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Heat dissipation board Product List and Ranking from 10 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

Heat dissipation board Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. ダイワ工業 Nagano//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. 共和産業 Aichi//Manufacturing and processing contract
  4. モリマーエスエスピー 本社 Osaka//Resin/Plastic
  5. 松和産業 本社 Mie//Electronic Components and Semiconductors
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Heat dissipation board Product ranking

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. Heat-dissipating substrate "DPGA" ダイワ工業
  2. [Examples of Using Mmems Substrates] High Thermal Dissipation Substrate for High Brightness LEDs 共和産業
  3. Release the heat - Matsuwa's heat dissipation board 松和産業 本社
  4. Proposal for thermal management and fanless heat dissipation structure using copper coin printed circuit boards. 沖電気工業 産業営業本部　産業営業統括室
  5. 4 Metal-based heat dissipation substrate with low thermal expansion coefficient 山下マテリアル

Heat dissipation board Product List

16～18 item / All 18 items

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Release the heat - Matsuwa's heat dissipation board

Release the heat - Matsuwa's heat dissipation board

Hot summer. Matsuwa's circuit boards are super COOL! Thick copper, metal, copper inlay boards, etc. For heat dissipation boards, please consult Matsuwa Industries.

Matsuwa Industries, renowned for its top-notch short delivery times in domestic printed circuit board manufacturing, offers a variety of heat dissipation boards with quick turnaround times. We pride ourselves on our flexibility, with a minimum order quantity starting from just one piece. If you have any issues related to heat dissipation boards, please feel free to consult us. 【Examples of Heat Dissipation Board Manufacturing】 - Thick copper boards (maximum copper thickness of 500µm) - Aluminum and copper base boards - Copper core boards - Copper inlay boards - Conductive paste resin-filled boards - High thermal conductivity materials - Ceramic boards - Thick copper FPC 【Examples of Short Delivery Manufacturing】 - Aluminum base boards: as fast as 2 days (standard 4 days and up) *For detailed services, please refer to the catalog available for download below.

  • Printed Circuit Board

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Proposal for thermal management and fanless heat dissipation structure using copper coin printed circuit boards.

Proposal for thermal management and fanless heat dissipation structure using copper coin printed circuit boards.

Mass production of copper coin printed circuit boards is possible for high-speed, high-frequency applications and high multilayer substrates. The unique copper coin structure achieves high heat dissipation.

Our company is capable of providing copper coin (heat dissipation structure) wiring boards. With the advancement of high-performance 5G communication devices, managing the heat generated by high-speed, high-frequency components has become a challenge. Additionally, as devices become more compact, semiconductors and electronic components are mounted on substrates at high density, and a fanless structure that eliminates fans and heat sinks within the device is required for low power consumption. Copper coin printed circuit boards can achieve an advanced "heat dissipation structure" that efficiently dissipates the heat generated by electronic components within a limited area. *Copper coin: A material shaped into a cylindrical form, significantly improving the thermal conductivity of the substrate compared to thermal vias. 【Features】 <Development> - Realization of embedding copper coins directly beneath heat-generating components on high-layer-count substrates. - Ensuring high reliability by embedding cylindrical copper using a unique method that minimizes load. - Dramatic improvement in the thermal conductivity of the substrate due to the copper coin structure. - Independently developed equipment for embedding copper coins, flexibly adapting to various coin sizes. - Comprehensive support for thermal simulation, prototyping, and mass production. - Capability for fanless housing design to achieve space-saving and high-efficiency heat dissipation. - Significant improvement in heat dissipation when used in conjunction with thermal management components such as heat pipes and thermal conductive sheets.

  • Circuit board design and manufacturing

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Heat dissipation substrate

Heat dissipation substrate

Cool down the substrate!

In printed circuit boards, heat dissipation measures have become a very significant issue. Our company offers various heat dissipation substrates, including metal bases, thick copper, copper inlays, conductive paste filling, and thermal conductive materials such as ceramics. Please feel free to contact us.

  • Printed Circuit Board

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