山下マテリアル List of Products and Services

This product is a high-performance resist ink based on silicone, featuring excellent heat resistance and UV resistance, as well as advanced measures against low molecular siloxanes. It shows minimal discoloration and cracking even under heating and UV environments, making it ideal for coating applications in electronic and electrical components that require high reliability. Particularly, after heat treatment at 320°C for 2 minutes, there is very little change in reflectivity, and no discoloration or cracking is observed (refer to graphs and images). Additionally, even after 2,000 hours of exposure to UV-C (265nm), it maintains a high reflectivity, demonstrating stable performance in deep UV environments. Furthermore, it suppresses the generation of low molecular siloxanes (cyclic siloxanes (D4 to D10)), which can cause contact failures. It can be safely used in clean environments and in situations where the reliability of electronic device contacts is required.

• Other electronic parts

The "FPC Forming Processing Service" provided by Yamashita Material Co., Ltd. is a service that delivers flexible printed circuit boards (FPC) manufactured by our company, pre-bent into shapes according to customer specifications. The delivered FPC is in a state ready for immediate assembly, significantly reducing the labor hours at the assembly site and contributing to space-saving design. We can accommodate custom bending shapes and sizes upon consultation. We also have numerous examples of forming that utilize flexible materials such as liquid crystal polymer (LCP) and polyimide (PI), allowing us to flexibly respond to complex shapes.

• Other electronic parts

All LCP is a high-performance flexible printed circuit board (FPC) made entirely of liquid crystal polymer (LCP) without the use of adhesives. Compared to conventional polyimide FPCs, it features high heat resistance, low moisture absorption, low loss characteristics, chemical resistance, and low outgassing properties, providing stable performance even in harsh environments. It is particularly suitable for applications that require reduced transmission loss of high-frequency signals and improved durability in environments where oils and chemicals are used.

• Printed Circuit Board

BigElec Fold is a flexible and cost-effective high-current wiring solution that serves as an alternative to busbars and wire harnesses. ■ Features - Thin and flat printed circuit board structure - Customizable according to the desired shape and applied current of the customer - Two-layer construction allows for cost reduction and bending processing BigElec Fold emphasizes cost performance by limiting itself to a two-layer structure instead of a multi-layer one. This reduces material costs and makes bending processing easier, allowing for folding as well. BigElec Fold can connect to multiple terminals in its flat state, and by folding the wiring, it can also be accommodated in tight spaces. It can be freely designed and folded according to the application and wiring space. It realizes innovative ideas in the design field and provides excellent cost performance. BigElec Fold paves the way for the next stage of high-current wiring and meets customer expectations.

• Printed Circuit Board

We would like to introduce flexible circuit boards suitable for medical device applications among the products we handle. 【Long-Length Flexible Circuit Boards】 By using crank shapes and spiral shapes, we can accommodate lengths in the meter range. ◎Features◎ ■ Capable of manufacturing with a board outline width of less than 1mm ■ Compatible with the mounting of 0402 size components 【Slit Flexible Circuit Boards】 By applying slitting processing, we can achieve a wide range of flexibility, including horizontal and twisting directions. ◎Features◎ ■ Improved bendability and weight reduction ■ Flexible support for the number of slits and slit widths 【Ultra-Fine Circuit Flexible Circuit Boards】 Using the Semi-Adhesive Process (SAP), we can process fine circuits with a minimum L/S of 20/20μm. ◎Features◎ ■ Contributes to miniaturization and weight reduction of products through high density ■ Capable of supporting high-speed communication applications due to the use of LCP as the core material *For more details, please refer to the PDF materials or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing
• Prototype Services

Big Elec is a flexible circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-section. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high-current electronic components. Big Elec's low inductance reduces voltage spikes, contributing to the reliability of high-current electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible circuit boards. 【Feature 3】 High Design Freedom It ensures the same design freedom and usability as printed circuit boards. Pattern wiring and external shapes can be customized to meet specific requirements. It also supports the mounting of electronic components and connectors using paste solder.

• Other electronic parts

Big Elec is a flexible printed circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-sectional area. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high current-compatible electronic components. The low inductance of Big Elec reduces voltage spikes, contributing to the reliability of high current-compatible electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible printed circuit boards. 【Feature 3】 High Design Freedom It ensures design freedom and usability similar to printed circuit boards. Pattern wiring and external shapes can be customized according to requirements. It also supports the mounting of electronic components and connectors using paste solder.

• Harness

Our "High Current Flexible Wiring Board" is a product designed for high current wiring, intended as a substitute for busbars and harnesses. By forming a copper foil layer with a conductor thickness of 75 to 90 μm, it is possible to carry higher currents than standard flexible printed wiring boards. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, which makes it suitable for installation in tight spaces. 【Features】 ■ Capable of carrying high currents ■ Can be installed and bent in narrow spaces ■ Compatible with through-hole components and surface-mounted components ■ Can integrate connections between substrates, contributing to a reduction in assembly labor *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.

• Printed Circuit Board

Attention all users of electric wires, wire harnesses, busbars, and bus bars! "Big Elec SMT Connect" (High Current FPC Surface Mount Connector Split Specification) is a compact flexible circuit board that allows for high current wiring even in extremely small spaces, thanks to its flat shape. It can be offered as a solution that significantly enhances design flexibility. The highly flexible circuit board allows for component mounting and can be used in bent configurations, making installation in tight spaces easy. Furthermore, its thinness contributes to space-saving. We propose an excellent high current wiring solution. Please give Big Elec SMT Connect a try!

• power supply
• Other power sources

At Yamashita Material Co., Ltd., we offer a short delivery manufacturing service for flexible printed circuit boards (FPC). We handle not only FPC production but also pattern design, component assembly, and component procurement. We cater to a wide range of needs, from prototype production for research and development purposes to small-lot mass production. 【Features】 We provide short delivery times for small-scale production of single-sided FPC, double-sided FPC, pattern design, and component assembly. 【Delivery Time Estimates】 Single-sided FPC: Shortest delivery time of 1 working day to standard delivery time of 15 working days Double-sided FPC: Shortest delivery time of 2 working days to standard delivery time of 20 working days FPC assembly: Additional 1 working day to the above delivery times. *Weekends, holidays, and designated company holidays are not counted in the delivery time. *Delivery times may vary depending on product specifications and quantities. *There are restrictions on the number of components for assembly. The standard specification is for 30 or fewer components for single-sided assembly and 30 or fewer boards.

• Printed Circuit Board

The "Ultra-Fine Circuit High-Frequency Flexible Substrate" is a flexible substrate designed for high-frequency applications in the GHz range, compatible with bare chip mounting. By using LCP (Liquid Crystal Polymer) with low dielectric properties as the core material and forming circuits using the SAP (Semi-Additive Process), it is possible to create transmission lines with a differential impedance of 100Ω at wiring pitches below 50μm. To accommodate wire bonding with bare chips, the mounting pads are treated with ENEPIG (Electroless Ni Pd Au plating) for surface treatment. One of the features of SAP is its high precision in circuit formation, with an accuracy of ±5μm, making it suitable for impedance control. *For more details, please download the PDF or contact us.*

• Wiring materials

Our company manufactures low-loss flexible substrates (GHz band, Microstrip Line). We would like to introduce a flexible substrate that significantly improves transmission loss compared to the combination of polyimide-based and standard coverlay products. Using a PTFE base with a low-dielectric coverlay, we can expect a 60-70% improvement in transmission loss at the 40GHz band compared to standard products. Additionally, while the performance is slightly lower compared to PTFE-based substrates, a combination of LCP base and LCP coverlay can also expect about a 50% improvement in transmission loss and is suitable for long-term heat resistance and low outgassing applications due to the absence of adhesives. *For more details, please refer to the PDF materials or feel free to contact us. *Abbreviation explanations: PTFE ... Fluoropolymer LCP ... Liquid Crystal Polymer

• Wiring materials

Button-plated flexible printed circuit boards (FPC) can utilize the original thickness and characteristics of copper foil by applying through-hole plating only to the through-holes and through-hole lands. This allows for uniform maintenance of conductor thickness, enabling the formation of high-precision wiring, which is expected to provide high-accuracy impedance control, making it ideal for high-speed transmission applications. Compared to conventional panel plating methods, button-plated FPCs excel in flexibility and bendability, achieving ultra-thin designs. This enables the lightweight and compact design of products. The new method also allows for button plating on narrow pitch patterns. Product Features: 1. By applying copper plating only to the through-holes, the original characteristics of the copper foil are maximized. 2. High-precision impedance control is possible, demonstrating performance suitable for high-speed transmission. 3. Compared to panel plating methods, it excels in flexibility and bendability while achieving ultra-thin designs. 4. It provides stable quality with technology that has cleared reliability evaluations based on JISC5016. 5. Through-hole plating is possible even for narrow pitch patterns, which were previously difficult to achieve.

• Printed Circuit Board
• Circuit board design and manufacturing

BigElec is a flexible printed circuit board designed for high current wiring, intended as an alternative to busbars and wire harnesses, featuring a slim and flat design. Similar to printed circuit boards, it can accommodate pattern formation and assembly according to your requirements. We have newly introduced the "BigElec Standard Specification Products," which are easy to implement for connections between screw terminals. The BigElec Standard Specification Products have no initial costs, allowing for reduced upfront expenses. 【BigElec Standard Specification Product Specifications】 ■ Layers: 2 layers, 4 layers, 6 layers, 8 layers ■ Wiring width: 8mm to 11mm (integers only) ■ Total length: 30mm to 210mm (integers only) ■ Terminal screw diameters: M3 (hole diameter φ3.8mm), M4 (hole diameter φ4.4mm), M5 (hole diameter φ5.4mm), M6 (hole diameter φ6.5mm), M8 (hole diameter φ8.5mm) *For more details, please download the PDF or contact us.

• Wiring materials

The "high-speed transmission multilayer flexible substrate" reduces reflection points by integrating FPC and rigid substrates. It is suitable for high-frequency applications in the 10-30GHz range and allows for high-density RF lines compared to rigid substrates, making it effective for miniaturization of products. It also supports wire bonding and can have metal or ceramic reinforcement plates attached for heat dissipation measures. 【Features】 ■ Heat dissipation measures can be implemented by attaching reinforcement plates made of metal or ceramics ■ Miniaturization is possible due to high-density RF lines ■ Compatible with wire bonding *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

The "High-Density High-Multilayer Flexible Circuit Board" is an FPC developed for devices that require many signals. Despite having a 12-layer structure, it achieves a thickness of less than 1mm. The cable section can be bent for use, enabling high-density wiring in compact spaces. 【Features】 ■ The harness section can be bent for use. ■ Ideal for applying high-density wiring with over 200 pins in limited spaces. *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

The low-rebound, high-speed transmission FPC adopts a stripline structure and is an excellent flexible substrate for noise countermeasures using shielding materials. Compared to conventional 3-layer FPCs, it is approximately 200μm thinner and reduces rebound force to about one-third, while keeping transmission loss at the same level or lower. This innovative FPC, developed for communication devices, is expected to improve assembly workability and be used in movable parts. 【Four Features】 1. Reduces transmission loss to the same level or lower compared to conventional 3-layer FPCs and decreases rebound force to about one-third. 2. Improves assembly workability and allows for use in movable parts. 3. Enhances noise countermeasures through the adoption of stripline structure and shielding materials. 4. Supports compact device design due to its thin profile. For more details, please refer to the PDF materials or feel free to contact us.

• Wiring materials

"Long-Length Flexible Circuit Boards" are ultra-thin and meter-class FPCs. They enable long-distance wiring with ultra-thin cables measuring less than 1mm. While primarily intended for use in medical devices, the width and length of the FPC can be freely determined by the customer, allowing for various applications across different fields depending on ideas. [Features] ■ Capable of long-distance wiring in meter-class ■ Can create ultra-thin cables measuring less than 1mm *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

The "slit flexible substrate" is a flexible substrate with excellent bendability that has been processed with slits, allowing for "twisting" and "torquing." It is widely used as an alternative to fine coaxial cables, wire harnesses, and cables for medical devices, and since the spacing and width of the slits can be specified, it offers greater freedom for customers. 【Features】 ■ A bendable cable flexible substrate with 0mm slits processed between patterns ■ Can be used with "twisting" and "torquing" compared to conventional products ■ The spacing and width of the slits can be specified *For more details, please refer to the PDF materials or feel free to contact us.

• Wiring materials

The "multi-layer coil flexible substrate" has a conductor thickness of 75μm to 90μm, making it suitable for high current applications compared to standard flexible substrates. It allows for increased winding numbers in a compact space, making it promising for use in motors, power supply coils, and sensor applications. Additionally, it can be bent and integrated into narrow spaces, achieving a flat, thin, and lightweight design. 【Features】 ■ Possible to increase winding numbers in a compact space ■ Achieves a flat, thin, and lightweight design ■ Can be bent and integrated into narrow spaces ■ Expected to be used in motors, power supply coils, and sensor applications *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

The "Flexible substrate compatible with high-speed transmission connectors" combines the high-speed transmission connectors from Irisoh Electronics, [IMSA-11600S-30Y900 and IMSA-11501S-30Y900], with our YFC series (LVDS type microstrip line) RFM. By integrating them, it supports high-speed transmission up to 15GHz. 【Features】 ■ The LVDS-compatible FPC has been slotted. ■ It is easy to bend and can also be twisted for use. *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

The "High Heat Resistant Radiation Flexible Printed Circuit Board (FPC)" is an FPC that uses Okitsumo's heat-resistant solder resist "TAINEX." TAINEX is suitable for high-temperature environments up to 150°C and suppresses discoloration during heating. It also achieves radiation heat dissipation, and in our heat dissipation experiments, when combined with a thermal conduction layer, it has been shown to maintain temperatures more than 30 degrees lower compared to typical resist specifications for FPCs. *This result is based on tests conducted on double-sided boards. 【Features】 ■ FPC using Okitsumo's heat-resistant solder resist "TAINEX" ■ Thermal measures: Achieves a radiation rate of over 90% *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

The "Long-term High-Temperature Durable Flexible Circuit Board" is an FPC that achieves long-term heat resistance without the use of epoxy-based adhesives, making it suitable for harsh conditions in high-temperature environments. Even after undergoing our unique long-term high-temperature test conditions of 200°C for 1000 hours, the insulation resistance, continuity resistance change rate, and dielectric strength meet the JIS passing standards. 【Main Features】 1. Achieves high-temperature durability with a structure that does not use epoxy-based adhesives. 2. Heat resistance suitable for long-term use in high-temperature environments. 3. Insulation properties are maintained even after the long-term high-temperature test of 200°C for 1000 hours. For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

The "High-Temperature Durable and Oil-Resistant Flexible Printed Circuit Board (FPC)" made entirely of LCP substrate excels in long-term heat resistance and passes the flexibility test (AB test) equivalent to MOT 180°C required by UL standards. Additionally, it has better high-frequency transmission characteristics due to its low dielectric constant, low dielectric loss, and low water absorption compared to polyimide. In the oil resistance test, there were almost no changes in conduction resistance and appearance before and after the test, and the conductor peel-off test also met the standard values. 【Features】 ■ Uses liquid crystal polymer (LCP) for the base and cover materials ■ Has long-term heat resistance of 240°C ■ Exhibits oil resistance against engine oil, brake pedals, and ATF *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

By incorporating non-through filled vias into extremely small pads with narrow pitch, it becomes possible to implement electronic components at a higher density. This enables the miniaturization of flexible substrates and the implementation of multi-pin SoC chips. 【High-Density Implementation Possible】 It is possible to directly create filled vias on very small pads (φ100μm) with a pitch of 150μm, allowing for higher density component implementation. 【Easy Miniaturization】 Since high-density components can be implemented, it allows for the design of miniaturized substrates.

• High frequency/microwave parts

"Ultra-small diameter through holes" are formed with a diameter of φ20μm on both sides of the FPC through laser processing. It is possible to create holes with a minimum diameter of 20μm and a minimum pad diameter of 95μm. By using through-hole plating to fill the holes and arranging the through holes on the pattern, it enables narrower pitch and contributes to the miniaturization of the product. 【Features】 ■ Formation of through holes with a diameter of Φ25μm or less on both sides of the FPC is possible. ■ The holes are filled with 15μm through-hole plating specifications. *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

The "4-layer blind via filled blind via flexible printed circuit board" is a multilayer FPC that enables high-density wiring while achieving miniaturization, lightweight, and thinness. It applies filled plating to blind vias, allowing for the creation of pads for component mounting on the vias. It possesses bending performance that rigid boards do not have. It is suitable for high-resolution imaging diagnostic devices, including endoscopes and catheters, where miniaturization is required. 【Features】 ■ Blind vias can be filled with plating on a 4-layer flexible board ■ Space-saving is possible as components can be mounted on top of the vias ■ It can be made lighter compared to rigid boards *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

The "Ultra-small diameter through hole" is a flexible substrate designed to have holes filled by 15μm through-hole plating. It is possible to form through holes with a diameter of 25μm or less on double-sided flexible substrates. Additionally, we also offer "4-layer filled blind vias," which allow for the filling of blind vias through plating on 4-layer flexible substrates. 【Specifications】 〈Ultra-small diameter through hole〉 ■ Base polyimide: 50μm ■ Conductor thickness: 12μm ■ Hole diameter (entry side): φ20μm ■ Hole diameter (exit side): φ15μm ■ Land diameter: 95μm *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

The "Normal Type" is a flexible flat cable that replaces FFC with excellent bending and bending resistance. It can be made to your specified length, number of cores, and pitch. It complies with UL certification specifications, and standard products do not require initial costs. 【Features】 ■ Can be made to your specified length, number of cores, and pitch ■ Can comply with UL certification specifications ■ Standard products do not require initial costs *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

The "LDVS Type with Ear and Notch" features a locking mechanism with protrusions and recesses on the terminal part, tailored to the specifications of the connector. It is particularly suitable for environments with high vibrations, use in equipment under tension, or situations where twisting is applied to the drive part, as it helps prevent connector disconnection. The total length of the cable can be made to your specified length (up to 340mm), number of cores, and pitch. 【Features】 ■ Compatible with the protrusions and recesses of the specified connector terminal ■ Can be made to your specified length, number of cores, and pitch ■ Compliant with UL certification specifications ■ Standard products do not require initial costs *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

The "LDVS Type Microstrip Line (RFM)" is a high-performance version of the popular YFC series. It uses liquid crystal polymer (LCP), a low dielectric constant material, as the base film to reduce transmission loss. There are types ranging from RFM1 to RFM4, so please check the catalog for details. We offer two types for insulation: one using liquid crystal polymer film and the other using polyimide film. The type using liquid crystal polymer film for insulation aims for further reduction in transmission loss. Please choose according to the scene in which you will be using it. 【Features】 ■ Reduces transmission loss by using liquid crystal polymer as the base ■ The type using polyimide for the coverlay can accommodate hand soldering ■ Improved bending performance due to the adoption of mesh GND *For more details, please refer to the PDF materials or feel free to contact us.

• Wiring materials

The "LVDS Type Strip Line (RFS)" uses liquid crystal polymer, a low dielectric material, as the base film, aiming to reduce transmission loss. Additionally, it is suitable for EMC measures due to the use of a shielding film. The adoption of a mesh ground improves flexibility. 【Features】 ■ Reduces transmission loss by using liquid crystal polymer as the base ■ Implements EMC measures with a shielding film ■ Improves bending performance through the adoption of a mesh ground *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

The "L Shielded Type (SFC)" is equipped with a shield film applied to our YFC. An essential item in scenes where EMC measures are required. The shield film uses a thin membrane, ensuring that flexibility is not compromised. 【Features】 ■ YFC cable using shield film ■ Utilizes thin film shielding ■ Excellent flexibility *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

The "LVDS Type Coplanar (RFC)" is a high-performance type of the YFC series. It uses liquid crystal polymer, which is a low dielectric constant material, for the base film to reduce transmission loss. There are two types available: one that uses polyimide film for insulation (RFC1) and another that uses liquid crystal polymer film (RFC2). Additionally, due to its coplanar structure with single-sided wiring, it offers the greatest flexibility among our LVDS-compatible flat cables. 【Features】 ■ Reduces transmission loss by using liquid crystal polymer as the base ■ Offers the greatest flexibility among LVDS types due to single-sided wiring *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

The "Card Edge Compatible Multi-Layer Flexible Printed Circuit Board (FPC)" provided by our company is a multi-layer flexible circuit board designed to accommodate card edge connectors with double-sided contacts. By reducing the connection points between printed circuit boards and flexible circuit boards, a stable impedance line is formed, which is expected to improve signal integrity at high frequencies of 10 GHz and above. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, making it suitable for installation in tight spaces. 【Features】 ■ A partially bendable structure that has similar functionality to rigid-flex boards, enabling the formation of highly reliable vias. ■ A structure that integrates flexible and rigid parts without connection points or via transitions, allowing for the formation of stable impedance lines. ■ High-density wiring is possible with 100μm pitch wiring and vias with a land diameter of 300μm or less. ■ Integration of connections between boards contributes to a reduction in assembly labor. *For more details, please refer to the PDF materials. Feel free to contact us with any inquiries.

• Board to FPC connector

Achieving Thinness While Maintaining Transmission Characteristics! 【Features】 ■ This technology resolves the relationship between the thickness of the FPC and conductor loss, which is a challenge of microstrip lines. ■ By incorporating a slit design in the ground (GND) plane, it is expected to achieve a thinner FPC while maintaining transmission characteristics. ■ A 0mm slit processing is applied between patterns, accommodating a bendable 'slit shape'. *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• High frequency/microwave parts
• Wiring materials

Solder resist ink based on silicone resin. 【Features】 ■ Utilizes the properties of silicone resin for "high heat resistance" and "UV resistance" ■ "High heat resistance" = Almost no discoloration or reduction in reflectivity after reflow ■ "UV resistance" = Strong against ultraviolet light, with almost no degradation even under UV-C exposure ■ Although it is silicone resin, it has minimal outgassing, making it safe for use *For more details, please download the PDF or contact us.

• LED Module
• Printed Circuit Board

The "metal-based heat dissipation substrate" is a substrate that improves heat dissipation through thermal conduction, alleviating thermal issues. There are applications in high-brightness LED lighting (for vehicles and floodlights), as well as in automotive electrical components, ECUs, EPS, and DC/DC converters. Compared to standard glass epoxy substrates, it has a lower thermal expansion coefficient and greater resistance to heat. 【Features】 ■ A substrate that improves heat dissipation through thermal conduction by using metal as the base ■ Compared to standard glass epoxy substrates, it has a lower thermal expansion coefficient and greater resistance to heat *For more details, please refer to the PDF materials or feel free to contact us.

• Wiring materials

We provide high heat-resistant printed circuit boards using Okitsumo's high heat-resistant solder resist ink "TAINEX Series" and FR-4 high heat-resistant grade materials. These boards have excellent heat resistance and can be used in high-temperature environments where standard printed circuit boards are difficult to employ. They are made from halogen-free materials and comply with various environmental regulations. Please feel free to contact us when you need assistance. 【Features】 ■ Continuous heating: 150℃ / 1000h - No swelling or peeling ■ Continuous heating: 175℃ / 1000h - No swelling or peeling ■ Temperature cycle (-65℃ ⇔ 150℃) × 3000 cycles achieved - No swelling or peeling ■ Made from halogen-free materials and compliant with various environmental regulations *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

"ACF connection" allows for the simultaneous connection of multiple electrodes on a substrate through heating and pressurization. It enables reliable connection at fine pitch with low cost. Additionally, compared to connection methods such as soldering or connectors, it offers lightweight, thin design, and low-temperature mounting around 180°C. 【Features】 ■ Simultaneous connection of multiple electrodes on a substrate through heating and pressurization ■ Reliable connection at fine pitch achieved at low cost ■ Lightweight, thin design, and low-temperature mounting around 180°C *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials