Gas Generation Behavior Using TPD-MS 4. Observation of Structural Changes by in-situ Heating TEM 4-1. Observation of Morphological and Organizational Changes in STEM Images 4-2. Observation of Crystal Structure Changes in HRSTEM Images 4-3. Observation of Morphological, Organizational, and Structural Changes Above 650°C 5. Conclusion

  • Contract Analysis
  • Contract measurement
  • Technical and Reference Books
  • Electron microscope

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