フジミインコーポレーテッド Product Lineup

SiC (silicon carbide) sintered bodies are widely used in semiconductor manufacturing equipment and other applications due to their excellent properties such as chemical resistance, heat resistance, and high thermal conductivity. In recent years, with the advancement of product requirements, there has been a demand for higher density in sintered body components. However, since SiC is a difficult-to-sinter material, producing high-density SiC sintered bodies poses challenges, such as the need for temperature environments around 2000°C, which places a high load on equipment. In response to these challenges, our company has developed α-type silicon carbide, GC#40000. This product consists of ultra-fine particles with an average particle diameter of 250 nm, allowing for higher activation energy during sintering, which enables sintering at lower temperatures than conventional methods. Additionally, under the same temperature conditions, it is possible to achieve a denser and more compact sintered body. Furthermore, GC#40000 achieves a high purity of 99.9% as α-type SiC, contributing to the production of high-purity sintered bodies. If you have any of the following challenges, please feel free to contact us: - I want to improve the density of sintered bodies. - I want to reduce the firing temperature to decrease the power consumption of the firing furnace. - I want to sinter SiC in the current firing furnace, but the maximum temperature of the furnace is insufficient.

SiC (silicon carbide) has a hardness second only to diamond and is also very stable chemically at room temperature. Due to these properties, it is applied as an additive in wear-resistant coatings and plating additives. In recent years, the heat generation of electronic devices has become a problem due to the high functionality of communication and mobility, leading to increased expectations for heat dissipation materials, and SiC is also being used as a heat dissipation filler. Our SiC (silicon carbide) GC series consists of α-type green silicon carbide and has the following characteristics: 1) Lineup: Ultra-fine particles with an average particle size of 250nm to 58μm 2) Sharp particle size distribution: Our unique classification technology 3) High purity 【Expected Applications】 - SiC sintered body raw materials (industrial machine parts, semiconductor manufacturing equipment parts) - Filler materials (thermal conductivity, heat dissipation, wear resistance, heat resistance) - Grinding wheels - Blasting materials

"GC" is a green silicon carbide abrasive material that boasts high SiC purity. The hexagonal α-type crystals possess hardness second only to diamond and are also very stable chemically at room temperature. Therefore, they are not affected by chemicals, self-generate sharp cutting edges through fragmentation, and exhibit excellent polishing power. It is used not only for precision lapping and dicing of quartz and ferrite, as well as for wire saws for cutting Si ingots, but also as a wide range of polishing materials for processing hard metals, cutting tools, soft metals such as cast iron and copper alloys, and resins. Additionally, it is suitable as a material for ultra-fine precision grinding wheels. 【Features】 ■ Has hardness second only to diamond ■ Very stable chemically at room temperature ■ Exhibits semiconductor properties electrically ■ Good thermal conductivity and high-temperature resistance ■ Also used as a material for heat sinks (heat dissipation components) *For more details, please refer to the PDF document or feel free to contact us.

"C" is a black silicon carbide abrasive material commonly referred to as Carborundum. It is composed of α-type silicon carbide crystals obtained by thermally reacting silica and coke at high temperatures above 2000°C in an electric resistance furnace. The products derived from our unique manufacturing process consist of a stable cutting edge and a particle size distribution suitable for abrasive processing, enabling excellent surface finishing. 【Features】 ■ Composed of α-type silicon carbide crystals ■ Superior toughness compared to GC ■ Suitable as a material for abrasive cloth, ultra-fine precision grinding wheels, and for precision lapping of cast iron, die-casting, copper, aluminum, stone, and glass for photomasks ■ Also suitable for precision honing and dicing of semiconductor crystals, etc. *For more details, please refer to the PDF document or feel free to contact us.

We developed prepreg by combining the powder technology cultivated in our abrasive manufacturing, the slurry technology for dispersing powders, and the sheet-making technology for creating homogeneous sheets. By sintering the prepreg, it becomes a Ceramic Matrix Composite (CMC). Since CMC is composed of ceramic components such as silicon carbide, it offers better heat resistance and is lighter than existing heat-resistant alloys. An example of CMC using our prepreg, SiC/SiC, demonstrates superior fatigue characteristics at high temperatures above 1200°C compared to existing metals and CMCs. 【Features】 - Expected reduction in production costs and simplification of processes compared to conventional CMCs. - Ability to prototype prepregs tailored to specific purposes/applications. - Support not only for prepregs but also for our powder technology, slurry technology, and sheet-making technology. 【Expected Applications】 - Aerospace sector: combustion chambers, turbine blades, shrouds, nozzles. - Energy sector: fusion reactors, cladding tubes, channel boxes. - Automotive sector: brake discs, friction materials, exhaust systems. - Machine tool sector: crucibles, setters, bearings, large tables.

Silicon carbide (SiC) is a high-performance heat dissipation material that is gaining attention in the field of electronic materials. In addition to its excellent thermal conductivity, it possesses heat resistance, wear resistance, and chemical resistance, demonstrating high effectiveness even in areas where conventional boron nitride and aluminum nitride do not provide sufficient performance. In particular, the rounded SiC filler with beveled edges achieves high fillability and fluidity. It easily disperses uniformly in resins and adhesives, enabling a balance between processability and thermal performance in thermal interface materials (TIM) such as heat dissipation sheets, heat dissipation grease, heat dissipation adhesives, and heat dissipation gap fillers. Furthermore, this rounded shape is expected to reduce stress concentration and contribute to the long-term reliability of components. Applications extend to a wide range of fields where heat management is crucial, including inverters for electric vehicles, onboard power modules, LED substrates, and communication devices. The rounded SiC filler, with its significant potential as a next-generation thermal management material, serves as a powerful solution for development challenges that require both heat dissipation and reliability.

"Silicon carbide (SiC)" is a high-performance heat dissipation material that is gaining attention in the field of electronic materials. In addition to its excellent thermal conductivity, it also possesses heat resistance, wear resistance, and chemical resistance, demonstrating high effectiveness even in areas where conventional boron nitride and aluminum nitride do not provide sufficient performance. Additionally, our company will be exhibiting at the "10th High-Performance Ceramics Exhibition CERAMIC JAPAN" held at Makuhari Messe. We sincerely look forward to your visit. 【Features of Rounded Silicon Carbide】 ■ Optimized high thermal conductivity material (270 W/m K) for fillers ■ Achieves low viscosity with a smooth filler surface *For more details, please download the PDF or feel free to contact us.

We have released a new product for heat dissipation fillers, "Rounded Silicon Carbide," which combines high thermal conductivity and chemical stability, and excels in fillability and fluidity due to its rounded shape. ■Features - The high aspect ratio rounded rod shape makes it easy to form thermal conduction paths. - When combined with main fillers such as spherical alumina and aluminum nitride, a boosting effect on heat dissipation is expected. - The rounded edges derived from its crystal structure make it easy to fill into resins and other materials. Additionally, we will be exhibiting at the "11th Advanced Ceramics Exhibition [Osaka] CERAMIC JAPAN," which will be held at Intex Osaka for three days starting from May 13, 2026 (Wednesday). We will also explain the features and expected applications of our new product "Rounded Silicon Carbide" for heat dissipation fillers, so please take this opportunity to visit our booth!