石川金属 Product Lineup

Applications of Low Melting Point Solder Low melting point solder is used for the assembly of heat-sensitive components such as camera modules. Until now, these components have been retrofitted using resin-based solder, but further efforts are being made to lower temperatures and automate processes through the use of low-temperature solder and laser heating. Challenges of Low Melting Point Soldering Low melting point solder requires dedicated flux that matches its melting point, so it cannot be directly applied to what is currently in use. Additionally, since the alloy contains bismuth, caution is needed when using it in areas that require high reliability, such as automotive parts, medical devices, and industrial equipment. Ishikawa Metal's Low Melting Point Solder We already offer a variety of syringe-type solder pastes with proven market performance, including halogen-free syringe-type solder paste, so please contact us for more information. *For more details, feel free to contact us.*

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About the Price and Characteristics of Aluminum The price of aluminum is about one-third that of copper, which can reduce procurement costs. Additionally, its weight is also about one-third, allowing for a reduction in transportation costs and environmental impact related to delivery. The characteristics of aluminum are that it is both ecological and economical. Soldering Aluminum We have made it possible to solder aluminum, which has been difficult until now. The surface of aluminum has a strong oxide film, and common fluxes cannot remove this oxide film. No-Clean Compatibility In our tar-containing solder EAN series, we have successfully used a special fluorine compound activator to remove the strong oxide film on aluminum. Just like our previous tar-containing solders, it can be used without the need to clean flux residues. *For more details, please feel free to contact us.

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Infrared lasers are used for soldering. There is a characteristic that organic materials have a higher absorption rate than metals. As a result, during soldering, the temperature of the flux becomes higher, and phenomena such as the evaporation or degradation of the flux can be observed before the solder alloy reaches the required temperature. Laser soldering faces the following challenges associated with optical heating and rapid heating over a short period of time: - Insufficient wetting - Flux and solder scattering - Decreased laser output due to lens contamination For laser soldering materials, specialized rosin-core solder and solder paste are available. In the case of rosin-core solder, using a base material that is less volatile can help, and for solder paste, adding materials that are less prone to thermal sagging at high temperatures can address these issues. We offer solder materials tailored to various mounting forms such as point soldering, SMT, printing, and dispensing, so please feel free to contact us. *For more details, please do not hesitate to contact us.

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In the case of solder materials, halogens such as Cl and Br are used in the flux to enhance the wettability and workability of the solder. However, incinerating electronic substrates containing halogens like Cl and Br can produce harmful dioxins to living organisms. To address this issue, the regulation of halogens used in electronic substrates is what is meant by halogen-free. Our company offers a variety of rosin-containing solder and solder paste that meet various halogen-free standards, so please feel free to contact us. 【Product Introduction】 ■ Rosin-containing solder → High reliability, halogen-free standard compliant HRK series ■ Rosin-containing solder → Completely halogen-free type HFC series ■ Solder paste (bottle) → Splash prevention, halogen-free standard compliant type 8850 series ■ Solder paste (bottle) → Completely halogen-free standard compliant 7100 series *For more details, please feel free to contact us.

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Currently, the introduction of low-silver solder with reduced Ag content and silver-free solder is progressing. The Ag in solder plays roles such as lowering the melting point of the alloy, improving wettability, and increasing mechanical strength, fatigue strength, and creep strength. We offer solder pastes and flux-cored solders compatible with low-Ag and no-Ag options, so please feel free to contact us. 【Product Introduction】 ■ Solder Paste (Bottle) Wettability-focused 1001 Series ■ Flux-Cored Solder Wettability-focused MFJ Series ■ Flux-Cored Solder Splash Prevention MYK Series *For more details, please feel free to contact us.

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The rosin used in flux varies in color depending on the variety, ranging from colorless and transparent to brown. Additionally, some active agents and additives can change color due to the heat during soldering. In LED lighting equipment, a white resist is applied over the entire substrate, and if the flux residue is brown, it can detract from the product's appearance. Furthermore, on substrates with silk-screened markings, brown flux residue can flow into the marked areas, reducing visibility and increasing the burden during visual inspection processes. We offer solder materials that minimize the color of flux residue by using light-colored rosin and low-color active agents. For samples, please contact us through our website below. 【Product Introduction】 ■ Rosin-containing solder, splash prevention type MYK series ■ Solder paste (bottle), colorless residue, LED compatible type 8860 series

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Residue cracking is a phenomenon that occurs when physical forces such as thermal contraction and bending are applied to flux residue, leading to cracking and delamination. When cracks occur in the residue, phenomena such as moisture absorption at the crack site can arise, resulting in decreased electrical reliability. Additionally, if delaminated flux enters switch contacts, it can cause operational failures. Countermeasures for residue cracking include cleaning the substrate and applying coatings; however, both of these options incur additional costs. Therefore, it is recommended to use solder and solder paste that do not crack under residue. Our company offers solder and solder paste that address residue cracking issues. Please contact us through our website for samples. 【Overview】 ■Issues with residue cracking - Phenomena such as moisture absorption at the crack site lead to decreased electrical reliability. - Delaminated flux entering switch contacts can cause operational failures. - Countermeasures for residue cracking include cleaning the substrate and applying coatings after soldering, but both incur costs. - Using solder and solder paste that do not crack under residue can resolve issues caused by residue cracking.

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One of the common issues during work with rosin-containing solder is flux scattering. In addition to damaging the appearance of the product, flux that adheres to the LCD screen, camera unit, and switch contacts can lead to product malfunctions. Flux scattering occurs when low-boiling and low-decomposition components in the flux boil and gasify due to the heat during soldering, resulting in an explosion simultaneous with solder melting. Factors that make scattering more likely include: - Not selecting solder appropriate for the task. - The soldering iron temperature being too high. - The speed of solder feeding being too fast. - The working location being at a high altitude (low surrounding air pressure). Solder balls are also likely to occur simultaneously with flux scattering. They can arise when solder is fed too rapidly, as well as when the movement of the soldering iron is too vigorous or when there is too much solder. Measures such as increasing the melting viscosity of the flux and using materials with less gasification can help reduce scattering caused by solder materials. Our company offers rosin-containing solder and solder paste with scattering countermeasures. For samples, please contact us through our website below.

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Wet defects, bridging, and solder spikes are all issues caused by the active agents in the flux. During soldering, the active agents decompose and volatilize due to heat, leading to depletion. When depleted, defects such as wetting issues, bridging, and solder spikes occur, so it is possible to prevent these defects by continuously supplying fresh active agents to the soldering area. By supplying small amounts to the soldering area, fresh active agents are always present, achieving good wetting. This is particularly important in robotic soldering, where the final results can vary significantly. Additionally, reviewing issues such as excessively high soldering iron temperatures, insufficient heater capacity, and mismatched dimensions between components and the soldering tip is also effective. We offer flux-containing solder that demonstrates excellent wetting properties across a wide temperature range and for various mounted components. Please contact us through our website for samples. 【Overview】 ■ Review of soldering operations - Achieving good wetting by supplying small amounts - Reviewing issues such as excessively high soldering iron temperatures, insufficient heater capacity, and mismatched dimensions between components and the soldering tip is also effective - Using flux-containing solder with a wide temperature range and sustained activity to prevent defects.

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Laser Heating Compatible The "EVASOL MYK Series" selects materials suitable for rapid heating by light. It achieves high workability and demonstrates sufficient wettability even with low Ag alloys, allowing for cost reduction. Significantly Reduced Spatter Base materials are selected in accordance with rapid heating and the melting point rise of solder alloys. There is almost no spatter, enabling higher quality mounting. Colorless Residue The residue color is very light, making it suitable for mounted products where appearance is important, such as LED lighting equipment. It also reduces the burden of visual inspection. 【Features】 ■ Laser heating compatible ■ Significantly reduced spatter ■ Colorless residue for a beautiful appearance *For more details, please refer to the PDF document or feel free to contact us.

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- Good wettability even with low Ag The "EVASOL MFJ series" has improved wettability significantly, making it compatible with low Ag alloys. It allows for cost reduction while maintaining work efficiency comparable to 3Ag. - Reduced splatter The base material is selected according to the melting point increase of the solder alloy. This results in less splatter and enables higher quality mounting. - Excellent wettability retention By combining surfactants, the retention of wettability has improved. Stable mounting is possible regardless of the size or type of components. 【Features】 ■ Excellent wettability even with low Ag ■ Minimal splatter ■ Improved wettability characteristics *For more details, please refer to the PDF document or feel free to contact us.*

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Compatible with aluminum wire The "EVASOL C601 series" can be used for soldering aluminum wire, such as that used in HDD actuators, with a soldering iron. Prevention of electrolytic corrosion Electrolytic corrosion that occurs between aluminum materials and solder is prevented by added elements, achieving high joint reliability. Good washability Instead of rosin, a water-soluble base material is used. Residues after soldering can be easily washed away with water. 【Features】 ■ Solderable to aluminum ■ High joint reliability ■ Good washability *For more details, please refer to the PDF document or feel free to contact us.

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Powerful wettability The "EVASOL ESK series" uses a special fluorine compound as an active agent. With strong activity, it demonstrates good workability even on difficult base materials such as nickel and brass. Soldering of stainless steel is also possible Even for stainless steel parts that are difficult to solder, hand soldering with a soldering iron and robot soldering are possible. Supports no-clean It suppresses corrosion and ensures reliability after joining. Like general rosin-core solder, cleaning of flux residues is not necessary. 【Features】 ■ Good wettability even on difficult base materials ■ Soldering of stainless steel is also possible ■ Supports no-clean *For more details, please refer to the PDF materials or feel free to contact us.

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Soldering possible with aluminum The "EVASOL EAN series" uses a special fluorine compound as an activator. Even aluminum parts, which are difficult to solder, can be soldered with strong reactivity. New Applications It enables soldering to aluminum wires, which was previously impossible. It allows for the introduction of aluminum wires in a wide range of applications. No-clean compatibility It suppresses corrosion and ensures reliability after joining. Like regular rosin-core solder, cleaning of flux residue is not necessary. 【Features】 ■ Soldering possible with aluminum ■ Enables the introduction of aluminum wires in a wide range of applications ■ No-clean compatibility due to suppressed corrosion *For more details, please refer to the PDF document or feel free to contact us.

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Colorless Residue The "EVASOL 8860 Series" selects a colorless base material to suppress the coloring of residues. There is no discoloration over time, and a beautiful appearance of the assembly is maintained. Electrical Insulation at High Temperatures By optimizing the type and amount of surfactants, insulation is maintained even at high temperatures. This prevents malfunctions in LED lighting equipment used in harsh environments. Compatible with Low Ag It is compatible with low Ag alloys and has already been adopted in practice. This reduces the impact of fluctuations in metal prices and enables cost reduction. 【Features】 ■ Residue is colorless, providing a beautiful appearance ■ Compatible with low Ag alloys ■ High insulation even at high temperatures *For more details, please refer to the PDF document or feel free to contact us.

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Reduce flux scattering The 'EVASOL 8850 series' does not contain surfactants that cause flux scattering during reflow heating, achieving a reduction in scattering. Good wettability, compatible with low Ag The use of special surfactants allows for the use of low Ag alloys. It achieves both halogen-free and cost reduction. Reduction of chip side balls Due to improved heat resistance of the flux, it easily accommodates low Ag. This reduces the impact of metal market fluctuations and enables cost reduction. 【Features】 ■ Reduces flux scattering ■ Good wettability, compatible with low Ag ■ Reduction of chip side balls *For more details, please refer to the PDF document or feel free to contact us.

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Compatible with laser methods The 'EVASOL 8239 series' is compatible with light heating methods such as lasers. It suppresses solder balls, which can be problematic during rapid heating, achieving excellent finishing quality. Compatible with printing methods Until now, it has been difficult for solder pastes for lasers to accommodate printing methods. It is now possible to transfer using existing equipment. Compliant with halogen-free standards It does not contain Cl and Br, which are causes of dioxin generation. It complies with most halogen-free standards. 【Features】 ■ Prevents solder balls ■ Stable viscosity characteristics ■ Compliant with halogen-free standards *For more details, please refer to the PDF document or feel free to contact us.

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Completely Halogen-Free The 'EVASOL 7001 Series' does not contain any halogens, including chlorine (Cl) and bromine (Br). It complies with all current halogen-free standards. Reduction of Voids By adding components that promote the escape of gas within the molten solder, we have reduced the residual voids. High Printing Stability It prevents the reaction between the flux and powder, thereby preventing viscosity changes during continuous printing. Stable mounting is achievable. 【Features】 ■ High continuous printing stability ■ Reduction of voids ■ Compliance with halogen-free standards *For more details, please refer to the PDF document or feel free to contact us.

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The "EVASOL 3700 Series" does not contain any halogens, including chlorine (Cl) and bromine (Br). It is a solder paste that complies with all current halogen-free standards. It uses a special activator that enables rapid heating implementation with light. This reduces slumping during heating and resolves issues with solder balls. Additionally, it prevents the reaction between the flux and the powder. Even with minimal discharge, it achieves high coating stability. 【Features】 ■ Complies with halogen-free standards ■ Prevents solder balls ■ Stable discharge *For more details, please refer to the PDF document or feel free to contact us.

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The "EVASOL 3230 series" is a laser solder paste specially designed to accommodate the mounting of micro components. It uses a special activator that enables rapid heating implementation through light. This reduces slumping during heating and resolves issues with solder balls. Additionally, it prevents the reaction between the flux and powder. Even with minimal dispensing, it achieves high coating stability. 【Features】 ■ Designed specifically for micro components ■ Prevents solder balls ■ Stable dispensing *For more details, please refer to the PDF document or feel free to contact us.

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Enhanced Wetting Performance The 'EVASOL 1001 Series' strengthens the heat resistance of the flux. It prevents wetting defects due to temperature gaps in mixed assembly of large and small components, as well as incomplete melting in fine patterns. High Storage and Printing Stability This technology controls the reactions within the paste at room temperature, preventing degradation during transport and prolonged printing. Good Wetting with Low Silver With improved heat resistance of the flux, good wetting is achieved even with low silver content. This reduces the impact of metal price fluctuations and enables cost reduction. 【Features】 ■ Good wetting performance under a wide range of conditions ■ High continuous printing stability ■ Excellent transport compatibility *For more details, please refer to the PDF document or feel free to contact us.

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The "EVSOL HFC Series" is a completely halogen-free solder with resin. It complies with all current halogen-free standards. It uses special activators other than halogens to ensure wettability equivalent to halogen-containing products. It also demonstrates good wettability for nickel and brass, enabling soldering of a wider variety of components. 【Features】 ■ Completely halogen-free ■ Ensures wettability ■ Compatible with difficult substrates *For more details, please refer to the catalog or feel free to contact us.

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