Matsumoto kakou Co.,Ltd. Product Lineup

"Hot melt molding," which is expanding as a waterproof sealing method for electrical components to replace potting. Compared to traditional two-component potting, the following advantages are being recognized, leading to its adoption: - Extremely short curing time. Hot melt molding completes sealing in just a few seconds. - Possibility of miniaturization and lightweight design. Since hot melt molding is directly insert molded into electrical components, it eliminates the need for a case, allowing for greater design freedom and achieving miniaturization and lightweight construction. - Sustainable materials. The PA-based hot melt we handle is derived from natural plant oils and is environmentally friendly. We have compiled the process for adopting hot melt molding and examples of adopted products into a video of about five minutes. Please check the video link below.

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention as a waterproof technology for circuit boards. What is hot melt molding? How is it different from potting? What is the process for implementation? We will answer these questions. In recent years, hot melt molding has been increasingly adopted in various fields such as automotive electronic components, mobile devices, home electronics, and IoT devices as a waterproofing method to replace potting, contributing to improved productivity and cost reduction.

"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding, which is gaining attention for waterproof sealing of electronic components, utilizes thermoplastic adhesives in low-pressure insert molding to achieve environmental protection such as waterproofing and dustproofing for electronic components like mounted circuit boards. Compared to traditional two-component potting and conformal coating, sealing is completed in an extremely short time, leading to an expansion in its adoption as a sealing technology. We propose a sustainable hot melt made primarily from natural fatty acids. At the Matsumoto Processing Lab, nine hot melt molding machines are installed, and you can observe the actual process of hot melt sealing electronic components. Customers interested in visiting are encouraged to inquire.

Numerous examples of achieving value analysis (VA) by replacing the two-component potting process with hot melt molding are published! This is a technical case study document summarizing these examples from a process perspective. ■ Currently, we are offering technical documents and various case studies for free! ■ 【Published Information】 ■ Differences between potting and hot melt molding ■ Process flow implementation - Potting process ■ Process flow implementation - Hot melt molding ■ Application 1: Waterproof sealing of LED fixtures ■ Application 2: Waterproof sealing of micro switches ■ Application 3: Waterproof sealing of temperature sensors

By replacing potting, we achieve cost reduction and miniaturization. Hot melt molding has the following advantages, and the transition from two-component potting is progressing. - Extremely short cycle time In hot melt molding, sealing is completed in just a few seconds. - Possibility of miniaturization and lightweight design Since it allows for direct insert molding of electronic components, there is no need for a case, and the high degree of freedom in shape enables miniaturization and lightweight design. - Sustainability The PA-based hot melts we handle are primarily made from natural vegetable oils, offering excellent environmental benefits. We have compiled materials on how potting and hot melt molding differ. Please download the materials. *For the "cost reduction" materials, please view the PDF data from the download.

We introduce the adoption of hot melt molding technology that demonstrates excellent sealing performance by directly injecting sustainable hot melt adhesives made from natural fatty acids into electronic components. □ Adoption Examples Waterproofing and dustproofing of circuit boards, waterproof connectors, sensor harnesses, harnesses, switches, etc. □ Benefits of Adoption 1. Reduction in the number of components 2. Reduction in the amount of resin used 3. Shortening of processing time ◆ If you would like a collection of case studies, please download the catalog. ◆ If you would like a sample of the actual product, please contact us.

Significant reduction in processing time and number of parts! Insert molding waterproof method that directly injects thermoplastic adhesive into electronic components! In recent years, adoption in automotive parts has been expanding. □ Adoption Examples Waterproofing and dustproofing of circuit boards, waterproof connectors, sensor harnesses, harnesses, switches, etc. □ Benefits of Adoption 1. Reduction in number of parts 2. Reduction in amount of resin used 3. Shortening of processing time ◆ If you would like a collection of case studies, please download the catalog.

This is an introduction to a case where "hot melt molding technology" was adopted to achieve the miniaturization of portable antennas for PCs equipped with digital TV tuners. To miniaturize the antenna, it was essential to fold the antenna in half. To achieve this, it was necessary to mold it as a single unit, including the hinge. What made this possible was a method using hot melt resin that can be molded at ultra-low pressure, which is still not widely used in Japan. By combining three types of molding technologies—gas assist, carbon dioxide, and hot melt—we successfully shaped a folded antenna through integrated molding without using a single screw. 【Benefits of Implementation】 ■ Reduction of subsequent processes through integrated molding ■ Good results in environmental testing (thermal shock testing machine) *For more details, please refer to the catalog or feel free to contact us.

A waterproof insert molding method that directly injects thermoplastic adhesives into electronic components! We have received many inquiries and requests in the past for applications such as LED lighting fixtures, decorative lighting, and optical sensors, but conventional materials had a strong yellow tint and issues with light transmittance. This time, we are introducing a material that not only supports low-pressure molding sealing of electronic components like traditional hot melts but also excels in light transmittance. <Expected products for use> - LED lighting equipment - Display devices using LEDs, etc. - Light-based sensors such as photo sensors and fiber sensors

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! 'Hot Melt Molding' is a groundbreaking new technology for waterproof processing of circuit boards and electronic components that significantly reduces processing time compared to traditional methods. The sealing agent is primarily made from natural fatty acids derived from grains, making it excellent for sustainability. Our case study collection includes numerous examples where switching from potting to hot melt molding has led to reduced processing time and cost savings. Technical materials provide know-how on hot melt molding and waterproof processing of circuit boards and electronic components, including comparisons and benefits over traditional methods. ■ Currently, we are offering three types of case studies and two types of technical materials as a free gift ■ [Contents] ■ Hot Melt Molding Case Study Collection (16 pages, 15 cases) ■ Automotive Parts Application Case Study Collection (5 pages, 6 cases) ■ Mobile Device Application Case Study Collection (3 pages, 2 cases) ■ Hot Melt Molding Technical Materials (10 pages) ■ [Technical Material] Achieving VA by Switching from Potting (7 pages, 3 cases) * Please view the 'Hot Melt Molding Case Study Collection & Technical Materials' PDF available for download.

"Hot Melt Molding" is a groundbreaking new technology for waterproofing substrates and electronic components that significantly reduces processing time compared to traditional methods. The case study collection includes numerous examples where switching from potting to hot melt molding has led to shortened processing times and cost reductions. The technical documentation provides know-how on hot melt molding and waterproofing of substrates and electronic components, including comparisons with traditional methods and their advantages. [Contents] ■ Hot Melt Molding Case Study Collection (16 pages, 15 cases) ■ Automotive Parts Application Case Study Collection (5 pages, 6 cases) ■ Mobile Device Application Case Study Collection (3 pages, 2 cases) ■ Hot Melt Molding Technical Documentation (10 pages) ■ [Technical Documentation] Achieving VA through Switching from Potting (7 pages, 3 cases) * Please view the PDF of the "Hot Melt Molding Case Study Collection & Technical Documentation" from the download section.

We will provide a sample of a 20×20mm substrate (with LED) molded and sealed with amber/black polyamide-based hot melt free of charge. Please feel free to check the texture in person. Additionally, a movie of the production of this sample is currently available on the YouTube video below. If you would like a sample, please do not hesitate to contact us. What is "hot melt molding"? It is a sealing method that uses a solvent-free, one-component thermoplastic adhesive to insert mold electronic components within a mold. It excels in environmental resistance characteristics such as waterproofing, dustproofing, and insulation, and it solidifies in a short time of just a few seconds, leading to its expanding adoption as a sealing method alternative to potting. Furthermore, the materials used in this method are primarily derived from natural fatty acids sourced from grains, making it an environmentally sustainable method. Examples of applications: - Automotive electronic components (interior/exterior of vehicles) - Electronic components for power tools - Electronic components for industrial equipment - Various sensors, switches, etc. - Components for outdoor equipment (such as agricultural machinery)

Our technology "Hot Melt Low-Pressure Molding" is increasingly being adopted for waterproofing and dustproofing automotive electrical components. Due to the following advantages, there are more cases of switching from two-component potting: 1. Sealing is completed in an extremely short time of just a few dozen seconds. 2. Since it is mold forming, there is a high degree of freedom in shape, allowing for miniaturization and weight reduction. 3. The equipment and molds are very compact and easy to introduce. This time, Matsumoto Processing will demonstrate Hot Melt Low-Pressure Molding at the exhibition venue. Please check the simplicity of the process and the compactness of the equipment in real-time. Additionally, we will showcase actual products that have adopted hot melt molding sealing from both domestic and international customers. We hope this will be helpful for your product development ideas. 【Exhibition Information】 Name: Automotive Technology Exhibition 2025 NAGOYA Date: July 16 (Thursday) - July 18 (Friday), 2025, 10:00 AM - 5:00 PM Venue: Aichi Sky Expo (Aichi Prefectural International Exhibition Center) Booth No: 221 Organizer: Japan Society of Automotive Engineers

"Hot melt molding," which is attracting attention as a sealing method to replace potting for the purpose of waterproofing and dustproofing electrical components, has been expanding its adoption starting with automotive parts around 2010 and into various electrical components. We will be introducing various case studies at the "38th Monozukuri World Tokyo" held at Tokyo Big Sight. We sincerely invite you to visit us. We look forward to seeing you there. Event Dates: July 1 (Wed) - 3 (Fri), 2026, 10:00 AM - 5:00 PM Venue: Tokyo Big Sight (International Exhibition Center) Booth Number: East Hall - E25 (within the Shizuoka Prefecture company booth)

This is a next-generation sealing technology that imparts excellent environmental resistance, such as waterproofing and dustproofing, to various electronic components like circuit boards and sensors by low-pressure insert molding with hot melt thermoplastic adhesives. Compared to conventional methods like potting, it simultaneously achieves "shortened tact time," "reduced number of components," "miniaturization and weight reduction," and "lower defect rates," leading to its expanding adoption in various fields as a next-generation sealing technology. 【Adoption Fields】 - Automotive interior and exterior electronic components for four-wheeled and two-wheeled vehicles - Interior and exterior electronic components for working vehicles such as agricultural and construction machinery - Electronic components for industrial equipment, FA devices, and robots - Electronic components for home appliances and consumer devices - Electronic components for infrastructure equipment - Electronic components for outdoor working machinery and power tools - Electronic components for communication devices like 5G and LPWA etc. 【Adoption Examples】 - Waterproof sealing of automotive interior and exterior electronic components (circuit boards, sensors, harnesses, switches, etc.) - Waterproof and dustproof sealing of electronic components in FA equipment (circuit boards, sensors, etc.) - Waterproof sealing of control boards for power tools - Sealing of industrial communication and IoT devices - Waterproof sealing of various sensors, such as gas sensors and angle sensors etc. The sealing technology is expanding its adoption in various fields as a replacement for potting!

A groundbreaking sealing method for waterproofing and dustproofing electronic components【Hot Melt Molding】 rapidly solidifies in just a few seconds, allowing for quick transition to the next process. Its high degree of freedom in shape and potential for miniaturization and lightweight design have led to its increasing adoption as an alternative method to two-component potting materials like urethane and epoxy. At Internepcon Japan (Autumn), we will showcase many products that have actually adopted this method. We look forward to your visit. ↓↓Exhibition Information↓↓ Internepcon Japan Autumn Venue: Makuhari Messe Dates: September 9 (Wednesday) to September 11 (Friday), 2026 ★★We sincerely await your visit.★★

Drones, which are being utilized in various fields starting from agriculture, forestry, and fisheries, have recently expanded their applications to logistics. One of the challenges as the areas of use broaden is reliability in harsh environments such as rain and sand. Therefore, Matsumoto Processing proposes a highly reliable electronic component protection method, developed through waterproofing and dustproofing automotive and aircraft parts, specifically for drones: the hot melt low-pressure molding technique. Main Features: ★1 High Reliability: The hot melt and molding sealing method has over 20 years of proven performance in waterproof and dustproof applications for automotive and aircraft parts, boasting high reliability. ★2 Compact and Lightweight: As it involves mold forming, there is great freedom in shape, allowing for smaller and lighter sealing compared to potting with two-component sealants. ★3 High Production Efficiency: Cooling and solidification occur within seconds in the mold, completing the sealing process quickly. ★4 Sustainable: The sealing material is an environmentally friendly material primarily made from plant-derived natural fatty acids. Matsumoto Processing can flexibly accommodate initial small-scale prototypes. Please feel free to contact us.

Hot melt molding is a low-pressure molding method aimed at waterproofing, dustproofing, and insulation of electrical components. In traditional two-component potting methods such as urethane and epoxy, production delays due to curing time and the need for securing workspace were challenges. This method allows the resin to rapidly cure in just a few seconds to several tens of seconds, enabling the product to flow to the next process immediately after sealing, thereby improving production efficiency and reducing costs on the manufacturing line. It is used in automotive electrical components, sensors, and IoT devices, and is expected to be adopted in markets such as drones and e-bikes for waterproofing measures in the future. 【Features】 ■ Cures in just 30 seconds, completing full waterproof sealing of components ■ Improved efficiency of the entire production process by replacing two-component potting ■ High design flexibility through mold forming using thermoplastic resin * For more details, please download the materials or feel free to contact us. 【Exhibition Information: Internepcon Japan Autumn】 Venue: Makuhari Messe Dates: September 9 (Wed) - September 11 (Fri), 2026 Exhibition lineup: Hot melt adhesives for low-pressure molding, dedicated low-pressure molding equipment for hot melt, etc. ★ We sincerely look forward to your visit! ★

As remote communication for meter reading, such as smart meters, and visualization of usage through HEMS advance, the importance of waterproof and dustproof measures for the increasing number of electronic components has grown. Matsumoto Processing proposes waterproof and dustproof protection for electronic components using hot melt molding to address concerns such as "If we ensure waterproofing on the housing, it will become larger!" and "The number of parts and labor during production will increase!" 【POINTS of Hot Melt Molding】 1. High Reliability Hot melt molding sealing has a track record of over 20 years in waterproof and dustproof applications for automotive and aerospace components, boasting high reliability. 2. Extremely Low Molding Pressure Molding is done at an extremely low pressure of 0.3 to 5 MPa, ensuring no damage to the electronic components being sealed. 3. Extremely High Productivity Sealing is completed in one shot within seconds to tens of seconds, allowing for significant "tact time reduction" compared to potting. 4. Miniaturization and Lightweighting of Products Since it can be molded into shapes that follow the contours of the components without the need for housing, "miniaturization and lightweighting" are possible. 5. Environmentally Friendly The hot melt products we handle are primarily made from plant fatty acids derived from grains.

Smart locks used in share mobility services, which are becoming more widespread. Exposed to wind and rain outdoors 24 hours a day, 365 days a year, and affected by vibrations during mobility installation, these devices require high reliability. Therefore, Matsumoto Processing proposes the protection of electrical components using "hot melt molding," which has a proven track record in waterproofing and dustproofing automotive electrical parts, to reduce failure rates through improved waterproofing and vibration resistance. 【POINTS of Hot Melt Molding】 1. High Reliability Hot melt molding has over 20 years of proven use in waterproof and dustproof applications for automotive and aircraft parts, boasting high reliability. 2. Extremely Low Molding Pressure Molding is done at an extremely low pressure of 0.3 to 5 MPa, preventing damage to the electrical components being sealed. 3. Extremely High Productivity Sealing is completed in one shot to several tens of seconds, allowing for significant "tact time reduction" compared to potting. 4. Miniaturization and Lightweighting of Products Since it can be molded into shapes that follow the contours of the parts without the need for housing, "miniaturization and lightweighting" are possible. 5. Environmentally Friendly The hot melt products we handle are primarily made from plant fatty acids derived from grains.

In recent years, physical AI has been gaining attention. Its widespread adoption requires high reliability to operate stably even in harsh environments. In particular, waterproof and dustproof measures for electrical components mounted on the equipment are one of the important challenges. Matsumoto Processing proposes waterproof and dustproof protection for electrical components using hot melt molding technology, contributing to the safety and durability of physical AI. 【Points of Hot Melt Molding】 1. High Reliability Hot melt molding sealing has a track record of over 20 years in waterproof and dustproof applications for automotive and aircraft components, boasting high reliability. 2. Extremely Low Molding Pressure Molding is done at an extremely low pressure of 0.3 to 5 MPa, ensuring no damage is inflicted on the sealed electrical components. 3. Extremely High Productivity Sealing is completed in one shot to several tens of seconds, allowing for significant "tact time reduction" compared to potting. 4. Miniaturization and Lightweighting of Products Since molding can be done in irregular shapes that conform to the components without the need for housing, "miniaturization and lightweighting" are possible. 5. Environmentally Friendly The hot melt products we handle are primarily made from plant fatty acids derived from grains.