フジミインコーポレーテッド List of Products and Services

"A" is a widely known abrasive also referred to as Alundum. It is composed of corundum crystals with an Al2O3 purity of over 90%, obtained by melting bauxite in an electric furnace at a high temperature of 2000°C. A characteristic feature is that a few percent of titanium is solid-solved to enhance toughness (resistance to fracture) as an abrasive grain. As a result, the product possesses high toughness among polishing micro-powders and is consistently adjusted to a uniform particle size distribution, leading to high polishing efficiency and scratch-free polished surfaces, while maintaining stable polishing performance. [Features] - A few percent of titanium is solid-solved to improve toughness (resistance to fracture) - Possesses high toughness among polishing micro-powders - Maintains stable polishing performance - Suitable for materials such as precision grinding wheels for ultra-finish and ultra-finish polishing cloths - Also ideal for precision lapping of various glass types, including cathode ray tubes, and soft metals *For more details, please refer to the PDF document or feel free to contact us.

"WA" is a representative precision processing micro-powder made from white alumina, used for a wide range of applications. It is produced by finely grinding and granulating fused alumina, and consists of high-purity alumina with an Al2O3 purity of 96.0% or higher, composed of α-type corundum crystals. It has a hardness second only to silicon carbide, maintains a sharp particle size distribution and stable particle shape, enabling advanced surface processing. 【Features】 ■ Exhibits excellent performance as a material for ultra-finish precision grinding wheels, ultra-finish abrasive cloth, and polishing tapes for ultra-precision surface finishing. ■ Suitable for precision lapping of metals without tensile strength, glass, quartz, semiconductor crystals, etc. ■ Chemically inert and resistant to high temperatures. ■ Outstanding stability in reaction with organic substances. ■ Widely used as a high-grade filler material (filling material) such as epoxy resin insulators. *For more details, please refer to the PDF document or feel free to contact us.

"FM" is a versatile final polishing material for metals, ranging from high-speed steel to soft metals. Even at a Vickers hardness of 200 to 250, it can transition directly from intermediate polishing with abrasive cloth to final polishing, creating a precise and beautiful polished surface. It overcomes the disadvantages of mechanical polishing, allowing for clear polishing even on fine structures such as high-speed steel and alloys. It can be easily processed with polishing cloths, including felt and flannel. 【Applications】 ■ Hard metals: Vickers hardness above 700 ■ Medium hardness: Vickers hardness 300 to 400 ■ Vickers hardness below 150 ■ Soft metal alloys such as aluminum steel and brass ■ Final finishing of soft metals and alloys *For more details, please refer to the PDF document or feel free to contact us.

"FAL" is a high-purity alumina polishing material. It consistently maintains a stable particle size distribution and high purity, ensuring excellent polishing performance and scratch-free surfaces. [Applications] ■ Contact lenses ■ Semiconductor crystals ■ Soft metals such as aluminum and copper *For more details, please refer to the PDF document or feel free to contact us.

"FS" is a polishing material made from high-purity α-A1₂O₃ powder that can be used for the final finishing of contact lenses and precision machine parts. In addition to Fujimi's technology, it is a product that has achieved controlled particle size, fast stock removing, low cost, and ease of use with the utmost care. Furthermore, it has an ultra-fine particle purity of over 99.9, making it less likely to undergo chemical reactions. [Applications] ■ Ceramic materials ■ Polishing of gemstones and precious stones ■ Final finishing for contact lenses ■ Finishing for precision parts such as watch gears ■ Raw materials for ceramic bites and transparent alumina *For more details, please refer to the PDF document or feel free to contact us.

"FO" is a precision lapping material based on alumina, featuring unique particle shape and hardness due to its carefully selected materials and proprietary manufacturing process. It is produced under strict crystal quality control, providing consistently stable polishing capabilities while also preventing the occurrence of scratches. In addition to semiconductor crystals, it demonstrates excellent processing performance for optical materials such as optical lenses, prisms, and glass, making it safe to use for high-value-added processed products. 【Features】 ■ Stable polishing capability ■ Prevents the occurrence of scratches ■ Excellent processing performance for optical materials ■ Strict crystal quality control ■ Uses carefully selected materials *For more details, please refer to the PDF document or feel free to contact us.

"POLIPLA" is a compound-type polishing material developed for plastic lenses. It is made from high-purity alumina that is uniformly dispersed and a special composition liquid with a pH value of approximately 3.0 to 4.0, allowing for a high polishing rate and a good finish. We offer a wide variety of types, so please choose a grade that suits your intended use. [Features] - Developed for plastic lenses - Compound-type polishing material - Achieves a high polishing rate and a good finish - A rich variety of types available - Grades can be selected according to the intended use *For more details, please refer to the PDF document or feel free to contact us.

The "CLEALITE Series" is a polishing material designed to smooth the surfaces of various metals, sapphire, and aluminum anodized films, among other metal oxides. It is suitable for removing processing marks, smoothing, enhancing gloss, and improving texture on general industrial parts, decorative items, LED support substrates, and sapphire cover glass surfaces. 【Features】 - Uses high-performance alumina abrasive particles - Excellent uniformity in abrasive particle size, resulting in a defect-free uniform surface - Superior cleanability, minimizing negative impacts on subsequent processes - Designed to smooth metal oxide surfaces - Efficiently removes machining marks and molding marks, allowing for a uniform smooth surface *For more details, please refer to the PDF document or feel free to contact us.

The mirror finish material "CLEALITE" is a mirror finishing material for general metals. "2340" is a polishing slurry that can achieve a surface roughness of 10nm (Rmax) and a scratch-free surface through mechanochemical polishing action with a special composition liquid. "S" was developed as a final polishing slurry specifically for metal materials, balancing a composition liquid that suppresses selective processing with a base of well-dispersed silica powder. 【Key Points】 ■ For general metals such as copper, aluminum, stainless steel, and titanium ■ 【Type "2340"】 ・Average particle size SEM: 15.0 ・pH: 10.0 ・Specific gravity: 1.210 ■ 【Type "S"】 ・Average particle size SEM: 72.0 ・pH: 8.8 ・Specific gravity: 1.200 *For more details, please refer to the PDF document or feel free to contact us.

"C" is a black silicon carbide abrasive material commonly referred to as Carborundum. It is composed of α-type silicon carbide crystals obtained by thermally reacting silica and coke at high temperatures above 2000°C in an electric resistance furnace. The products derived from our unique manufacturing process consist of a stable cutting edge and a particle size distribution suitable for abrasive processing, enabling excellent surface finishing. 【Features】 ■ Composed of α-type silicon carbide crystals ■ Superior toughness compared to GC ■ Suitable as a material for abrasive cloth, ultra-fine precision grinding wheels, and for precision lapping of cast iron, die-casting, copper, aluminum, stone, and glass for photomasks ■ Also suitable for precision honing and dicing of semiconductor crystals, etc. *For more details, please refer to the PDF document or feel free to contact us.

"GC" is a green silicon carbide abrasive material that boasts high SiC purity. The hexagonal α-type crystals possess hardness second only to diamond and are also very stable chemically at room temperature. Therefore, they are not affected by chemicals, self-generate sharp cutting edges through fragmentation, and exhibit excellent polishing power. It is used not only for precision lapping and dicing of quartz and ferrite, as well as for wire saws for cutting Si ingots, but also as a wide range of polishing materials for processing hard metals, cutting tools, soft metals such as cast iron and copper alloys, and resins. Additionally, it is suitable as a material for ultra-fine precision grinding wheels. 【Features】 ■ Has hardness second only to diamond ■ Very stable chemically at room temperature ■ Exhibits semiconductor properties electrically ■ Good thermal conductivity and high-temperature resistance ■ Also used as a material for heat sinks (heat dissipation components) *For more details, please refer to the PDF document or feel free to contact us.

The polishing material "FZ" is made of ultra-fine particles of zirconium oxide (ZrO2) and is suitable for polishing special alloys such as molybdenum, tungsten, chromium, titanium, and nickel. When using "FZ," employing a hard urethane pad or polishing pitch can achieve a deep, scratch-free glossy surface characteristic of metals. Additionally, using "FZ-02" for the final polishing of optical lenses can produce a scratch-free lens surface without "roughness" and vibrant interference fringes free of "waves." 【Applications】 ■ Molybdenum ■ Tungsten ■ Chromium ■ Titanium ■ Nickel ■ Other special alloys *For more details, please refer to the PDF materials or feel free to contact us.

The "PLANERLITE" series is a polishing material used in CMP (Chemical Mechanical Planarization) technology incorporated into the planarization process of increasingly dense ULSI devices. It is developed with the basic concepts of high purity, high processing efficiency, high dispersion, and scratch-free performance. [Introduction to the PLANERLITE Series] ■ PLANERLITE-4000: Polishing material for SiO2 films (interlayer insulating films, STI) ■ PLANERLITE-6000: Polishing material for Poly-Si ■ PLANERLITE-7000: Polishing material for copper wiring used in damascene processes ■ PLANERLITE-8000: Polishing material for barrier metals used in copper wiring *For more details, please refer to the PDF document or feel free to contact us.

"GLANZOX" has made it possible to achieve excellent polished surfaces by dispersing colloidal silica in a specially formulated liquid. In recent years, there have been strict reduction requirements for metallic impurities that affect device characteristics. In response, we have developed ultra-high purity colloidal silica. We offer dedicated polishing materials such as the "GLANZOX E Series" for finishing wafer edges to a mirror-like surface. 【Features】 ■ Disperses colloidal silica in a specially formulated liquid ■ Enables the realization of excellent polished surfaces ■ Developed ultra-high purity colloidal silica ■ Provides high-dimensional polishing materials *For more details, please refer to the PDF document or feel free to contact us.

"COMPOL" is a high-purity colloidal silica slurry developed specifically for polishing electronic material substrates such as sapphire, as well as metal materials and ceramics. It excels in particle uniformity and dispersion, achieving a high-efficiency, damage-free polished surface. [Contents] - Representative physical properties of COMPOL - SiO2 content - pH - Specific gravity - Average particle size - Standard quantity *For more details, please refer to the PDF document or feel free to contact us.

"INSEC" is a polishing material that precisely finishes compound semiconductor crystals to a mirror surface through mechanochemical processing. It comes in a variety of types, including "FP (primary polishing material)" and "NIB (final polishing material)" for GaAs wafers, as well as "P (final polishing material)" for GaP wafers. Additionally, we offer "SP," a polishing material specifically for precision polishing of GaAs wafers, and "IPP (primary polishing material)" for InP wafers. It is also effective as an etching material for GaAs and GaP LED-related applications. All of these materials are in granular form and are dissolved just before use. 【Features】 ■ Polishing material that finishes to a mirror surface with high precision ■ Wide variety of types ■ Effective as an etching material for GaAs and GaP LED-related applications *For more details, please refer to the PDF document or feel free to contact us.

"DIATEC" is a slurry-type abrasive that combines finely graded diamond powder with a special grinding liquid. It consistently maintains stable polishing power, enabling high efficiency and high precision mirror finishing. Various types are available, including concentration (M: Medium, H: Heavy) and types of diamonds (A: Single crystal, D: Polycrystalline), allowing for the selection of items suitable for the workpiece. [Features] - Mixture of finely graded diamond powder and special grinding liquid - Slurry-type abrasive - Consistently maintains stable polishing power - Diverse types available *For more details, please refer to the PDF document or feel free to contact us.