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Heat dissipation board Product List and Ranking from 11 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.

Heat dissipation board Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.

  1. ダイワ工業 Nagano//Electronic Components and Semiconductors
  2. モリマーエスエスピー 本社 Osaka//Resin/Plastic
  3. 松和産業 本社 Mie//Electronic Components and Semiconductors
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 4 共和産業 Aichi//Manufacturing and processing contract
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Heat dissipation board Product ranking

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.

  1. Heat-dissipating substrate "DPGA" ダイワ工業
  2. Proposal for thermal management and fanless heat dissipation structure using copper coin printed circuit boards. 沖電気工業 産業営業本部　産業営業統括室
  3. Release the heat - Matsuwa's heat dissipation board 松和産業 本社
  4. Heat dissipation substrate (aluminum, copper base, thick copper) 棚澤八光社
  5. 4 Heat dissipation (special) substrate for LED 名東電産

Heat dissipation board Product List

16～19 item / All 19 items

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[Information] Various Measures for Heat Dissipation in Circuit Board Design

[Information] Various Measures for Heat Dissipation in Circuit Board Design

Introducing new heat dissipation technology in circuit board design! It is already widely adopted in various mass-produced circuit boards.

The miniaturization of devices, the high-frequency characteristics of circuits, and the increase in the current being handled have led to concerns about heat generation from the devices and circuits mounted on the substrate. This document provides detailed information on substrate design techniques that can accommodate everything from small-scale prototypes to mass production. We explain various new technologies for heat dissipation measures in substrate design. We encourage you to read it. 【Contents】 ■ Trends in devices ■ High heat dissipation measures for specific devices ■ Improving heat dissipation with surface structures ■ Metal core and metal base substrates ■ Thick copper substrates *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board

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Semiconductor heat dissipation substrate for the purpose of exothermic and endothermic processes - Base plate [Heat sink]

Semiconductor heat dissipation substrate for the purpose of exothermic and endothermic processes - Base plate [Heat sink]

Adoption of precision total extraction mold! High accuracy in outer shape and hole pitch, improved finish on the burr surface and shear surface!

We handle "base plates" and "heat sinks." Thanks to our precision progressive dies, the accuracy of the outer shape and hole pitch has significantly improved, resulting in enhanced finish quality on both the edge and shear surfaces. With the adoption of progressive dies for coil materials, continuous processing is possible for thicknesses up to 5mm, contributing to lower costs and shorter delivery times. We also utilize UV printing. Additionally, we can accommodate micron-level flatness and specified warp processing, as well as resist baked printing. 【Features】 ■ High accuracy of outer shape and hole pitch due to precision progressive dies ■ Continuous processing of coil materials up to 5mm thickness with the use of progressive dies ■ Adoption of UV printing ■ Capability for micron-level flatness and specified warp processing ■ Support for resist baked printing *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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Heat dissipation substrate

Heat dissipation substrate

Cool down the substrate!

In printed circuit boards, heat dissipation measures have become a very significant issue. Our company offers various heat dissipation substrates, including metal bases, thick copper, copper inlays, conductive paste filling, and thermal conductive materials such as ceramics. Please feel free to contact us.

  • Printed Circuit Board

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Semiconductor heat dissipation substrate for the purpose of heat release and absorption [heat sink]

Semiconductor heat dissipation substrate for the purpose of heat release and absorption [heat sink]

The coil material for the heat sink can be continuously processed up to a thickness of 5mm by adopting a progressive die! This contributes to lower costs and shorter delivery times. Please feel free to consult with us.

Our company handles heat sinks (base plates). Thanks to precision progressive dies, the dimensional accuracy of the outer shape and hole pitch has greatly improved, resulting in significantly enhanced finish quality on both the edge and shear surfaces. The coil material can be continuously processed up to a thickness of 5mm due to the adoption of progressive dies, contributing to lower costs and shorter delivery times. We utilize UV printing. In addition to micron-level flatness and specified warp processing, we also support resist baked printing. 【Features】 ■ High dimensional accuracy of the outer shape and hole pitch due to precision progressive dies ■ Continuous processing of coil material up to a thickness of 5mm through the use of progressive dies ■ Adoption of UV printing ■ Capability for micron-level flatness and specified warp processing ■ Support for resist baked printing *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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