We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Wire Bonder.
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Wire Bonder Product List and Ranking from 7 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

Wire Bonder Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. カイジョー ODM事業部 Tokyo//Industrial Electrical Equipment
  3. 兼松PWS Kanagawa//Industrial Machinery
  4. 4 超音波工業 Tokyo//Industrial Electrical Equipment
  5. 5 ハイソル Tokyo//Electronic Components and Semiconductors

Wire Bonder Product ranking

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Latest wire bonder with wire monitoring function
  2. Semiconductor assembly equipment Wire Bonder FB-900 カイジョー ODM事業部
  3. Ultrasonic Wire Bonder REBO-9 超音波工業
  4. 75um wire diameter compatible high-speed wire bonder for discrete applications
  5. 4 MPP Corporation's "Manual Wire Bonder iBond5000 Series" 兼松PWS

Wire Bonder Product List

16~21 item / All 21 items

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Rotary Head Bonder REBO-9T

Significant improvements in recognition capabilities will contribute to the increased operational efficiency of the production line.

- Expanded the bonding area in the Y direction by 70mm, enabling support for wide bonding. - Integrated two heads to achieve space-saving. - Capable of accommodating various wire diameters through kit replacement.

  • Other semiconductors

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MPP Corporation's "Manual Wire Bonder iBond5000 Series"

Over 9,000 units delivered worldwide! Bonding is possible with just a click of the mouse. Compact and effective for research and development as well as small-scale production.

The "Manual Wire Bonder iBond5000 Series" is a successor to the "4500 Series," which boasts over 400 units delivered domestically. (The 5000 Series has over 9,000 units delivered worldwide.) Bonding can be easily performed with just a click of the mouse. Its compact size makes it suitable for research and development as well as small-scale production. You can choose from three models: "for Ball Bonding," "for Wedge Bonding," and "for Both Ball and Wedge Bonding." 【Features】 ■ Equipped with a user-friendly touch panel ■ Y-axis table motion settings can be configured with parameters, making bonding of pitch wires and parallel wires easy ■ Ergonomically designed ■ ESD coating is standard *For more details, please refer to the materials. Feel free to contact us with any inquiries.

  • Other processing machines
  • Bonding Equipment

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Ultrasonic Thermal Pressing Wedge Wire Bonder Model 7600D

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally.

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally. Our company has also been the exclusive distributor for West Bond in Japan for over 40 years, handling import, sales, and support. Among our products, the model 7476D has a proven track record of numerous installations in government agencies, universities, and various research institutions, and its operability using the patented new mechanism X-Y-Z 3-axis manipulator has received high praise from users. We would be grateful if you would consider it as a highly versatile manual wedge wire bonder that can meet diverse needs.

  • Steel

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Semiconductor assembly equipment Wire Bonder FB-780

Capable of supporting small-lot production of multiple varieties, contributing to increased productivity.

Fine pitch, stacked IC Fully automatic wire bonder compatible with all cutting-edge devices.

  • Other semiconductor manufacturing equipment

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