We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Heat dissipation board.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

Heat dissipation board Product List and Ranking from 10 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

Heat dissipation board Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. ダイワ工業 Nagano//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. 共和産業 Aichi//Manufacturing and processing contract
  4. モリマーエスエスピー 本社 Osaka//Resin/Plastic
  5. 松和産業 本社 Mie//Electronic Components and Semiconductors
Go to Company Ranking

Heat dissipation board Product ranking

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. Heat-dissipating substrate "DPGA" ダイワ工業
  2. [Examples of Using Mmems Substrates] High Thermal Dissipation Substrate for High Brightness LEDs 共和産業
  3. Release the heat - Matsuwa's heat dissipation board 松和産業 本社
  4. Proposal for thermal management and fanless heat dissipation structure using copper coin printed circuit boards. 沖電気工業 産業営業本部　産業営業統括室
  5. 4 Metal-based heat dissipation substrate with low thermal expansion coefficient 山下マテリアル

Heat dissipation board Product List

1～15 item / All 18 items

Displayed results
Technical documentation on "high heat dissipation of substrates" necessary for product miniaturization.

Technical documentation on "high heat dissipation of substrates" necessary for product miniaturization.

Handbook on 'Improving Heat Dissipation of PCBs' is now available! High heat dissipation of PCBs is essential for miniaturizing products! Includes advantages and disadvantages of using copper and aluminum.

In the miniaturization of products, enhancing the thermal dissipation of the substrate is essential. Heat sinks are used to improve thermal conductivity, but they take up extra space, which contradicts the goal of miniaturization. Meito Electric specializes in processing that improves the thermal dissipation of substrates by using aluminum and copper as conductors. ★ We have a proven track record in various fields, including automotive substrates and LED substrates! We are currently offering technical materials related to improving substrate thermal dissipation for free! These materials also include the advantages and disadvantages of substrates made from copper and aluminum. *If you would like the technical materials, please feel free to download them or contact us.

  • Contract manufacturing

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Heat-dissipating substrate "DPGA"

Heat-dissipating substrate "DPGA"

This is a substrate with unique high heat dissipation properties developed by Daiwa Kogyo Co., Ltd.

"DPGA" stands for "Daiwa Process Global Advance," which is a process developed independently by Daiwa Industrial that uses metal Cu bumps for interlayer wiring connections. A substrate with high heat dissipation characteristics enables high brightness and long lifespan of LEDs, as well as miniaturization of heat sinks. 【Features】 ○ Interlayer connection using metal pillars (copper bumps) → Achieves low resistance, high connection reliability, and high thermal conductivity ○ Copper bumps can be of any shape and size → For cylindrical shapes, diameters can range from 0.3 to 4.00 mm ○ Mixing of copper bumps of different sizes is possible ○ Improved thinness, lightness, and rigidity → Minimum board thickness: 0.3 mm, using prepreg for the insulation layer ○ Maximizes the functionality of LEDs → Ideal for LED substrates (liquid crystal panels, lighting) and automotive substrates For more details, please contact us or download the catalog.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[Examples of Using Mmems Substrates] High Thermal Dissipation Substrate for High Brightness LEDs

[Examples of Using Mmems Substrates] High Thermal Dissipation Substrate for High Brightness LEDs

A tall copper electrode can be created! The volume of the body has increased, allowing it to handle large currents.

As an example of the use of the "M-MEMS substrate," we would like to introduce the "High Heat Dissipation Substrate for High Brightness LEDs." The LED heat dissipation characteristics are significantly improved by the "M-MEMS substrate." It is possible to reduce the temperature rise by 10 to 40°C compared to conventional methods. Additionally, it can be formed on aluminum nitride, achieving an electrode thickness that allows for high thermal diffusion of 50 to 140 μm. We can also accommodate the special mounting needs of LEDs, so please feel free to consult with us. 【Features】 ■ Capable of handling large currents ■ Can be formed on aluminum nitride with excellent heat dissipation ■ Achievable electrode thickness that allows for high thermal diffusion (50 to 140 μm) ■ Achievable electrode gap that can accommodate narrow pitch LEDs (below 100 μm) ■ Capable of various prototypes, including special electrode structures *For more details, please refer to the PDF materials or feel free to contact us.

  • Processing Contract
  • Other contract services
  • Circuit board design and manufacturing

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
3D metal substrate, flexible heat dissipation substrate

3D metal substrate, flexible heat dissipation substrate

Industry first! We can manufacture bendable metal substrates!

Curved lighting substrates, LED lighting, and light source substrates that match the casing and design are optimal. It is possible to bend a single substrate to fit the curves of automotive and scooter turn signals and tail lamps. The basic specifications as a heat dissipation substrate are equivalent to those of standard aluminum substrates, with the added performance of being bendable, making it the latest metal substrate.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Heat dissipation (special) substrate for LED

Heat dissipation (special) substrate for LED

Heat-dissipating substrates and special substrates available! We develop products tailored to our customers' needs together.

Meito Electric Co., Ltd. is engaged in the development of LED products that are attracting attention as environmentally friendly lighting for the Earth. We offer not only LED lighting suitable for a wide range of applications, such as illuminated signs and indirect lighting for stores, but also various customized LEDs. Additionally, leveraging our expertise in circuit board manufacturing, we also design and manufacture metal heat dissipation substrates. Our company handles heat dissipation substrates, including metal base substrates (such as aluminum base substrates and copper base substrates), as well as substrates for special applications. We are committed to developing products in collaboration with our customers to meet their needs. For more details, please refer to our catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • LED Module

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Metal-based heat dissipation substrate with low thermal expansion coefficient

Metal-based heat dissipation substrate with low thermal expansion coefficient

For the electrical wiring in the engine room and the gasoline tank meter! Compared to glass epoxy substrates, it has a lower coefficient of thermal expansion and stronger resistance to heat.

The "metal-based heat dissipation substrate" is a substrate that improves heat dissipation through thermal conduction, alleviating thermal issues. There are applications in high-brightness LED lighting (for vehicles and floodlights), as well as in automotive electrical components, ECUs, EPS, and DC/DC converters. Compared to standard glass epoxy substrates, it has a lower thermal expansion coefficient and greater resistance to heat. 【Features】 ■ A substrate that improves heat dissipation through thermal conduction by using metal as the base ■ Compared to standard glass epoxy substrates, it has a lower thermal expansion coefficient and greater resistance to heat *For more details, please refer to the PDF materials or feel free to contact us.

  • 2021-05-10_11h12_04.png
  • 2021-05-10_11h12_09.png
  • 2021-05-10_11h12_12.png
  • Wiring materials

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Original DPGA (for high brightness and high heat dissipation LEDs)

Original DPGA (for high brightness and high heat dissipation LEDs)

Introducing a high thermal conductivity substrate that connects the LED heat dissipation pad and copper base through a copper bump.

The "Original DPGA (for high-brightness, high-heat-dissipation LEDs)" is a high-heat-dissipation substrate that connects the LED's heat dissipation pad to a copper base via copper bumps. Thanks to the high thermal conductivity of copper, it is possible to efficiently release the heat from high-brightness LEDs. The significant difference between aluminum substrates, CEM3 substrates, and DPGA substrates is that they connect directly to the LED heat dissipation pad, allowing for efficient heat dissipation. 【Features】 ■ Efficiently releases heat from high-brightness LEDs ■ High thermal conductivity of copper ■ Enables efficient heat dissipation *For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High Brightness High Current LED Heat Dissipation Substrate "MMMS Substrate"

High Brightness High Current LED Heat Dissipation Substrate "MMMS Substrate"

Achieving fine three-dimensional MEMS structures through plating! It realizes high heat dissipation and can accommodate large currents.

The "Mmemus substrate" is a heat dissipation substrate for high-brightness, high-current LEDs that integrates unique plating technology with MEMS technology to accommodate various electronic devices. It achieves fine three-dimensional MEMS structures through plating. Vertical fine plating with pattern widths of several tens of micrometers is possible using semiconductor photoprocessing. High-speed film formation through plating allows for the creation of fine three-dimensional thick film structures over 50μm in thickness, and by using a unique seed layer, high reliability is achieved. 【Features】 ■ Thick film structure unique to plating (over 50μm) ■ Dense, low-stress, and high adhesion is possible - Can be created on nitrogen aluminum substrates with excellent insulation and heat resistance ■ Achieves high heat dissipation and can handle high currents - Mounting substrates for LD/LEDs and power supply circuits - MEMS components such as micro springs/switches and package cap arrays *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Other contract services
  • Circuit board design and manufacturing

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Heat-dissipating substrate "Thick Copper Special Substrate"

Heat-dissipating substrate "Thick Copper Special Substrate"

A thick copper three-layer substrate with a total thickness of 0.35mm! Suitable for applications such as mobile phone camera flash substrates.

We handle "heat dissipation structure substrates" with built-in copper. We use a thick copper three-layer substrate (inner layer copper thickness 0.2mm, total board thickness 0.35mm) and ultra-thin PP (0.03mm). These are used for applications such as mobile phone camera flash substrates. 【Required Performance】 ■ Circuit and SR alignment tolerance of 0.04mm ■ Surface treatment for gold wire bonding (electroless NiPdAu plating) ■ Deviation tolerance between the outer shape centerline and the component pad centerline of ±0.075mm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other electronic parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High Heat Dissipation Substrate "High Precision Heat Dissipation Via"

High Heat Dissipation Substrate "High Precision Heat Dissipation Via"

We meet advanced requirements through the combination of high-precision machining and high heat dissipation structures!

Our company handles the heat dissipation substrate "High Precision Heat Dissipation Via." The applicable substrate methods include general through-hole TH, BVH, IVH, and build-up methods. The finishing plating options include electroless NiAu, bonding NiAu, and other impedance control solutions. By combining high-precision machining with a high heat dissipation structure, we meet advanced requirements. 【Features】 ■ Applicable substrate methods: Compatible with general through-hole TH, BVH, IVH, and build-up methods ■ Finishing plating: Electroless NiAu, bonding NiAu 　　　　　　　　Other impedance control compatible ■ Resin dam structure compatible with both high and low standards *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Heat dissipation substrate "Heat dissipation Via"

Heat dissipation substrate "Heat dissipation Via"

Multilayering of thick copper substrates is also possible! We can handle filling of blind vias and vacuum filling in-house.

Our company handles the heat dissipation substrate "Heat Dissipation Via." With the increasing heat generation due to the high performance and miniaturization of electronic components, there is a growing need for heat dissipation pathways that allow the heat generated by components to escape from the space to the pattern, in order to maintain the performance of electronic devices and extend their lifespan. We propose solutions to these issues as heat dissipation measures. It is also possible to create multilayer thick copper substrates, allowing for the development of new applications that have not been seen before. 【Features】 ■ Thick copper substrate with copper foil thickness of 210μm ■ Copper paste VIA hole filling (thermal conductivity 0.58–7.8W/mk) - Small diameter VIA φ 0.15 is supported, - Bottom-filled VIA hole filling can also be handled in-house with vacuum filling. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[Information] Various Measures for Heat Dissipation in Circuit Board Design

[Information] Various Measures for Heat Dissipation in Circuit Board Design

Introducing new heat dissipation technology in circuit board design! It is already widely adopted in various mass-produced circuit boards.

The miniaturization of devices, the high-frequency characteristics of circuits, and the increase in the current being handled have led to concerns about heat generation from the devices and circuits mounted on the substrate. This document provides detailed information on substrate design techniques that can accommodate everything from small-scale prototypes to mass production. We explain various new technologies for heat dissipation measures in substrate design. We encourage you to read it. 【Contents】 ■ Trends in devices ■ High heat dissipation measures for specific devices ■ Improving heat dissipation with surface structures ■ Metal core and metal base substrates ■ Thick copper substrates *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Semiconductor heat dissipation substrate for the purpose of exothermic and endothermic processes - Base plate [Heat sink]

Semiconductor heat dissipation substrate for the purpose of exothermic and endothermic processes - Base plate [Heat sink]

Adoption of precision total extraction mold! High accuracy in outer shape and hole pitch, improved finish on the burr surface and shear surface!

We handle "base plates" and "heat sinks." Thanks to our precision progressive dies, the accuracy of the outer shape and hole pitch has significantly improved, resulting in enhanced finish quality on both the edge and shear surfaces. With the adoption of progressive dies for coil materials, continuous processing is possible for thicknesses up to 5mm, contributing to lower costs and shorter delivery times. We also utilize UV printing. Additionally, we can accommodate micron-level flatness and specified warp processing, as well as resist baked printing. 【Features】 ■ High accuracy of outer shape and hole pitch due to precision progressive dies ■ Continuous processing of coil materials up to 5mm thickness with the use of progressive dies ■ Adoption of UV printing ■ Capability for micron-level flatness and specified warp processing ■ Support for resist baked printing *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Semiconductor heat dissipation substrate for the purpose of heat release and absorption [heat sink]

Semiconductor heat dissipation substrate for the purpose of heat release and absorption [heat sink]

The coil material for the heat sink can be continuously processed up to a thickness of 5mm by adopting a progressive die! This contributes to lower costs and shorter delivery times. Please feel free to consult with us.

Our company handles heat sinks (base plates). Thanks to precision progressive dies, the dimensional accuracy of the outer shape and hole pitch has greatly improved, resulting in significantly enhanced finish quality on both the edge and shear surfaces. The coil material can be continuously processed up to a thickness of 5mm due to the adoption of progressive dies, contributing to lower costs and shorter delivery times. We utilize UV printing. In addition to micron-level flatness and specified warp processing, we also support resist baked printing. 【Features】 ■ High dimensional accuracy of the outer shape and hole pitch due to precision progressive dies ■ Continuous processing of coil material up to a thickness of 5mm through the use of progressive dies ■ Adoption of UV printing ■ Capability for micron-level flatness and specified warp processing ■ Support for resist baked printing *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Heat dissipation substrate

Heat dissipation substrate

Achieving both heat dissipation measures for high-heat-generating components and ensuring transmission characteristics! Application to low-loss materials is also possible.

We create "heat dissipation substrates" that allow for the selection of substrate materials and configurations tailored to specific applications and heat dissipation challenges. Thick copper plated substrates form circuits for heat dissipation from heat-generating components directly to conductors and the back surface of the substrate through copper plating. In metal base substrates, a dielectric (insulation layer) and copper foil are laminated on copper or aluminum, and by connecting to copper or aluminum plates through filled vias, high heat dissipation is achieved. Additionally, we have extensive experience in the mechanical design and manufacturing of various heat dissipation carriers and enclosures, as well as the selection and assembly of heat sinks and TIM materials, allowing us to provide consistent support. 【Application Fields】 ■ High Frequency ■ Automotive ■ Power Modules ■ High Power LEDs ■ Inverters *For more details, please download the PDF or feel free to contact us.

  • 放熱基板2.png
  • 放熱基板3.png
  • Circuit board design and manufacturing

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Search Keywords Related to Heat dissipation board

COPYRIGHT © 2001-2025 IPROS CORPORATION ALL RIGHTS RESERVED.