アイン List of Products and Services

We would like to introduce the "Thick Copper Base Wiring Boards" and "AMB Boards" that we handle. The "Thick Copper Base Wiring Board" is available with three grades of insulation layers. We manufacture thick copper base boards for power modules as an alternative to DBC boards and AMB boards (high thermal conductivity and high current). We also handle "AMB Boards," which are thick copper boards bonded to ceramics using the AMB method. These thick copper ceramic boards are designed for power devices and offer high insulation, heat dissipation, and reliability. We can accommodate small quantities, so please feel free to consult with us. 【Specifications of Thick Copper Base Wiring Boards (Partial)】 <Insulation Layer> ■ Thermal Conductivity: 10.0 W/m·K Thickness: 120 μm ■ Young's Modulus: 53 GPa ■ Copper Thickness (Base): 0.5, 1.0, 1.5, 2.0, 3.0 mm ■ Copper Thickness (Wiring): 0.2, 0.3, 0.5, 0.8, 1.0 mm *For more details, please download the PDF or feel free to contact us.

• Printed Circuit Board

Ain Co., Ltd. will exhibit at the 'JPCA Show 2024' held at Tokyo Big Sight. This exhibition will showcase electronic circuits and mounting technologies used in various electronic, information communication, and control devices, as well as new content and solutions. We plan to display our thick copper ceramic substrate "AMB substrate" for power devices and our ceramic wiring substrate "DPC substrate" using a plating method. We sincerely look forward to your visit. 【Exhibition Information】 ■ Dates: June 12 (Wed) to June 14 (Fri), 2024, from 10:00 AM to 5:00 PM (tentative) ■ Venue: Tokyo Big Sight, East Exhibition Hall ■ Booth Number: 6G-02 ■ Exhibition Zone: Printed Circuit Board Technology Exhibition ■ Address: 3-10-1 Ariake, Koto-ku, Tokyo 135-0063 *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

Ain Corporation will exhibit at the "JPCA Show 2023" held at Tokyo Big Sight. We plan to showcase our "DPC substrate," which is a wiring board formed by plating using ceramics as the base material, and the "AMB substrate," a thick copper ceramic substrate that excels in insulation, heat dissipation, and reliability. We will propose wiring boards that meet our customers' requirements with suitable materials and structures. 【Various Wiring Boards】 ■ Thermal Management: Ceramics, Metal ■ High Current: Ceramics, Metal ■ High Frequency: Resin ■ General Purpose: Resin We sincerely look forward to your visit. 【Event Overview】 ■ Dates: May 31 (Wed) - June 2 (Fri), 2023, 10:00 AM - 5:00 PM (tentative) ■ Venue: Tokyo Big Sight, East Exhibition Hall ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 ■ Exhibition Zone/Booth Number: Printed Circuit Board Technology Exhibition/6F-11 ■ Admission Fee: 1,000 yen (tax included) *Free for web registrants *For more details, please refer to the related links or feel free to contact us.

• Printed Circuit Board

This document introduces the AMB substrate design rules. It clearly presents information on ceramic types and thicknesses, layer composition, work sizes, product sizes, and prohibited areas for patterns on the product's outer perimeter, along with diagrams and tables. We encourage you to read it. 【Contents (excerpt)】 ■ Ceramic types and thicknesses ■ Copper thickness ■ Layer composition ■ Work sizes and product sizes ■ Product outer dimension tolerances ■ Prohibited areas for patterns on the product's outer perimeter *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

Our company specializes in the design and manufacturing of high-frequency substrates that meet various needs such as "high thermal conductivity," "high strength," and "miniaturization." In applications where heat dissipation measures are particularly required, such as high-speed wireless communication, we can design to conduct heat from heat-generating components to copper-based substrates via through-holes rather than through insulation layers. [Proposal Examples] ■ High thermal conductivity 　→ Copper-based fluoropolymer substrates ■ Low loss & high thermal conductivity 　→ DPC substrates (ceramic wiring substrates using plating methods) ■ Miniaturization (RF section, control section separation) 　→ Bonding of fluoropolymer substrates and FR-4 substrates *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Circuit board design and manufacturing

The "Metal Core Wiring Board" is a double-sided high thermal conductivity wiring board that uses metal as the core material. It supports high thermal conductive materials up to 10 W/m·K and low elastic materials (to reduce solder cracking), as well as "special insulation layers," "multilayer," "special processing," and "special materials." 【Specifications】 ■ Aluminum Core Wiring Board Insulation Layer - Thermal Conductivity: 5.0 W/m·K - Thickness: 120 μm - Young's Modulus: 33 GPa - Copper Plate Thickness: (0.2～) 0.5/1.0/1.5/2.0(～3.0) mm - Foil Thickness: 35/70(～200) μm *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

Our company designs, manufactures, and sells "high-frequency substrates" using various high-frequency substrate materials, tailored to performance, cost, and delivery time. The materials include fluoropolymer materials and ceramics such as alumina and aluminum nitride. We can also provide laminated substrates combining fluoropolymer substrates with standard FR-4 substrates, as well as copper-based fluoropolymer substrates with higher thermal conductivity. Additionally, we are flexible in accommodating special processing (treatments) such as "cavity structure formation," "counterbore and irregular router processing," "through-hole filling processing," and "electroplating, electroless plating." 【Examples of Achievements】 ■ Substrates for VSAT BUC and LNB (microwave) ■ Substrates for millimeter-wave radar and antennas ■ Substrates for Doppler sensors ■ Substrates for high-frequency power amplifiers ■ Optical transmission/reception units (TOSA/ROSA) *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Circuit board design and manufacturing

When designing modules that use high-power optical semiconductors, such as UV LEDs, a suitable wiring board for implementation is necessary. Our company proposes appropriate wiring boards considering various materials and structures for each requirement. We can also handle the design and manufacturing of wiring boards, as well as the modularization (implementation). ★ You can view detailed materials summarizing photos, structural diagrams, cross-sections, and achievements of "Thermal Countermeasures and Wiring Boards" from the "PDF Download." 【Contents】 ■ DPC Boards (Boards using plating methods) Comparison with thick film and thin film methods is also explained. ■ Copper Base Wiring Boards with Posts (High Thermal Conductivity Wiring Boards) Directly conducts heat from heat-generating components to the base material. ■ Metal Base Wiring Boards (High Thermal Conductivity Wiring Boards) Supports everything from standard aluminum base boards to copper base and custom specifications. ■ Ultraviolet High Reflective Film A film that can be applied to the surfaces of ceramics and metals, excellent in insulation, heat resistance, and ultraviolet resistance, reflecting even in the ultraviolet range. ■ Overview of EMS Services ■ List of Equipment from Partner Companies for Implementation

• Circuit board design and manufacturing

The "Ultraviolet (UV) High Reflective Film" is an excellent film that can be applied to the surfaces of ceramics and metals, reflecting in the ultraviolet range while providing insulation, heat resistance, and UV resistance. Our company engages in consistent product development from design to production. In response to the diversifying electronics industry, we provide high quality and high reliability based on the know-how we have cultivated over many years. 【Features】 ■ Can be applied to the surfaces of ceramics and metals ■ Reflects in the ultraviolet range ■ Excellent insulation, heat resistance, and UV resistance *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

The "thick copper wiring board" is a wiring board that uses copper plates in the wiring layer to respond to the "high current" demands of the electronics industry. By creating a substrate for high current circuits, it enables miniaturization and cost reduction. 【Features】 ■ Responds to the "high current" demands of the electronics industry ■ Uses copper plates in the wiring layer ■ Miniaturization ■ Cost reduction *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

This document introduces the products of Ain Co., Ltd., which engages in the design, manufacturing, and sales of printed circuit boards, categorized by function. It features various types of multilayer circuit boards (resin, metal, ceramics), including thick film printed circuit boards and inner layer thick copper circuit boards (with busbars). We respond to diverse needs such as high frequency, high thermal conductivity, and dimensional stability. 【Contents】 ■ High Frequency ■ High Thermal Conductivity ■ Dimensional Stability (Low Expansion) ■ High Heat Resistance ■ High Current *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

"Through hole filling" refers to the process of filling holes in ceramic substrates that excel in electrical (low resistance) and thermal (high thermal conductivity) properties due to special copper plating. We will introduce hole filling for diameters of Φ0.1 mm, as well as Φ0.15 mm and Φ0.2 mm, with photos. *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

The "DPC substrate" is a ceramic wiring substrate that offers higher heat resistance and strength than conventional thick-film printed circuit boards. It is a substrate using the DPC (Direct Plated Copper) plating method, compatible with various materials such as alumina (Al₂O₃), aluminum nitride (AlN), silicon nitride (Si₃N₄), and glass. 【Specifications】 ■ Base material: Compatible with various materials including alumina, aluminum nitride, silicon nitride, and glass ■ Conductor thickness: 10 to 100 μm *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

The "AMB substrate" is a substrate that joins thick copper to ceramics using the AMB (Active Metal Brazing) method. It is a thick copper ceramic substrate for power devices that has high insulation, heat dissipation, and reliability. 【Specifications】 ■ Base material: Silicon nitride (Si₃N₄) 　　　　Aluminum nitride (AlN) 　　　　Alumina (Al₂O₃) ■ Conductor thickness: 300 to 1000 μm *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

We can accept component mounting on printed circuit boards regardless of quantity. We offer a consistent response from design and manufacturing of printed circuit boards to component procurement and component mounting. (Some processes are outsourced.) We can also respond to requests for assembly, adjustment, and inspection, so please feel free to consult with us. 【Features】 ■ Integrated system from design and manufacturing to component procurement and component mounting *For more details, please download the PDF or feel free to contact us.

• Printed Circuit Board

The "Copper Base Wiring Board with Posts" is a thermally excellent heat dissipation substrate that forms posts on a copper base and connects directly to the surface pattern. It can also be multilayered and is used for high-density mounting substrates for LEDs. 【Features】 ■ High thermal conductivity ■ Short delivery time available ■ Special specifications can be discussed *For more details, please download the PDF or feel free to contact us.

• Printed Circuit Board

"Ceramics Ink" is an ink that has heat resistance and UV resistance, and can cure at low temperatures with inorganic materials. Despite being made of inorganic ceramic materials, it can cure at 160°C. It has a high heat resistance of 700°C, and its characteristic is that there is no discoloration due to the powdered inorganic oxide materials. 【Features】 ■ Inorganic ceramic materials ■ High heat resistance ■ Excellent thermal radiation ■ High opacity over the base ■ Less affected by the color of the base ■ High opacity and protection from UV and other factors ■ High thermal conductivity and dielectric strength *For more details, please download the PDF or feel free to contact us.

• Ceramics

The "metal base wiring board" is a high thermal conductivity wiring board that accommodates everything from standard aluminum base boards to copper base boards and custom specifications. We have various stock of aluminum and copper bases in a laminated structure, allowing for short delivery times. Additionally, we can accommodate special specifications (structure and materials) as per your requests. 【Features】 ■ High thermal conductivity ■ Short delivery times available ■ Special specifications can also be discussed *For more details, please download the PDF or feel free to contact us.

• Other semiconductors
• Printed Circuit Board
• Other electronic parts

Ain Corporation is a company primarily engaged in the sale of printed circuit boards, ceramic inks, and chemical industrial products. We provide a consistent product development process from design to production. We handle a wide range of high-performance substrates, such as "ceramics" and "VCM," which achieve excellent through-hole performance and bonding strength with low resistance values. 【Business Activities】 ■ Design, manufacturing, and sales of printed circuit boards ■ Manufacturing and sales of information control devices ■ Manufacturing, sales, and rental of printed circuit board manufacturing machinery and equipment ■ Sales of chemical industrial products *For more details, please download the PDF or feel free to contact us.

• Other electronic parts