We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Laser processing machine.
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Laser processing machine Product List and Ranking from 264 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Jan 28, 2026~Feb 24, 2026
This ranking is based on the number of page views on our site.

Laser processing machine Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jan 28, 2026~Feb 24, 2026
This ranking is based on the number of page views on our site.

  1. システムクリエイト Osaka//Industrial Machinery
  2. ランテクノロジー Kanagawa//Optical Instruments
  3. アマダ(アマダグループ) Kanagawa//Industrial Machinery
  4. 4 トロテック・レーザー・ジャパン 本社 Tokyo//Industrial Machinery
  5. 5 null/null

Laser processing machine Product ranking

Last Updated: Aggregation Period:Jan 28, 2026~Feb 24, 2026
This ranking is based on the number of page views on our site.

  1. Ultra-precision small fiber laser processing machine 'LTC6050' ランテクノロジー
  2. I tried engraving on five different types of metal! システムクリエイト
  3. I tried changing the maximum output to three levels and irradiating it! システムクリエイト
  4. 4 Yamanaka Manufacturing Co., Ltd.
  5. 5 Amada's domestic exhibition facility アマダ(アマダグループ)

Laser processing machine Product List

571~600 item / All 766 items

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YOSHIMI's "Production Process"

Creating things with the sense of making plastic models utilizing networks.

YOSHIMI's manufacturing utilizes 3D models from programming to inspection, allowing us to create products with the same feeling as building plastic models. 【Manufacturing Process】 1. Order processing in production management software 2. Sheet metal unfolding alongside 3D models 3. Pursuit of optimal nesting efficiency 4. Automatic operation of punch-laser hybrid machines, material supply, and product retrieval 5. Cost performance and quality with NT benders 6. Welding assembly based on assembly drawings We can receive and unfold 3D CAD data! ■ Equipped with 3D design CAD as a base ■ Compatible with all customer CAD systems ■ Capability assessment for processing ■ Automatic creation of drawings ■ 2D drawings converted to 3D etc… Feel free to consult us about any drawing-related matters! Additionally, to meet customer demands, we have introduced the Flying Optics Laser Machine "FO-MII 3015 NT." We provide high-quality, beautiful laser processing. *For more details, please contact us or download the PDF materials for more information.

  • Contract manufacturing
  • Processing Contract
  • Other metal materials
  • Laser processing machine

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[Sample processing available] Laser processing "Laser Clean Cut"

The processed cross-section can be cut cleanly and is close to the color of the base material, eliminating the need for post-processing or pickling. It is resistant to rust and allows for a smooth transition to secondary processing!

Sankou Seisakusho Co., Ltd.'s "Laser Clean Cut" is an oxidation-free cutting process where specialized craftsmen carefully work on each surface of materials such as stainless steel and aluminum alloys, achieving a clean cut that closely matches the color of the base material. 【Features】 ■ Careful workmanship ■ Strong protection ■ Beautiful finish ■ Materials can be protected and delivered upon request *For more details, please download the PDF or feel free to contact us.

  • Plastic processing machines (cutting and rolling)
  • Other processing machines
  • Laser marker
  • Laser processing machine

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Pearl Light Industrial Co., Ltd. Business Introduction

Consistent production with well-equipped facilities! Leave your metal processing needs to us!

At Pearl Light Industry Co., Ltd., we engage in 2D and 3D laser processing, as well as precision sheet metal and can manufacturing. Through collaboration with our own factory and related companies, we provide a one-stop service from heat treatment such as hardening and tempering to bending and welding processing. We eliminate the need for saw orders, achieving reductions in your time and costs. 【Features】 ■ 2D laser processing accommodating from 28mm to 0.1mm ■ Bending processing with no variation in quality ■ YAG and semiconductor lasers for minimal distortion in finishing *For more details, please download the PDF or feel free to contact us.

  • Processing Contract
  • Laser processing machine

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Introduction to 3D Laser Processing

Supports various sizes and shapes! 3D laser processing with freely customizable shapes.

Nikken Sangyo Co., Ltd. offers "3D Laser Processing," which realizes the reduction of material waste with optimal processing programs tailored to material shapes. Equipped with a 3D laser head that can handle complex processing, it also contributes to the expansion of product variations through tapping. Additionally, the automatic focal position adjustment function calculates the optimal focal position, enabling high-precision and quick processing of complex shapes. 【Features】 ■ Achieves laser processing at high speed and optimal conditions ■ Tapping processing is also possible (maximum tap M12) ■ High-precision integrated processing from laser processing to tapping ■ Reduces material waste with optimal processing programs tailored to material shapes ■ Streamlines handling by processing a series of operations in one go, ensuring speed *For more details, please download the PDF or feel free to contact us.

  • Processing Contract
  • Laser processing machine

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UV laser processing machines (nanosecond, picosecond, etc.) 【contract processing, equipment sales】

Equipped with a high-speed UV oscillator with a wavelength of 355nm! A laser processing machine that also supports ultra-small diameter processing from 10μm to 30μm.

The "Vela UV" is a laser processing machine equipped with a high-speed UV oscillator operating at a wavelength of 355nm. It performs high-speed, high-precision micro-diameter processing of printed circuit boards and other materials. Additionally, it allows for the selection of suitable laser sources based on materials and purposes. The two-axis configuration enables high-speed processing of two workpieces simultaneously. 【Features】 ■ Ability to select suitable laser sources based on materials and purposes ■ High-speed processing of two workpieces simultaneously due to the two-axis configuration ■ Capable of micro-diameter processing from 10μm to 30μm ■ Comfortable operability with in-house developed CNC ■ Support for test processing ■ Contract processing and equipment sales *For more details, please refer to the PDF document or feel free to contact us.

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  • Other processing machines
  • Laser processing machine

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CO2 Laser Processing Machine [Contract Processing and Equipment Sales]

Comfortable operability with in-house developed CNC! CO2 laser processing machine.

The "CO2 Laser Processing Machine" achieves low power consumption through a design that eliminates waste. It supports various surface treatments such as blackening, browning, and untreated, as well as various processing methods like DLD and Conformal Mask. It offers comfortable operability with our in-house developed CNC. 【Features】 ■ Achieves low power consumption through a design that eliminates waste ■ Supports various surface treatments (blackening, browning, untreated) ■ Supports various processing methods (DLD, Conformal Mask, Resin Direct) ■ Comfortable operability with our in-house developed CNC ■ Contract processing and equipment sales *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Laser processing machine

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Invitation to Exhibit at the 2019 Total Solutions for Electronic Devices Exhibition

Exhibition of CO2 and UV laser processing technology, hole drilling and contour processing machines, fully automatic AOI, and X-ray inspection equipment.

The Daifune Group is engaged in the manufacturing and sales of drilling machines and profile processing machines, as well as contract processing using various laser processing machines. At the "Total Solutions for Electronic Devices Exhibition 2019," starting on June 5, we will introduce our unique processing technologies and drilling/profile processing machines. We will also display actual models of fully automatic AOI and X-ray inspection equipment, and provide detailed explanations of the features of each product. [Exhibition Content] ■ CO2 and UV laser processing (we also accept prototypes for 5G laser processing) ■ Drilling machines and profile processing machines (processing technology for base stations, communications, and automotive substrates) ■ Fully automatic AOI (also for labor-saving, IoT, inline, and cloud applications) ■ X-ray inspection equipment (for multilayer boards) *You can view related product materials from the "PDF Download" section.

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  • 全自動AOIvr2.jpg
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  • Exhibition planning/construction
  • Laser processing machine

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Introduction to examples of inner layer copper foil machining.

【Example of Inner Layer Copper Foil Engraving】 In semi-flexible substrates, high precision depth accuracy is required from the inner layer copper foil, and we will introduce examples of such processing.

In semi-flexible substrates, high precision depth accuracy is required from the inner layer copper foil. By using our touch-type engraving mechanism and accurately detecting the target copper foil position, we can achieve high-precision engraving processing.

  • Circuit board processing machine
  • Laser processing machine

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CO2 Laser Processing [Cu Direct Blind Hole Processing Results]

Focus on the micro-diameter processing capability of CO2 lasers and the technology for controlling resin diameter.

1. Cu Direct BH Processing Results ■No.1: Example of untreated substrate Cu direct micro-diameter processing Hole diameter φ30–60μm ■No.2-1: Improvement in quality and productivity of Cu direct φ70μm processing ■No.2-2: Improvement in quality and productivity of Cu direct φ100μm processing

  • Circuit board processing machine
  • Laser processing machine

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CO2 Laser Processing [ABF Resin Direct Processing Results]

■ The densification of package substrates is progressing, and there is a demand for miniaturization using CO2 lasers. ■ Introducing examples of miniaturization processing using our VELA machine.

ABF Resin Direct Processing Results ■No.1-1: Resin Direct (ABF GZ41 t32.5μm) Hole diameter φ30–50μm ■No.1-2: Resin Direct (ABF GZ41 t32.5μm) Hole diameter φ60–120μm ■No.2-1: Resin Direct (ABF Development Product t32.5μm) Hole diameter φ30–50μm ■No.2-2: Resin Direct (ABF Development Product t32.5μm) Hole diameter φ60–120μm

  • Circuit board processing machine
  • Laser processing machine

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[Contract Processing] CO2/UV Laser, Drilling, Router *Processing Examples

We also support processing of 5G and IoT-related materials! We can propose technical solutions based on your needs, such as processing with laser composites or performing high-precision back drilling.

Our company specializes in contract processing of printed circuit boards used in 5G, IoT, automotive, HDI, Mini-LED, and base stations. We possess UV/CO2 laser processing machines capable of ultra-small diameter processing, as well as drilling machines and router processing machines. By combining these, we can propose processing technologies for printed circuit boards tailored to your needs. We also accept technical consultations and development regarding processing methods, and we handle various inspection devices (such as Hall AOI and circuit AOI). 【Examples of Processing Materials】 PTFE-based, FR-5-based, PPE/PPO-based, R-5515, R-1566, MEG6, MEG7, MEG8, RO4350B, RO3003G2, etc. 【If you have the following requests, please feel free to consult with us】 - I want to process using CO2/UV or other lasers (processing with CO2/UV or PICO/femtosecond lasers, etc.) - I want to process new materials or difficult-to-process materials (ABF materials, Rogers materials, MEGTRON materials, glass materials, etc.) ★ We are also conducting test processing! If you are interested, please apply through the inquiry form. *We are currently offering materials that introduce processing examples.

  • Processing Contract
  • Laser processing machine

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Laser processing machine - multipurpose single-axis laser processing machine

Multipurpose 1-axis laser processing machine! Development of processing technology for new materials and sales of production machines (custom-made available).

The multi-purpose single-axis laser processing machine was first exhibited as a real machine at "JPCA 2022" by the Japanese company Ofuna. Customers can choose the laser oscillator and table specifications according to their processing applications and materials, allowing for custom-made solutions. We own various types of multi-purpose single-axis laser processing machines, including UV (nanosecond, picosecond) and CO2, enabling us to provide consistent support from the development of processing technology for new materials to the sale of production machines. ■ Examples of processing with UV laser Processing of micro-diameter holes in ABF material (package substrate), processing of micro-diameter holes in PI material (flexible substrate), small-diameter hole processing of SI wafers and ceramics, cutting of Cu/PP multilayer boards, cutting of Cu/LCP double-sided boards, etc. ■ Examples of processing with CO2 laser TH processing of Cu 2um double-sided boards, BH processing of Cu 2um multilayer boards, and new materials compatible with high frequency and 5G such as fluororesin, liquid crystal polymer, and PPE resin. *For more details, please refer to the PDF materials or feel free to contact us. *There are also various examples of processing applications, so please check the PDF materials.

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  • Other processing machines
  • Laser processing machine

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CO2 Laser Processing Example: Package Substrate Processing

Case study of small diameter hole drilling for package substrates

Using our unique technology, we can ensure high-quality hole shapes and achieve the desired taper rate. This document details the processing of materials with a thickness of 32.5μm using a CO2 laser, down to a minimum diameter of φ30μm.

  • Processing Contract
  • Laser processing machine

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CO2 Laser Processing Example_Cu Direct TH Processing

Cu Direct Double-Sided Through Hole Processing

In a case where through-hole processing was performed on a double-sided plate with a thickness of φ2μm using a CO2 laser processing machine, we control the cross-sectional shape of the through-holes according to the customer's needs using our unique technology.

  • Processing Contract
  • Laser processing machine

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CO2 Laser Processing Example_Cu Direct BH Processing

Cu Direct Blind Processing Examples

This is an example of using our equipment's unique features to ensure high-quality hole shapes and aim for a reduction in the number of shots. In this document, we have achieved a reduction from the usual 4 shots to 3 shots by utilizing these unique features.

  • Processing Contract
  • Laser processing machine

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UV & CO2 Laser Processing Case Study: Composite Processing of Cu + PP Materials

Case study of UV and CO2 laser hybrid processing of Cu+PP materials

Our company has two types of processing technologies, UV and CO2, and by combining the advantages of these lasers, we are able to achieve high-quality laser drilling that reduces the burden of subsequent processes. This document discusses the processing of multilayer boards, and to avoid damaging the inner copper foil, we perform resin processing with CO2 after drilling, followed by UV processing to remove residues at the bottom of the holes.

  • Processing Contract
  • Laser processing machine

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UV Laser Processing Examples: SI Wafers, Ceramics, Glass, etc.

Examples of UV laser processing applications for various materials.

Our company sells in-house developed laser processing machines (from CO2 lasers to nanosecond, picosecond, and femtosecond UV lasers), and we accept contract processing from test processing for product machining technology development to small-scale production sales during our customers' initial development stages. This document includes processing examples of SI wafers, ceramics, multilayer boards, and double-sided boards using picosecond lasers.

  • Processing Contract
  • Laser processing machine

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UV Laser Processing Example: Package Substrate

Examples of micro-diameter hole processing for package substrates

Using the top-hat beam with a minimum beam diameter of φ10μm or less from our UV laser processing machine, we achieve high-quality drilling with a steep taper. This document includes processing examples with a minimum diameter of φ20μm for package material with a thickness of t25μm and a minimum diameter of φ10μm for package material with a thickness of t10μm.

  • Processing Contract
  • Laser processing machine

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UV Laser Various Processing Examples

We offer a wide range of services from the sale of UV laser processing machines to initial development and contract processing for small-scale production!

Our company sells laser processing machines developed in-house, and we also accept contract processing from prototypes to mass-produced products. We specialize in technological development, so we can handle everything from the development of processing methods for new materials and products to contract processing and manufacturing sales of mass-produced items. Please feel free to consult with us.

  • Processing Contract
  • Laser processing machine

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CO2 Laser Processing Examples

We offer a wide range of services from the sale of CO2 laser processing machines to initial development, contract processing for small-scale production, and manufacturing sales.

We sell our own developed laser processing machines, but we also accept contract processing from development products to mass-produced items. We specialize in technological development, so we can handle everything from the development of processing methods for new materials and products to contract processing of mass-produced items and the manufacturing and sales of equipment. Please feel free to consult with us.

  • Processing Contract
  • Laser processing machine

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New 4-beam CO2 laser processing machine for package substrates

A new type of CO2 laser processing machine for PKG materials that quickly processes at high speed with four beams.

The manufacturing of electronic circuits for CPUs, which are becoming increasingly miniaturized, requires more precise processing. Therefore, the selection of processing machines is crucial, with quality and productivity being important factors. The "ECO-TL4C" from Ofuna Corporation Japan is a new type of CO2 laser processing machine that enhances the processing quality of substrate materials for packaging, including interlayer insulating film materials, through its unique functions, enabling efficient processing with two tables and four beams.

  • Other semiconductor manufacturing equipment
  • Laser processing machine

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Nishida Techniques Co., Ltd. Business Introduction

Leave it to us for laser processing, three-dimensional laser, bending processing, TIG welding, argon welding, and MIG welding.

Nishida Giko Co., Ltd. specializes in sheet metal processing, focusing on laser processing, bending processing, turret punching, precision sheet metal processing, TIG welding, and spot welding. We can accept orders for integrated production. You can entrust us with everything from design and setup to material procurement, processing (sheet metal and welding), surface treatment, assembly, inspection, and shipping. We also accommodate a wide range of production volumes, from small lot production (1 or 2 pieces) to mass production (10,000 pieces), and we are open to consultations for both large and small items. 【Business Activities】 ■ Laser Processing ■ Bending Processing ■ Turret Punching ■ Welding *Please feel free to contact us for more details.

  • Processing Contract
  • Laser processing machine

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Horie Limited Company - Business Introduction

We use laser cutting machines and water jets to cut shapes according to customer specifications.

At Horie Co., Ltd., we can process various materials with thicknesses ranging from 1mm to 150mm using laser cutting machines and water jets on both axes. Not only cutting, but we also utilize bending, tapping, welding, and other techniques to accommodate any shape according to the customer's conditions and applications. Additionally, we manage the entire process from order to delivery through our network, achieving short lead times and high quality. 【Features】 ■ Achieved cutting thickness: 140mm ・ Can cut up to a maximum of 160mm ■ Processing size: 1220mm x 2440mm ・ Maximum processing water pressure: 400MPa ・ Complex shapes are acceptable *For more details, please download the PDF or feel free to contact us.

  • Plastic processing machines (cutting and rolling)
  • Processing Contract
  • Laser processing machine

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Thick plates, aluminum, copper, and brass can also be processed! 3D fiber laser processing machine.

We own an AMADA laser processing machine, which has only a few examples of implementation in the country. It is capable of processing thick plates and materials that are difficult to handle with CO2 laser processing machines.

In sheet metal processing, cutting of metal sheets (trimming, piercing, etc.) is typically done using molds or CO2 laser processing machines. However, with the practical application of fiber lasers, which offer high productivity and energy efficiency, there is a shift from CO2 lasers. While processing with fiber lasers is becoming mainstream for two-dimensional work, there are still very few fiber laser processing machines capable of three-dimensional processing available domestically, making them quite rare. 【Features】 - Suitable for trimming and hole drilling of formed products such as automotive, agricultural machinery, and construction components. - Capable of high-speed and high-precision cutting of difficult materials such as ultra-high-strength steel plates, hot-stamped materials, and thick plates. - High beam focusability allows for a smaller focal diameter, enabling high-speed, high-precision processing with minimal distortion. - Easily handles high-reflective materials and non-ferrous metals such as aluminum, titanium, stainless steel, copper, and brass.

  • Processing Contract
  • Laser processing machine

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Suenami Industrial Co., Ltd. Main Equipment

We have TIG welding machines, YAG welding machines, and semi-automatic welding machines! Welding is possible according to material and application.

Suenami Industries offers laser processing (capable of clean cuts), turret punch processing, bending processing, and various types of welding. We possess equipment such as the "AP100," which connects drawings to processing, as well as the laser and turret punch combination machine "LC 2012 C1," and "FaB2530・HG5020," "Tig・YAG・semi-automatic," among others. Additionally, we collaborate with partner companies to provide services such as plating, painting, anodizing, barrel polishing, and electrolytic polishing. Please feel free to consult with us. 【Main Equipment】 ■AP100 ■LC 2012 C1 ■FaB2530・HG5020 ■Tig・YAG・semi-automatic *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Laser processing machine

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Laser processing

We can quickly respond to a wide range of products with various materials and thicknesses, including spacers made from sintered copper!

Brooch Grinding Industry introduced laser processing alongside electric discharge machines from the early days of their widespread use. Since then, we have built a track record of 30 years. We specialize in processing hardened steel plates and differentiate ourselves from other companies through our unique condition adjustments. We offer high-speed processing for materials up to 12mm thick. We can quickly respond to a wide range of materials and thicknesses, including spacers made from hardened copper. We are also flexible in accommodating urgent needs. 【Features】 ■ Unique adjustments of processing conditions for hardened steel ■ High-speed processing for thicknesses up to 12mm ■ Capable of proposing processing methods tailored to wire, laser, and specific applications *For more details, please refer to the PDF document or feel free to contact us.

  • Plastic processing machines (cutting and rolling)
  • Other processing machines
  • Laser processing machine

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Case Study of Production Using New Processing Methods for Shaped Steel and Pipe: Food Machinery Framework

Using a fiber laser processing machine for pipe processing! Reducing man-hours for temporary assembly adjustments and correction work.

It is common for the frames of food machinery to be made using pipe materials. However, the precision of pipes is not very high, making it difficult to cut them accurately, and there are various challenges such as the long processing time due to the large number of machining steps. By using a fiber laser processing machine for pipe processing, it becomes possible to cut complex shapes, reducing the man-hours required for temporary assembly adjustments and correction work. Furthermore, by incorporating mortise groove shapes and cutting parts in an integrated form, it is possible to reduce the number of welding points and shorten finishing work. [Challenges] ■ The precision of pipes is not very high, making accurate cutting difficult. ■ The large number of machining steps results in longer processing times. ■ Positioning by marking during temporary assembly before welding is challenging. ■ Welding with round pipes requires high skill levels. *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Laser processing machine

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Incorporated Company Ing - Business Introduction

We offer integrated production for laser processing, bending, welding, and more!

Our company specializes in precision sheet metal processing, including laser processing, NCT processing, bending processing, and various types of welding. By combining advanced equipment with the knowledge and experience of skilled craftsmen, we strive to deliver high-quality products with "high quality," "short delivery times," and "low prices," ensuring customer satisfaction. We cater to the diverse needs of various industries, including parts for industrial equipment, railway components, and medical device parts, offering small lot production of various types. Please feel free to consult with us. 【Sales Items】 ■ Precision Sheet Metal Processing - Laser Processing - NCT Processing - Bending Processing - Various Types of Welding - Shot Blasting Processing *For more details, please download the PDF or feel free to contact us.

  • Processing Contract
  • Other machine elements
  • Laser processing machine

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LDF Corporation Business Introduction

Specialists in manufacturing provide carefully selected equipment, know-how, information, and connections.

LDF Corporation provides not only laser processing machines but also manufacturing equipment and laser processing materials. In addition to our main product line of small and medium-sized carbon dioxide lasers, we are focusing on fiber laser markers with high quality and price competitiveness, as well as fiber laser processing machines capable of metal cutting, effectively anticipating market needs. 【Business Activities】 ■ Sales and technical services of laser processing equipment ■ Sales of laser processing materials ■ Contract laser processing ■ Design and planning development of laser processing-related materials and products *For more details, please download the PDF or feel free to contact us.

  • Laser marker
  • Processing Contract
  • Rental/lease
  • Laser processing machine

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Metal and Resin Marking "LDF-FC Series"

By removing the side panel, long materials can also be processed!

The "LDF-FC Series" is an all-in-one fiber laser marking system. It can mark a wide variety of materials including stainless steel, aluminum, brass, silver, titanium, polycarbonate, ABS, and many others. Additionally, by removing the side panels, it is possible to process longer materials. With a complete one-year warranty after purchase and a three-year parts warranty, you can use it with peace of mind for a long time. 【Features】 ■ Laser protective glass ■ Automatic height-adjustable processing table ■ One-touch focus positioning ■ LED internal lighting ■ Easy-to-use input and editing software Ez-CAD included *For more details, please refer to the PDF materials or feel free to contact us.

  • Laser marker
  • Other markings
  • Laser processing machine

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