Matsumoto kakou Co.,Ltd. Product Lineup

Hot melt molding is a molding technology that involves injecting solvent-free, one-component thermoplastic hot melt adhesive into a mold under low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, impact resistance, insulation, and housing functionality. In this catalog, we introduce a case where waterproof sealing of printed circuit boards has been replaced from urethane potting to hot melt molding. **Benefits of Hot Melt Molding** - It achieves significant process improvements by solidifying in just a few seconds. - Since it does not take time to solidify, it enables inline processing rather than batch processing like potting. - It realizes cost reduction in the process due to the above. - It allows for the creation of freely shaped designs in molds, achieving "compactness and lightweight." *For more details, please refer to the catalog or feel free to contact us.*

Hot melt molding is a molding technology that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold at low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, shock resistance, insulation, and housing functionality. Matsumoto Processing Co., Ltd. has responded to the request to encapsulate IC tags (fine wire coils) using resin molding. [Challenges] - IC tags that are coiled into an antenna shape. - While wanting to encapsulate them with resin molding, bending of the coil leads to wire breakage, making commercialization impossible. [Effects] - A hot melt with low melting viscosity is used (1,900 m·Pa·s). - By molding at an extremely low pressure of 0.5 MPa, encapsulation was achieved without damaging the coil. *For more details, please refer to the catalog or feel free to contact us.

Hot melt molding is a molding technology that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold under low pressure. This method is widely used for purposes such as dust-proofing, waterproofing, vibration resistance, impact resistance, insulation, and housing functionality. In this catalog, we introduce a case where the process was improved by switching from potting to hot melt molding for waterproof sealing of LED modules. 【Conventional Method: Silicone Potting】 - A bathtub for polycarbonate molded products is created. - The module is placed in the case and secured. - Silicone resin is poured in and cured by heating for 80 minutes. ↓ 【Hot Melt Molding Method】 - Two modules are set on the mold. - Pressing the molding start button completes the sealing in 40 seconds. *For more details, please refer to the catalog or feel free to contact us.

Hot melt molding is a molding technique that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold at low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, impact resistance, insulation, and housing functionality. In this catalog, we introduce examples of process improvement and value analysis through the switch from waterproof connector rubber bushings. [Challenge] We want to waterproof the wire insertion area. *For more details, please refer to the catalog or feel free to contact us.

Hot melt molding is a molding technology that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold at low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, shock resistance, insulation, and housing functionality. In this catalog, we introduce examples that address the desire to tidy up the internal wiring of small devices using hot melt molding technology. [Challenges] - Poor organization of internal wiring - When users open the housing for battery replacement, the appearance is not good [Benefits] - Fixing the harness in any shape with hot melt molding *For more details, please refer to the catalog or feel free to contact us.

I want to use hot melt molding, but... ▼ The equipment is too expensive to adopt. ▼ Since the products are in the range of dozens per lot, we cannot consume the materials. ▼ Due to fluctuations in production quantity, we want to create a buffer through outsourcing. ▼ I want to adopt it immediately, but... I can't wait for the equipment delivery time. We respond to such customer "troubles." Our company applies hot melt molding to parts such as circuit boards entrusted to us and returns them. - We can handle almost all types of molding hot melt materials, including polyamide-based, polyester-based, polyolefin-based, and reactive polyurethane-based. - Materials are kept in standard stock for each grade, minimizing the burden on our customers. Our factory is ISO 9001 certified and also supports encapsulation molding for automotive parts. ◆ Please feel free to contact us.

"I want to use hot melt molding, but I can't install the equipment." For such customers, our factory has installed nine hot melt molding machines, and we will perform hot melt molding on the insert work provided by the customer. We can provide a comprehensive response, including selection of sealing agents, prototyping, mold manufacturing, and contract sealing processing. Available hot melts: - Polyamide-based - Polyolefin-based - Reactive polyurethane-based ◆ If you are interested, please feel free to contact us.

We will provide a sample of a 20×20mm substrate (with LED) molded and sealed with amber/black polyamide-based hot melt free of charge. Please feel free to check the texture in person. Additionally, a movie of the production of this sample is currently available on the YouTube video below. If you would like a sample, please do not hesitate to contact us. What is "hot melt molding"? It is a sealing method that uses a solvent-free, one-component thermoplastic adhesive to insert mold electronic components within a mold. It excels in environmental resistance characteristics such as waterproofing, dustproofing, and insulation, and it solidifies in a short time of just a few seconds, leading to its expanding adoption as a sealing method alternative to potting. Furthermore, the materials used in this method are primarily derived from natural fatty acids sourced from grains, making it an environmentally sustainable method. Examples of applications: - Automotive electronic components (interior/exterior of vehicles) - Electronic components for power tools - Electronic components for industrial equipment - Various sensors, switches, etc. - Components for outdoor equipment (such as agricultural machinery)

"Hot melt molding," which is attracting attention as a sealing method to replace potting for the purpose of waterproofing and dustproofing electrical components, has been expanding its adoption starting with automotive parts around 2010 and into various electrical components. We will be introducing various case studies at the "38th Monozukuri World Tokyo" held at Tokyo Big Sight. We sincerely invite you to visit us. We look forward to seeing you there. Event Dates: July 1 (Wed) - 3 (Fri), 2026, 10:00 AM - 5:00 PM Venue: Tokyo Big Sight (International Exhibition Center) Booth Number: East Hall - E25 (within the Shizuoka Prefecture company booth)

This is a next-generation sealing technology that imparts excellent environmental resistance, such as waterproofing and dustproofing, to various electronic components like circuit boards and sensors by low-pressure insert molding with hot melt thermoplastic adhesives. Compared to conventional methods like potting, it simultaneously achieves "shortened tact time," "reduced number of components," "miniaturization and weight reduction," and "lower defect rates," leading to its expanding adoption in various fields as a next-generation sealing technology. 【Adoption Fields】 - Automotive interior and exterior electronic components for four-wheeled and two-wheeled vehicles - Interior and exterior electronic components for working vehicles such as agricultural and construction machinery - Electronic components for industrial equipment, FA devices, and robots - Electronic components for home appliances and consumer devices - Electronic components for infrastructure equipment - Electronic components for outdoor working machinery and power tools - Electronic components for communication devices like 5G and LPWA etc. 【Adoption Examples】 - Waterproof sealing of automotive interior and exterior electronic components (circuit boards, sensors, harnesses, switches, etc.) - Waterproof and dustproof sealing of electronic components in FA equipment (circuit boards, sensors, etc.) - Waterproof sealing of control boards for power tools - Sealing of industrial communication and IoT devices - Waterproof sealing of various sensors, such as gas sensors and angle sensors etc. The sealing technology is expanding its adoption in various fields as a replacement for potting!

A groundbreaking sealing method for waterproofing and dustproofing electronic components【Hot Melt Molding】 rapidly solidifies in just a few seconds, allowing for quick transition to the next process. Its high degree of freedom in shape and potential for miniaturization and lightweight design have led to its increasing adoption as an alternative method to two-component potting materials like urethane and epoxy. At Internepcon Japan (Autumn), we will showcase many products that have actually adopted this method. We look forward to your visit. ↓↓Exhibition Information↓↓ Internepcon Japan Autumn Venue: Makuhari Messe Dates: September 9 (Wednesday) to September 11 (Friday), 2026 ★★We sincerely await your visit.★★

Drones, which are being utilized in various fields starting from agriculture, forestry, and fisheries, have recently expanded their applications to logistics. One of the challenges as the areas of use broaden is reliability in harsh environments such as rain and sand. Therefore, Matsumoto Processing proposes a highly reliable electronic component protection method, developed through waterproofing and dustproofing automotive and aircraft parts, specifically for drones: the hot melt low-pressure molding technique. Main Features: ★1 High Reliability: The hot melt and molding sealing method has over 20 years of proven performance in waterproof and dustproof applications for automotive and aircraft parts, boasting high reliability. ★2 Compact and Lightweight: As it involves mold forming, there is great freedom in shape, allowing for smaller and lighter sealing compared to potting with two-component sealants. ★3 High Production Efficiency: Cooling and solidification occur within seconds in the mold, completing the sealing process quickly. ★4 Sustainable: The sealing material is an environmentally friendly material primarily made from plant-derived natural fatty acids. Matsumoto Processing can flexibly accommodate initial small-scale prototypes. Please feel free to contact us.

Hot melt molding is a low-pressure molding method aimed at waterproofing, dustproofing, and insulation of electrical components. In traditional two-component potting methods such as urethane and epoxy, production delays due to curing time and the need for securing workspace were challenges. This method allows the resin to rapidly cure in just a few seconds to several tens of seconds, enabling the product to flow to the next process immediately after sealing, thereby improving production efficiency and reducing costs on the manufacturing line. It is used in automotive electrical components, sensors, and IoT devices, and is expected to be adopted in markets such as drones and e-bikes for waterproofing measures in the future. 【Features】 ■ Cures in just 30 seconds, completing full waterproof sealing of components ■ Improved efficiency of the entire production process by replacing two-component potting ■ High design flexibility through mold forming using thermoplastic resin * For more details, please download the materials or feel free to contact us. 【Exhibition Information: Internepcon Japan Autumn】 Venue: Makuhari Messe Dates: September 9 (Wed) - September 11 (Fri), 2026 Exhibition lineup: Hot melt adhesives for low-pressure molding, dedicated low-pressure molding equipment for hot melt, etc. ★ We sincerely look forward to your visit! ★

As remote communication for meter reading, such as smart meters, and visualization of usage through HEMS advance, the importance of waterproof and dustproof measures for the increasing number of electronic components has grown. Matsumoto Processing proposes waterproof and dustproof protection for electronic components using hot melt molding to address concerns such as "If we ensure waterproofing on the housing, it will become larger!" and "The number of parts and labor during production will increase!" 【POINTS of Hot Melt Molding】 1. High Reliability Hot melt molding sealing has a track record of over 20 years in waterproof and dustproof applications for automotive and aerospace components, boasting high reliability. 2. Extremely Low Molding Pressure Molding is done at an extremely low pressure of 0.3 to 5 MPa, ensuring no damage to the electronic components being sealed. 3. Extremely High Productivity Sealing is completed in one shot within seconds to tens of seconds, allowing for significant "tact time reduction" compared to potting. 4. Miniaturization and Lightweighting of Products Since it can be molded into shapes that follow the contours of the components without the need for housing, "miniaturization and lightweighting" are possible. 5. Environmentally Friendly The hot melt products we handle are primarily made from plant fatty acids derived from grains.

Smart locks used in share mobility services, which are becoming more widespread. Exposed to wind and rain outdoors 24 hours a day, 365 days a year, and affected by vibrations during mobility installation, these devices require high reliability. Therefore, Matsumoto Processing proposes the protection of electrical components using "hot melt molding," which has a proven track record in waterproofing and dustproofing automotive electrical parts, to reduce failure rates through improved waterproofing and vibration resistance. 【POINTS of Hot Melt Molding】 1. High Reliability Hot melt molding has over 20 years of proven use in waterproof and dustproof applications for automotive and aircraft parts, boasting high reliability. 2. Extremely Low Molding Pressure Molding is done at an extremely low pressure of 0.3 to 5 MPa, preventing damage to the electrical components being sealed. 3. Extremely High Productivity Sealing is completed in one shot to several tens of seconds, allowing for significant "tact time reduction" compared to potting. 4. Miniaturization and Lightweighting of Products Since it can be molded into shapes that follow the contours of the parts without the need for housing, "miniaturization and lightweighting" are possible. 5. Environmentally Friendly The hot melt products we handle are primarily made from plant fatty acids derived from grains.

In recent years, physical AI has been gaining attention. Its widespread adoption requires high reliability to operate stably even in harsh environments. In particular, waterproof and dustproof measures for electrical components mounted on the equipment are one of the important challenges. Matsumoto Processing proposes waterproof and dustproof protection for electrical components using hot melt molding technology, contributing to the safety and durability of physical AI. 【Points of Hot Melt Molding】 1. High Reliability Hot melt molding sealing has a track record of over 20 years in waterproof and dustproof applications for automotive and aircraft components, boasting high reliability. 2. Extremely Low Molding Pressure Molding is done at an extremely low pressure of 0.3 to 5 MPa, ensuring no damage is inflicted on the sealed electrical components. 3. Extremely High Productivity Sealing is completed in one shot to several tens of seconds, allowing for significant "tact time reduction" compared to potting. 4. Miniaturization and Lightweighting of Products Since molding can be done in irregular shapes that conform to the components without the need for housing, "miniaturization and lightweighting" are possible. 5. Environmentally Friendly The hot melt products we handle are primarily made from plant fatty acids derived from grains.