フジミインコーポレーテッド Product Lineup

The newly developed "angular nano-alumina" differs from conventional alumina in that its particle size is uniform and the particle size distribution is very sharp. The primary particle size can be controlled arbitrarily between 100 and 700 nm, and the crystal system can also be controlled depending on the application. It is used as an abrasive for device polishing slurries, fillers for resins and paints, and as a raw material for ceramics. 【Features】 ■ Uniform shape ■ Uniform particle size ■ Size control is possible ■ Crystal system control is possible *For more details, please refer to the PDF document or feel free to contact us.

"PWA" is a high-quality alumina-based polishing material composed of plate-like crystals with an Al2O3 purity of 99.0% or higher. It has excellent heat resistance, is chemically inert, and is not affected by acids or alkalis. Due to its stable particle size distribution, it achieves intricate polished surfaces and demonstrates outstanding polishing efficiency. [Features] - Composed of plate-like crystals with an Al2O3 purity of 99.0% or higher - Excellent heat resistance and chemically inert - Achieves intricate polished surfaces and demonstrates outstanding polishing efficiency - A functional polishing material with a wide range of applications - Suitable for lapping materials for silicon, optical materials, quartz, stainless steel, and metal materials, as well as coating fillers, polishing cloths, and composites with metals or synthetic resins. *For more details, please refer to the PDF document or feel free to contact us.

We have successfully synthesized a completely new plate-like particle, "Titanium Phosphate," with a refractive index of 1.79, high whiteness, and controlled aspect ratio. Titanium Phosphate does not decompose organic matter due to its lack of photocatalytic activity. It possesses characteristics unique to plate-like particles, such as slip properties. The developed high-whiteness plate-like Titanium Phosphate maintains its plate-like shape regardless of particle size and is characterized by uniform particle diameter and thickness. Particle size control is possible from 0.2 to 5 μm, ranging from submicron to several micrometers. *Surface treatment is also available. Please consult us. 【Features】 High aspect ratio, high whiteness, slip properties, low friction, ion exchange capacity, organic matter adsorption capacity, photocatalytic inactivity, glossiness 【Expected Applications】 Fillers, slip improvement materials, additives for paints, catalysts, optical films, etc.

Microparticles have advantages such as high surface area and reactivity, but they often face challenges in fluidity due to issues like agglomeration. Our company utilizes spray granulation technology to create spherical granules, providing powders that maintain the characteristics of microparticles while ensuring high fluidity. In the thermal spraying materials where we have extensive experience, we have provided composite powders made from various materials such as ceramics, metals, and resins. The reasons for choosing spherical composite powders for thermal spraying include the ability to achieve both reactivity (fusibility) and fluidity, as well as the capability to supply different materials like ceramics and metals uniformly dispersed within the granules. Our Features: - We own all processes from granulation to sintering, classification, and analysis inspection equipment, allowing us to provide total solutions tailored to our customers' challenges. - We have obtained JIS Q9100 certification for thermal spraying materials aimed at the aerospace industry. - We have a strong track record of deliveries to the semiconductor industry, which requires high-quality management. Beyond thermal spraying applications, there is a growing demand for various composite particles, including metals and ceramics, as materials and fillers for 3D printers. We are committed to providing solutions with spherical composite powders, so please feel free to contact us.

SiC (silicon carbide) has a hardness second only to diamond and is also very stable chemically at room temperature. Due to these properties, it is applied as an additive in wear-resistant coatings and plating additives. In recent years, the heat generation of electronic devices has become a problem due to the high functionality of communication and mobility, leading to increased expectations for heat dissipation materials, and SiC is also being used as a heat dissipation filler. Our SiC (silicon carbide) GC series consists of α-type green silicon carbide and has the following characteristics: 1) Lineup: Ultra-fine particles with an average particle size of 250nm to 58μm 2) Sharp particle size distribution: Our unique classification technology 3) High purity 【Expected Applications】 - SiC sintered body raw materials (industrial machine parts, semiconductor manufacturing equipment parts) - Filler materials (thermal conductivity, heat dissipation, wear resistance, heat resistance) - Grinding wheels - Blasting materials

"COMPOL" is a high-purity colloidal silica slurry developed specifically for polishing electronic material substrates such as sapphire, as well as metal materials and ceramics. It excels in particle uniformity and dispersion, achieving a high-efficiency, damage-free polished surface. [Contents] - Representative physical properties of COMPOL - SiO2 content - pH - Specific gravity - Average particle size - Standard quantity *For more details, please refer to the PDF document or feel free to contact us.

Cemented carbide is widely used for tools, cutting tools, molds, and jigs due to its excellent hardness and wear resistance. However, because of these characteristics, it is known as a difficult-to-machine material, and conventional processing methods have faced challenges in achieving complex shapes and longer delivery times. To address these issues, our company has developed cemented carbide powder suitable for 3D printing. It has the following features: 1) High-flow powder that contributes to high density 2) A lineup tailored to different manufacturing methods (PBF, DED, etc.) Expected applications: - High-precision press molds, special cutting tools - Repair of large structures and components, hard coatings Additionally, as a powder manufacturer, we support our customers' 3D printing with layered manufacturing by providing high-quality materials and developing and designing powders that consider different process parameters such as laser output, scanning speed, and layer thickness for each manufacturing method. If you have any inquiries or challenges regarding 3D printing with cemented carbide powder, please feel free to contact us.

Titanium phosphate is a plate-shaped filler with characteristics such as high refractive index (1.79), high whiteness, and photocatalytic inactivity. Our unique synthesis technology allows us to provide particles with uniform size and thickness. In recent years, to reduce the emissions of PFAS, which are difficult to decompose and have the potential for long-term environmental persistence, regulations are being considered in Europe, leading to a narrowing of material options in the solid lubricant industry. Titanium phosphate has the following three characteristics as a solid lubricant: 1) When added to grease, it improves durability (resistance to seizure and wear). 2) Due to its high whiteness, it does not cause black contamination in the surrounding area. 3) Depending on the particle size, it can maintain its plate-like shape up to around 700°C. Additionally, it tends to excel in durability compared to common solid lubricants such as molybdenum disulfide, PTFE, and boron nitride. Furthermore, titanium phosphate has the following optical characteristics: - It achieves both light diffusion and light transmission. Light-diffusing particles represented by acrylic particles and silicone particles also have excellent light diffusion properties, but materials that can achieve compatibility with light transmission are rare, making it promising for applications in light-diffusing films and light-diffusing plates.

In the "Knowledge Base Aichi Key Research Project" implemented by Aichi Prefecture and the Public Interest Incorporated Foundation Science and Technology Exchange Foundation, a research group consisting of Professor Makoto Kobashi from Nagoya University, Asahi Seiki Kogyo Co., Ltd., Aichi Industrial Science and Technology Comprehensive Center, and our company has successfully developed a mold for cemented carbide with internal structures using a 3D printer. We are currently fabricating cemented carbide punches with internal piping using a 3D printer, and for verification, we are using the actual fabricated cemented carbide punches in deep drawing processing. We have confirmed that there are no abnormalities in both the workpiece and the punch even after 100,000 shots, and further verification with an increased number of shots is planned for the future. Our company has developed powders with properties suitable for metal 3D printers (Powder Bed Fusion: PBF) necessary for fabricating using cemented carbide powders. The manufacturing and sales of these 3D printer-compatible cemented carbide powders have already begun. The cemented carbide punch shown in the image was fabricated by Japan Layered Manufacturing Co., Ltd.

In recent years, the high functionality of communication and mobility has led to issues with heat generation in electronic devices, increasing expectations for heat dissipation materials. Zinc oxide, like common alumina (aluminum oxide) and magnesia (magnesium oxide), has high thermal conductivity and possesses the following advantages: - Low Mohs hardness, resulting in low aggressiveness towards equipment used to manufacture heat dissipation materials - Low thermal expansion coefficient, leading to minimal impact on dimensional changes of heat dissipation materials - Superior water resistance compared to magnesia Our company has successfully developed rod-shaped zinc oxide using our unique particle synthesis technology. Rod-shaped zinc oxide is expected to have three effective benefits for heat dissipation materials: 1) Its high aspect ratio makes it easy to form thermal conduction paths 2) Its rounded corners, due to the crystal structure, make it easy to fill into resins and other materials 3) It is easier to secure contact surface area between fillers compared to spherical particles If you have any of the following challenges, please feel free to contact us: - You want to try heat dissipation/thermal conduction fillers with unique shapes - You are struggling with the difficulty of filling boron nitride fillers (to be combined as a bulking filler) - You are facing issues with water resistance measures for aluminum nitride

In recent years, to reduce the emissions of PFAS, which are difficult to decompose and have the potential for long-term environmental persistence, regulations are being considered in Europe. This has narrowed the options for materials in the solid lubricant industry, and alternatives to PTFE are limited. In response to such challenges, we have developed titanium phosphate in a plate-like form with a controlled aspect ratio. Our synthesis technology allows for control of particle sizes from 0.3 to 5 µm, providing uniform plate-like particles. Plate-like titanium phosphate has the following three characteristics for solid lubricant applications: 1) Excellent sliding properties due to the shape characteristics of the plate-like particles. 2) High whiteness, which prevents black contamination of the surroundings. 3) Composed of materials that do not contain fluorine compounds. Our titanium phosphate tends to excel in anti-seizing properties compared to common solid lubricants such as molybdenum disulfide, PTFE, and boron nitride. If you have any of the following challenges, please feel free to contact us: - Want to improve the anti-seizing properties of lubricants. - Want to achieve lubrication performance with a small amount of additive. - Considering measures against PFAS in materials. *For more details, please download the PDF.

Silicon carbide (SiC) is a high-performance heat dissipation material that is gaining attention in the field of electronic materials. In addition to its excellent thermal conductivity, it possesses heat resistance, wear resistance, and chemical resistance, demonstrating high effectiveness even in areas where conventional boron nitride and aluminum nitride do not provide sufficient performance. In particular, the rounded SiC filler with beveled edges achieves high fillability and fluidity. It easily disperses uniformly in resins and adhesives, enabling a balance between processability and thermal performance in thermal interface materials (TIM) such as heat dissipation sheets, heat dissipation grease, heat dissipation adhesives, and heat dissipation gap fillers. Furthermore, this rounded shape is expected to reduce stress concentration and contribute to the long-term reliability of components. Applications extend to a wide range of fields where heat management is crucial, including inverters for electric vehicles, onboard power modules, LED substrates, and communication devices. The rounded SiC filler, with its significant potential as a next-generation thermal management material, serves as a powerful solution for development challenges that require both heat dissipation and reliability.

"Silicon carbide (SiC)" is a high-performance heat dissipation material that is gaining attention in the field of electronic materials. In addition to its excellent thermal conductivity, it also possesses heat resistance, wear resistance, and chemical resistance, demonstrating high effectiveness even in areas where conventional boron nitride and aluminum nitride do not provide sufficient performance. Additionally, our company will be exhibiting at the "10th High-Performance Ceramics Exhibition CERAMIC JAPAN" held at Makuhari Messe. We sincerely look forward to your visit. 【Features of Rounded Silicon Carbide】 ■ Optimized high thermal conductivity material (270 W/m K) for fillers ■ Achieves low viscosity with a smooth filler surface *For more details, please download the PDF or feel free to contact us.

We have released a new product for heat dissipation fillers, "Rounded Silicon Carbide," which combines high thermal conductivity and chemical stability, and excels in fillability and fluidity due to its rounded shape. ■Features - The high aspect ratio rounded rod shape makes it easy to form thermal conduction paths. - When combined with main fillers such as spherical alumina and aluminum nitride, a boosting effect on heat dissipation is expected. - The rounded edges derived from its crystal structure make it easy to fill into resins and other materials. Additionally, we will be exhibiting at the "11th Advanced Ceramics Exhibition [Osaka] CERAMIC JAPAN," which will be held at Intex Osaka for three days starting from May 13, 2026 (Wednesday). We will also explain the features and expected applications of our new product "Rounded Silicon Carbide" for heat dissipation fillers, so please take this opportunity to visit our booth!