Matsumoto kakou Co.,Ltd. Product Lineup

Hot melt molding is a molding technology that involves injecting solvent-free, one-component thermoplastic hot melt adhesive into a mold under low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, impact resistance, insulation, and housing functionality. In this catalog, we introduce a case where waterproof sealing of printed circuit boards has been replaced from urethane potting to hot melt molding. **Benefits of Hot Melt Molding** - It achieves significant process improvements by solidifying in just a few seconds. - Since it does not take time to solidify, it enables inline processing rather than batch processing like potting. - It realizes cost reduction in the process due to the above. - It allows for the creation of freely shaped designs in molds, achieving "compactness and lightweight." *For more details, please refer to the catalog or feel free to contact us.*

Hot melt molding is a molding technology that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold at low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, shock resistance, insulation, and housing functionality. Matsumoto Processing Co., Ltd. has responded to the request to encapsulate IC tags (fine wire coils) using resin molding. [Challenges] - IC tags that are coiled into an antenna shape. - While wanting to encapsulate them with resin molding, bending of the coil leads to wire breakage, making commercialization impossible. [Effects] - A hot melt with low melting viscosity is used (1,900 m·Pa·s). - By molding at an extremely low pressure of 0.5 MPa, encapsulation was achieved without damaging the coil. *For more details, please refer to the catalog or feel free to contact us.

Hot melt molding is a molding technology that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold under low pressure. This method is widely used for purposes such as dust-proofing, waterproofing, vibration resistance, impact resistance, insulation, and housing functionality. In this catalog, we introduce a case where the process was improved by switching from potting to hot melt molding for waterproof sealing of LED modules. 【Conventional Method: Silicone Potting】 - A bathtub for polycarbonate molded products is created. - The module is placed in the case and secured. - Silicone resin is poured in and cured by heating for 80 minutes. ↓ 【Hot Melt Molding Method】 - Two modules are set on the mold. - Pressing the molding start button completes the sealing in 40 seconds. *For more details, please refer to the catalog or feel free to contact us.

Hot melt molding is a molding technique that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold at low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, impact resistance, insulation, and housing functionality. In this catalog, we introduce examples of process improvement and value analysis through the switch from waterproof connector rubber bushings. [Challenge] We want to waterproof the wire insertion area. *For more details, please refer to the catalog or feel free to contact us.

Hot melt molding is a molding technology that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold at low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, shock resistance, insulation, and housing functionality. In this catalog, we introduce examples that address the desire to tidy up the internal wiring of small devices using hot melt molding technology. [Challenges] - Poor organization of internal wiring - When users open the housing for battery replacement, the appearance is not good [Benefits] - Fixing the harness in any shape with hot melt molding *For more details, please refer to the catalog or feel free to contact us.

I want to use hot melt molding, but... ▼ The equipment is too expensive to adopt. ▼ Since the products are in the range of dozens per lot, we cannot consume the materials. ▼ Due to fluctuations in production quantity, we want to create a buffer through outsourcing. ▼ I want to adopt it immediately, but... I can't wait for the equipment delivery time. We respond to such customer "troubles." Our company applies hot melt molding to parts such as circuit boards entrusted to us and returns them. - We can handle almost all types of molding hot melt materials, including polyamide-based, polyester-based, polyolefin-based, and reactive polyurethane-based. - Materials are kept in standard stock for each grade, minimizing the burden on our customers. Our factory is ISO 9001 certified and also supports encapsulation molding for automotive parts. ◆ Please feel free to contact us.

"I want to use hot melt molding, but I can't install the equipment." For such customers, our factory has installed nine hot melt molding machines, and we will perform hot melt molding on the insert work provided by the customer. We can provide a comprehensive response, including selection of sealing agents, prototyping, mold manufacturing, and contract sealing processing. Available hot melts: - Polyamide-based - Polyolefin-based - Reactive polyurethane-based ◆ If you are interested, please feel free to contact us.

We will provide a sample of a 20×20mm substrate (with LED) molded and sealed with amber/black polyamide-based hot melt free of charge. Please feel free to check the texture in person. Additionally, a movie of the production of this sample is currently available on the YouTube video below. If you would like a sample, please do not hesitate to contact us. What is "hot melt molding"? It is a sealing method that uses a solvent-free, one-component thermoplastic adhesive to insert mold electronic components within a mold. It excels in environmental resistance characteristics such as waterproofing, dustproofing, and insulation, and it solidifies in a short time of just a few seconds, leading to its expanding adoption as a sealing method alternative to potting. Furthermore, the materials used in this method are primarily derived from natural fatty acids sourced from grains, making it an environmentally sustainable method. Examples of applications: - Automotive electronic components (interior/exterior of vehicles) - Electronic components for power tools - Electronic components for industrial equipment - Various sensors, switches, etc. - Components for outdoor equipment (such as agricultural machinery)

"Hot melt molding," which is attracting attention as a sealing method to replace potting for the purpose of waterproofing and dustproofing electrical components, has been expanding its adoption starting with automotive parts around 2010 and into various electrical components. We will be introducing various case studies at the "38th Monozukuri World Tokyo" held at Tokyo Big Sight. We sincerely invite you to visit us. We look forward to seeing you there. Event Dates: July 1 (Wed) - 3 (Fri), 2026, 10:00 AM - 5:00 PM Venue: Tokyo Big Sight (International Exhibition Center) Booth Number: East Hall - E25 (within the Shizuoka Prefecture company booth)