Matsumoto kakou Co.,Ltd. Product Lineup

The "MK700H" is a dedicated low-pressure molding machine for hot melt, with the maximum mold dimensions expanded to 300×200×150 (mm) and an enhanced clamping force of 75kN. This allows for the molding of larger insert works and molds with a high number of cavities, which were difficult to mold with the "MK600" and "MK520." By completing parts procurement and assembly within China, it achieves an astonishingly low price despite using a dual gear pump type for the discharge mechanism. By separating the workstation and melter, it also allows for customization, such as adding an injection nozzle. 【Features】 ■ Supports large area products ■ Low cost ■ Uses reliable OMRON products for PLC/HMI ■ High layout flexibility *For more details, please refer to the PDF materials or feel free to contact us.

The "MK600" is a compact low-pressure molding machine dedicated to hot melt, with a footprint of 900×1,200 mm. By eliminating heat hoses, which can cause material degradation and pressure loss, it establishes excellent productivity. It is covered on three sides (back and sides), and an area sensor is installed on the operator's side. By completing parts procurement and assembly within China, we have achieved an astonishing price for a dual gear pump type discharge mechanism. 【Features】 ■ Excellent safety ■ Hose-free ■ Low cost ■ Compact size ■ Uses reliable OMRON products for PLC/HMI *For more details, please refer to the PDF document or feel free to contact us.

The MK520 is a low-pressure molding machine specifically designed for hot melt applications. By adopting a shuttle stage, it allows for molding to be performed in parallel with work set and work retrieval operations, achieving high productivity. Additionally, the injection system does not use heat hoses, which can cause material degradation and pressure loss, enabling precise injection control. 【Features】 ■ Excellent production capacity ■ Hose-free heating ■ Low cost ■ Parts procurement and assembly completed within China ■ Uses reliable OMRON products for PLC/HMI *For more details, please refer to the PDF materials or feel free to contact us.

The "MK-MELTER" is a hot melt melter that employs a dual gear pump, enabling stable discharge volume control while achieving an astonishingly low price. It uses pneumatic control for hydraulic pressure, allowing the hydraulic pressure to be controlled by the pressure of the air supplied externally. You can choose from five tank capacities: 3L, 5L, 10L, 15L, and 20L, according to the amount of hot melt used. Additionally, it can be used as a standalone unit, and it is designed to allow for pump rotation speed control and heater ON/OFF via external input. 【Features】 ■ Low cost ■ High versatility ■ Optimized design for hot melt molding applications ■ Tank capacity can be selected according to usage conditions *For more details, please refer to the PDF document or feel free to contact us.

The "MK10" is a manual hot melt molding machine. By minimizing movable parts, it achieves both low cost and safety. It can mold two types of molds alternately, resulting in high productivity. It is suitable for applications such as harness bush processing, and various customizations are possible according to customer requirements. 【Features】 ■ High productivity is achieved by molding two types of molds alternately. ■ Low cost and safety are balanced by minimizing movable parts. ■ The melter can be combined from low-cost types to high-end specifications. ■ The molding stage has high flexibility with left, right, and front three-sided openings. ■ Various customizations are possible according to customer requirements. *For more details, please refer to the PDF document or feel free to contact us.

Hot melt molding, which is expanding its adoption for waterproof applications in electrical components. The MK series from Matsumoto Processing is a molding machine developed specifically for hot melt molding. It is compact and user-friendly, and has been introduced in many customers' factories. Additionally, we can accommodate customization and dedicated design of equipment according to customer requirements. Furthermore, we also support automation, including fully automatic inline machines. ◆ We have various devices on display at our prototype lab in Fuji City, Shizuoka Prefecture. Customers wishing to visit should contact us.

We will provide a sample of a 20×20mm substrate (with LED) molded and sealed with amber/black polyamide-based hot melt free of charge. Please feel free to check the texture in person. Additionally, a movie of the production of this sample is currently available on the YouTube video below. If you would like a sample, please do not hesitate to contact us. What is "hot melt molding"? It is a sealing method that uses a solvent-free, one-component thermoplastic adhesive to insert mold electronic components within a mold. It excels in environmental resistance characteristics such as waterproofing, dustproofing, and insulation, and it solidifies in a short time of just a few seconds, leading to its expanding adoption as a sealing method alternative to potting. Furthermore, the materials used in this method are primarily derived from natural fatty acids sourced from grains, making it an environmentally sustainable method. Examples of applications: - Automotive electronic components (interior/exterior of vehicles) - Electronic components for power tools - Electronic components for industrial equipment - Various sensors, switches, etc. - Components for outdoor equipment (such as agricultural machinery)

"Hot melt molding," which is attracting attention as a sealing method to replace potting for the purpose of waterproofing and dustproofing electrical components, has been expanding its adoption starting with automotive parts around 2010 and into various electrical components. We will be introducing various case studies at the "38th Monozukuri World Tokyo" held at Tokyo Big Sight. We sincerely invite you to visit us. We look forward to seeing you there. Event Dates: July 1 (Wed) - 3 (Fri), 2026, 10:00 AM - 5:00 PM Venue: Tokyo Big Sight (International Exhibition Center) Booth Number: East Hall - E25 (within the Shizuoka Prefecture company booth)

This is a next-generation sealing technology that imparts excellent environmental resistance, such as waterproofing and dustproofing, to various electronic components like circuit boards and sensors by low-pressure insert molding with hot melt thermoplastic adhesives. Compared to conventional methods like potting, it simultaneously achieves "shortened tact time," "reduced number of components," "miniaturization and weight reduction," and "lower defect rates," leading to its expanding adoption in various fields as a next-generation sealing technology. 【Adoption Fields】 - Automotive interior and exterior electronic components for four-wheeled and two-wheeled vehicles - Interior and exterior electronic components for working vehicles such as agricultural and construction machinery - Electronic components for industrial equipment, FA devices, and robots - Electronic components for home appliances and consumer devices - Electronic components for infrastructure equipment - Electronic components for outdoor working machinery and power tools - Electronic components for communication devices like 5G and LPWA etc. 【Adoption Examples】 - Waterproof sealing of automotive interior and exterior electronic components (circuit boards, sensors, harnesses, switches, etc.) - Waterproof and dustproof sealing of electronic components in FA equipment (circuit boards, sensors, etc.) - Waterproof sealing of control boards for power tools - Sealing of industrial communication and IoT devices - Waterproof sealing of various sensors, such as gas sensors and angle sensors etc. The sealing technology is expanding its adoption in various fields as a replacement for potting!

A groundbreaking sealing method for waterproofing and dustproofing electronic components【Hot Melt Molding】 rapidly solidifies in just a few seconds, allowing for quick transition to the next process. Its high degree of freedom in shape and potential for miniaturization and lightweight design have led to its increasing adoption as an alternative method to two-component potting materials like urethane and epoxy. At Internepcon Japan (Autumn), we will showcase many products that have actually adopted this method. We look forward to your visit. ↓↓Exhibition Information↓↓ Internepcon Japan Autumn Venue: Makuhari Messe Dates: September 9 (Wednesday) to September 11 (Friday), 2026 ★★We sincerely await your visit.★★

Hot melt molding is a low-pressure molding method aimed at waterproofing, dustproofing, and insulation of electrical components. In traditional two-component potting methods such as urethane and epoxy, production delays due to curing time and the need for securing workspace were challenges. This method allows the resin to rapidly cure in just a few seconds to several tens of seconds, enabling the product to flow to the next process immediately after sealing, thereby improving production efficiency and reducing costs on the manufacturing line. It is used in automotive electrical components, sensors, and IoT devices, and is expected to be adopted in markets such as drones and e-bikes for waterproofing measures in the future. 【Features】 ■ Cures in just 30 seconds, completing full waterproof sealing of components ■ Improved efficiency of the entire production process by replacing two-component potting ■ High design flexibility through mold forming using thermoplastic resin * For more details, please download the materials or feel free to contact us. 【Exhibition Information: Internepcon Japan Autumn】 Venue: Makuhari Messe Dates: September 9 (Wed) - September 11 (Fri), 2026 Exhibition lineup: Hot melt adhesives for low-pressure molding, dedicated low-pressure molding equipment for hot melt, etc. ★ We sincerely look forward to your visit! ★

As remote communication for meter reading, such as smart meters, and visualization of usage through HEMS advance, the importance of waterproof and dustproof measures for the increasing number of electronic components has grown. Matsumoto Processing proposes waterproof and dustproof protection for electronic components using hot melt molding to address concerns such as "If we ensure waterproofing on the housing, it will become larger!" and "The number of parts and labor during production will increase!" 【POINTS of Hot Melt Molding】 1. High Reliability Hot melt molding sealing has a track record of over 20 years in waterproof and dustproof applications for automotive and aerospace components, boasting high reliability. 2. Extremely Low Molding Pressure Molding is done at an extremely low pressure of 0.3 to 5 MPa, ensuring no damage to the electronic components being sealed. 3. Extremely High Productivity Sealing is completed in one shot within seconds to tens of seconds, allowing for significant "tact time reduction" compared to potting. 4. Miniaturization and Lightweighting of Products Since it can be molded into shapes that follow the contours of the components without the need for housing, "miniaturization and lightweighting" are possible. 5. Environmentally Friendly The hot melt products we handle are primarily made from plant fatty acids derived from grains.

Smart locks used in share mobility services, which are becoming more widespread. Exposed to wind and rain outdoors 24 hours a day, 365 days a year, and affected by vibrations during mobility installation, these devices require high reliability. Therefore, Matsumoto Processing proposes the protection of electrical components using "hot melt molding," which has a proven track record in waterproofing and dustproofing automotive electrical parts, to reduce failure rates through improved waterproofing and vibration resistance. 【POINTS of Hot Melt Molding】 1. High Reliability Hot melt molding has over 20 years of proven use in waterproof and dustproof applications for automotive and aircraft parts, boasting high reliability. 2. Extremely Low Molding Pressure Molding is done at an extremely low pressure of 0.3 to 5 MPa, preventing damage to the electrical components being sealed. 3. Extremely High Productivity Sealing is completed in one shot to several tens of seconds, allowing for significant "tact time reduction" compared to potting. 4. Miniaturization and Lightweighting of Products Since it can be molded into shapes that follow the contours of the parts without the need for housing, "miniaturization and lightweighting" are possible. 5. Environmentally Friendly The hot melt products we handle are primarily made from plant fatty acids derived from grains.

In recent years, physical AI has been gaining attention. Its widespread adoption requires high reliability to operate stably even in harsh environments. In particular, waterproof and dustproof measures for electrical components mounted on the equipment are one of the important challenges. Matsumoto Processing proposes waterproof and dustproof protection for electrical components using hot melt molding technology, contributing to the safety and durability of physical AI. 【Points of Hot Melt Molding】 1. High Reliability Hot melt molding sealing has a track record of over 20 years in waterproof and dustproof applications for automotive and aircraft components, boasting high reliability. 2. Extremely Low Molding Pressure Molding is done at an extremely low pressure of 0.3 to 5 MPa, ensuring no damage is inflicted on the sealed electrical components. 3. Extremely High Productivity Sealing is completed in one shot to several tens of seconds, allowing for significant "tact time reduction" compared to potting. 4. Miniaturization and Lightweighting of Products Since molding can be done in irregular shapes that conform to the components without the need for housing, "miniaturization and lightweighting" are possible. 5. Environmentally Friendly The hot melt products we handle are primarily made from plant fatty acids derived from grains.