石川金属 List of Products and Services

Our "Yani-iri Solder (HFC Series)" is completely halogen-free and does not contain any halogens, including chlorine (Cl) and bromine (Br). It complies with all current halogen-free standards. It also demonstrates good wettability for nickel and brass, allowing for soldering of a wider variety of components. Additionally, it uses special activators other than halogens, exhibiting wettability comparable to halogen-containing products.

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Our "Solder with Flux (EYP Series)" focuses on wetting and does not contain Cl and Br, which are causes of dioxin generation, making it compliant with most halogen-free standards. We select materials suitable for rapid heating by light, ensuring sufficient wettability even at low power, thereby reducing damage to mounted components due to heat. We choose base materials in accordance with the rapid heating and the melting point rise of the solder alloy, enabling high-quality mounting with minimal scattering.

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"Sunless Pellet 100" is a solder pot antioxidant that reduces dross in the solder pot and cuts costs. Thanks to its effect in suppressing the oxidation film on the surface of the solder pot, it prevents solder balls caused by the thermal decomposition of the coil wire's urethane coating. Additionally, "Sunless H Pellet 100" is also available, capable of accommodating a wide range of pot temperatures from 250 to 500°C. 【Features】 ■ Reduces dross in the solder pot ■ Prevents solder splatter ■ Accommodates a wide working temperature *For more details, please refer to the PDF document or feel free to contact us.

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【Overview】 Stainless steel is a base material that can be soldered. The Sn in the solder bonds with the Fe and Ni in the stainless steel to complete the joint. The difficulty of soldering is due to the behavior of the oxide film on stainless steel. While the oxide film on stainless steel serves to prevent rust, it also hinders soldering. During soldering, the oxide film on the stainless surface is removed by the flux, but a new oxide film grows due to heat and oxygen in the air. Therefore, it is necessary to complete the soldering in a short time before the oxide film grows too thick. 【Three Features】 - Strong wettability - Stainless steel can also be soldered - Compatible with no-clean *Test reports are also included in the catalog! *We offer solder with flux for stainless steel, so please contact us!

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The details below describe the cracking of flux residues in solder with rosin and solder paste, so please check them.

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The details below describe the cracking of flux residue in solder with flux and solder paste, so please check them.

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The following detailed information describes the flux dispersion in solder paste, so please check it.

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The details below include information regarding "wet defects, bridges, and spikes" in solder with flux, so please check.

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The details below include information regarding "wet defects, bridges, and horns" in solder containing flux, so please check them.

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Void Issues Voids in solder joints are phenomena where gas generated during soldering remains trapped inside the solder joint. According to the industry standard IPC-A-610, voids up to 25% of the joint area are permissible, but for components such as power devices, reducing voids is necessary to improve heat dissipation efficiency and ensure joint reliability. Causes of Voids The causes of voids include: - Air bubbles trapped in non-wet areas - Decomposition gases from residual flux in the solder - Decomposition gases trapped in non-wet areas Measures Against Voids To prevent voids, it is essential to avoid creating non-wet areas on the substrate and components. It is important to manage them properly to prevent deterioration due to oxidation or moisture absorption during storage. Our company offers void-reducing solder paste made from materials with good wettability and low gas generation, so please contact us for more information.

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Issues with Poor Wetting When solder wetting is poor, the bonding area decreases, leading to reduced joint reliability. Causes of poor wetting include issues with the reflow profile and degradation of components and substrates. Concept of the Reflow Profile A method called the "trapezoidal profile" is employed, which involves a long preheating and main heating process. While the heat resistance temperature of components is around 250°C, the melting point of solder is approximately 220°C. By extending the preheating zone, temperature differences due to the size of components are eliminated, preventing wetting failures due to insufficient heat in large components and failures due to overheating in small components. Degradation of Solder Paste During Preheating The typical preheating temperature is between 150°C and 180°C, with a preheating time of 90 to 120 seconds. During preheating, the flux in the solder paste begins to react due to heat, gradually losing its activity and reducing wettability. Therefore, it is ideal to conduct preheating at the lowest possible temperature and for the shortest time, within a range where the component temperature rises to about 240°C during main heating. Wetting Measures with Solder Materials The flux in solder paste contains activators tailored to the preheating and main heating temperatures. Our company offers pastes that demonstrate good wettability across a wide range of preheating temperatures and various components.

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Corresponds to 6% Flux Thanks to advanced manufacturing technology, it can handle a high flux amount of 6% while being extremely fine wire. It achieves stable mounting with excellent wettability. Capable of Micro Supply It enables micro supply of about 1/10 of the previous amount. This significantly reduces the difficulty of robotic soldering for small components. Wide Range of Applications It has a rich track record of adoption across a wide range of applications. It contributes to the miniaturization of various mounted products and stabilization of quality. 【Features】 ■ Corresponds to 6% Flux ■ Capable of Micro Supply ■ Wide Range of Applications *For more details, please refer to the PDF document or feel free to contact us.

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Copper erosion and fine wire erosion This phenomenon occurs when soldering coil wires for relay components, earphones, microphones, etc., causing the wire to become thinner. Depending on the severity, it can lead to defects such as wire breakage. Causes of copper erosion Copper erosion occurs when the copper in the coil wire forms compounds with Sn in the solder and diffuses into the solder. Pb-free solder contains a higher amount of Sn, making it more susceptible to erosion. Countermeasures for copper erosion By adding a large amount of Cu to the solder alloy, it is possible to reduce the diffusion rate of Cu from the coil wire, thereby decreasing copper erosion. We offer solder with resin for copper erosion countermeasures and bar solder, so please contact us for more information.

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Background Copper is widely used in automobiles and electronic components, but its price has significantly increased from July 2020 to the present. The rising demand for copper due to the proliferation of electric vehicles (EVs) is one factor driving up prices. Consequently, there is an accelerating movement to switch the materials of busbars and coils from copper to aluminum. Furthermore, the aspect of weight reduction is also drawing attention to the transition from copper to aluminum. → From copper to aluminum For details on dip soldering to aluminum coils, please see the information below.

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Using a special activator that enables rapid heating implementation with light. It reduces sagging during heating and solves issues with solder balls.

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Using a flux with high melting viscosity, it is compatible with rapid heating implementation by light. It suppresses the flow out of the flux during heating, resulting in a good appearance after implementation.

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This is a solder paste that uses high-strength solder alloy. It is suitable for mounting in areas where reliability is required, such as automotive electronic components. It uses a special activator that enables rapid heating implementation with light. This reduces slumping during heating and resolves issues with solder balls.

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High Melting Point Alloy Compatible B280P3202J This is a solder paste of the high melting point type. It is ideal for mounting components with high heat generation, such as power semiconductors. The viscosity is adjusted to match the high density of high-temperature solder, allowing for stable application.

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This is a high melting point type of solder paste. It is ideal for mounting components with high heat generation, such as power semiconductors. It has good adhesion after printing and suppresses solder ball formation during heating. This allows for more stable mounting.

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Rich automotive track record For over 15 years since its release, it has been used by many users, including those in the automotive sector. For screen printing - Chip stand-off prevention type "BT02B878C" The metal composition expands the melting point by adding silver to the eutectic solder, preventing the chip stand-off phenomenon. It increases the adhesive properties of the binder, suppressing the movement of small chips. As a silver-containing effect, it also prevents silver dissolution, improving solder joint strength, thereby enhancing mounting quality. - Standard type "BH63B878C" Developed a solder paste that achieves no-cleaning using conventional reflow. Compared to nitrogen reflow furnace compatible solder paste, it exhibits almost the same characteristics, but since the solid content in the flux is slightly higher, there is a minor drawback in pin contact performance. *For more details, please refer to the PDF document or feel free to contact us.*

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Powerful wettability Special fluorine compounds were used as surfactants. With strong activity, it shows good workability even on difficult base materials such as nickel and brass. Soldering possible on stainless steel Soldering by hand with a soldering iron and robotic soldering is possible even for stainless steel parts that are difficult to solder. Supports no-clean Corrosiveness is suppressed, ensuring reliability after joining. Like general rosin-core solder, cleaning of flux residues is not necessary. 【Features】 ■ Good wettability even on difficult base materials ■ Supports no-clean ■ Soldering possible on stainless steel *For more details, please refer to the PDF document or feel free to contact us.

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Good wettability and low spattering Special surfactants achieve both wettability and low spattering. High-quality soldering is possible with various mounted products. Rich automotive track record For over 25 years since its launch, it has been used by many users, including in the automotive sector. *There are three types of rosin-containing solder available depending on the application. GXM Series Standard product of the Super Rojin series. It has a good balance of wettability, low spattering, and reliability, and is widely used in automotive electronic components, home appliances, and consumer products. GXR Series The most reliable product in the Super Rojin series. It is ideal for mounting products that prioritize reliability, such as automotive circuit board components and industrial equipment. GXB Series The product with the highest wettability in the Super Rojin series. It has good wettability even for difficult substrates like brass and is used in switch components. *For more details, please refer to the PDF document or feel free to contact us.

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Halogen-free standard compliant No Cl or Br added, which are the causes of dioxin generation. Complies with most halogen-free standards. Ensured wettability Special surfactants other than Cl and Br are added. It demonstrates good wettability while complying with halogen-free standards. Reduced scattering The use of special surfactants has reduced scattering. It helps to minimize substrate contamination and ensures higher assembly quality. 【Features】 ■ Excellent wettability ■ Significantly reduced scattering ■ Halogen-free standard compliant *For more details, please refer to the PDF document or feel free to contact us.

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Soldering to aluminum wire is possible. Due to the strong oxide film on the aluminum surface, it was difficult to remove with flux, but this product can remove the oxide film, making soldering possible. No cleaning process is required. Although it is a highly active flux, it only activates during soldering (at high temperatures), so no cleaning process is needed after soldering. No prior removal of the urethane coating is necessary. For some aluminum coil wires, the heat from the solder and the flux can remove the urethane coating, allowing soldering to aluminum wire with the urethane coating removed. Therefore, there is no need to separate the coating removal and soldering processes, which increases productivity. 【Features】 ■ Removes the oxide film on the aluminum surface ■ No cleaning process required ■ No prior removal of the urethane coating necessary

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Support for aluminum wire It can be used for terminal processing of aluminum wire, which is rapidly spreading to air conditioner compressors and other applications, through a dip tank. Prevention of electrolytic corrosion Electrolytic corrosion that occurs between aluminum materials and solder materials is prevented by added elements, achieving high joint reliability. High work stability It suppresses the occurrence of dross, which is particularly problematic in terminal processing of aluminum wire. This reduces the number of times the solder tank needs to be replaced, ensuring work efficiency. 【Features】 ■ Reduction of dross caused by aluminum ■ Support for terminal processing of aluminum wire ■ High joint reliability *For more details, please refer to the PDF document or feel free to contact us.

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Completely Halogen-Free No halogens, including chlorine (Cl) and bromine (Br), are added. It complies with all current halogen-free standards. Prevention of Solder Balls Uses a special activator that enables rapid heating implementation by laser. Reduces sagging during heating and solves the solder ball issue. Stable Dispensing Prevents reactions between flux and powder. Achieves high coating stability even with minimal dispensing. 【Features】 ■ Prevention of solder balls ■ Stable dispensing ■ Compliance with halogen-free standards *For more details, please refer to the PDF document or feel free to contact us.

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Halogen-free standard compliant Does not contain Cl and Br, which are the causes of dioxin generation. Complies with most halogen-free standards. Prevention of solder balls Uses a special activator that enables rapid heating implementation by laser. Reduces slumping during heating and resolves solder ball issues. Specialized for micro components Designed specifically to accommodate the implementation of micro components. Addresses challenges unique to micro components. 【Features】 ■ Prevents solder balls ■ Compatible with light heating of narrow pitch terminals ■ Complies with halogen-free standards *For more details, please refer to the PDF materials or feel free to contact us.

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Corresponding to the cleaning process The "EVASOL 8825 series" uses materials with high compatibility with solvents based on flux. It improves the cleanability of flux residues. Compliance with halogen-free standards It does not contain chlorine (Cl) or bromine (Br), which can cause dioxins, and complies with the halogen-free standard J-STD-709. High printing stability It prevents the reaction between flux and powder, thereby preventing viscosity changes during continuous printing. Stable mounting is possible. 【Features】 ■ Good cleanability ■ High continuous printing stability ■ Good wettability *For more details, please refer to the PDF document or feel free to contact us.

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Corresponding to the cleaning process The 'EVASOL 8820 series' uses materials with high compatibility with solvents based on flux. It improves the cleanability of flux residues. Good wettability It uses special surfactants and demonstrates wettability equivalent to that of standard no-clean solder paste. High printing stability It prevents the reaction between the flux and powder, preventing viscosity changes during continuous printing. Stable mounting is possible. 【Features】 ■ Good cleanability ■ High printing stability ■ Good wettability *For more details, please refer to the PDF document or feel free to contact us.

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Adoption of low melting point solder alloy The "EVASOL 7610 series" has been specially designed to accommodate the mounting of heat-sensitive components. It addresses the unique challenges associated with non-heat-resistant parts. Compatible with low-temperature reflow It demonstrates good wettability even at low temperatures of 160°C. This prevents soldering defects and enhances reliability. Compliant with halogen-free standards It does not contain Cl or Br, which are the causes of dioxin generation. It complies with most halogen-free standards. 【Features】 ■ Good wettability ■ Compatible with low-temperature reflow ■ Compliant with halogen-free standards *For more details, please refer to the PDF document or feel free to contact us.

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Compatible with ICT testing The 'EVASOL 6001 series' uses a special base material in the flux to reduce residue levels. It demonstrates a high vertical rate in ICT testing. Good wettability It uses a special surfactant and shows wettability equivalent to products with normal residue levels. High printing stability It prevents reactions between the flux and powder, preventing viscosity changes during continuous printing. Stable mounting is possible. 【Features】 ■ High vertical rate in continuity testing ■ High stability in continuous printing ■ Good wettability *For more details, please refer to the PDF materials or feel free to contact us.

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Compatible with laser processing The 'EVASOL 8229 series' is compatible with light heating methods such as lasers. It suppresses solder balls, which can be problematic during rapid heating, achieving excellent finishing quality. Compatible with printing methods Until now, it has been difficult for laser solder pastes to accommodate printing methods. This product is now compatible, allowing transfer with existing equipment. A new operational method By combining light heating and printing, a new operational method has become possible. SMT components such as QFPs can be mounted in a short time without using a reflow oven. 【Features】 ■ Prevents solder balls ■ Compatible with light heating of SMT packages ■ Stable viscosity characteristics *For more details, please refer to the PDF document or feel free to contact us.

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Halogen-free standard compliant The 'EVASOL 7510 series' does not contain Cl and Br, which are the causes of dioxin generation. It complies with most halogen-free standards. Reduced voids By adding components that promote the escape of gas within the molten solder, we have reduced the residual voids. Enhanced wetting performance The heat resistance of the flux has been enhanced. This prevents wetting defects due to temperature gaps in mixed assembly of large and small components, as well as unmelted areas in fine patterns. 【Features】 ■ Halogen-free standard compliant ■ Reduced voids ■ Excellent wettability *For more details, please refer to the PDF document or feel free to contact us.

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Prevention of Flux Residue Cracking The "EVASOL 1500 Series" incorporates a special resin into the flux, providing elasticity to the flux residue. This prevents cracking and the associated decrease in insulation resistance. Good Wetting Properties We have selected the optimal surfactants for synthetic resins, ensuring wetting properties equivalent to those of previous products. High Electrical Reliability We have chosen the base resin and surfactants with a focus on electrical reliability. 【Features】 ■ Prevention of flux residue cracking ■ Good wetting properties ■ High electrical reliability *For more details, please refer to the PDF materials or feel free to contact us.

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Good water washability "EVASOL WSG Series" uses a water-soluble base material instead of rosin. Residues after soldering can be easily washed away with water. Excellent wettability By selecting surfactants tailored to the base material, wettability has been improved. Stable mounting is possible regardless of the type of components. Reduced splatter Thanks to the effects of special surfactants, solder and flux splatter has been reduced. This enables the assurance of higher mounting quality. 【Features】 ■ Good water washability ■ Excellent wettability ■ Significantly reduced splatter *For more details, please refer to the PDF document or feel free to contact us.

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Completely Halogen-Free The 'EVASOL HFC Series' does not contain any halogens, including chlorine (Cl) and bromine (Br). It complies with all current halogen-free standards. Ensured Wettability We use special surfactants that are not halogen-based. It demonstrates wettability equivalent to halogen-containing products. Compatible with Difficult Substrates It shows good wettability on nickel and brass. This allows for soldering of a wider variety of components. 【Features】 ■ Complies with halogen-free standards ■ Excellent wettability ■ Compatible with difficult substrates *For more details, please refer to the PDF document or feel free to contact us.

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Laser Heating Compatibility Materials suitable for rapid heating by laser are selected. They exhibit sufficient wettability even at low power, reducing damage to mounted components due to heat. Significantly Reduced Spattering Base materials are chosen to match the rapid heating and the melting point rise of solder alloys. There is almost no spattering, enabling higher quality mounting. No-Clean Compatibility Corrosiveness is minimized, ensuring reliability after joining. Like standard flux-containing solders, cleaning of flux residues is not necessary. 【Features】 ■ Good wettability even on difficult substrates ■ Significantly reduced spattering ■ No-clean compatibility *For more details, please refer to the PDF document or feel free to contact us.

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Joint development with Denso Specialists in automotive electrical components fully cooperate in specification formulation and product evaluation. Achieving high levels of reliability and workability. Prevention of residue cracking The residue has flexibility, preventing cracks from thermal shock and vibrations. Cost reduction is possible by omitting the coating process. Compatible with various methods Compatible with various methods such as hand soldering, soldering robots, and lasers. Widely adaptable to diversifying mounted products. 【Features】 Prevention of residue cracking, no coating material required Compatible with laser heating methods Good workability *For more details, please refer to the PDF materials or feel free to contact us.

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With the miniaturization of various implemented products and the fine-pitching of circuit boards, precise adjustments in solder supply amounts are required. Ultra-fine solder is used in small components such as camera modules, OIS modules, and fine cables. Our ultra-fine solder with flux can accommodate wire diameters down to 0.10mm and can also have a flux content of 6%. This allows for more precise adjustments in solder supply amounts and significantly expands the range of applications. It is possible to create ultra-fine wires with various types of flux-cored solder, including anti-splash flux-cored solder and stainless steel-compatible flux-cored solder. *For more details, please feel free to contact us.

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The dross generated during soldering is primarily composed of solder, with the solder alloy being trapped in an oxidized state. By using our dross recycling device, after inputting the dross, you can easily extract solder from the dross by simply pressing the warm-up and separation start buttons. The solder separated from the dross can sometimes be reused, allowing for cost savings. The usage is not complicated, so no special training or knowledge is required to operate it. Many users are already utilizing this device. *For more details, please feel free to contact us.*

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The particle size of solder powder used in solder paste must be selected appropriately according to the mounted components. As miniaturization of components used in small mounted products progresses, it is necessary to narrow the inner diameter of the metal mask openings and dispensing nozzles to stably apply a small amount of solder to the mounting substrate, which requires the use of fine powders. Fine powders not only have a smaller diameter but also have an increased surface area per unit weight. As a result, issues arise such as: - Decreased wettability - Increased solder balls - Decreased stability during use (continuous application) These challenges necessitate the development of specialized fluxes to address them. We offer a syringe-type solder paste using Type 5 (10-25) powder, which resolves the above issues, and it has already been adopted by our users. *For more details, please feel free to contact us.

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Applications of Low Melting Point Solder Low melting point solder is used for the assembly of heat-sensitive components such as camera modules. Until now, these components have been retrofitted using resin-based solder, but further efforts are being made to lower temperatures and automate processes through the use of low-temperature solder and laser heating. Challenges of Low Melting Point Soldering Low melting point solder requires dedicated flux that matches its melting point, so it cannot be directly applied to what is currently in use. Additionally, since the alloy contains bismuth, caution is needed when using it in areas that require high reliability, such as automotive parts, medical devices, and industrial equipment. Ishikawa Metal's Low Melting Point Solder We already offer a variety of syringe-type solder pastes with proven market performance, including halogen-free syringe-type solder paste, so please contact us for more information. *For more details, feel free to contact us.*

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About the Price and Characteristics of Aluminum The price of aluminum is about one-third that of copper, which can reduce procurement costs. Additionally, its weight is also about one-third, allowing for a reduction in transportation costs and environmental impact related to delivery. The characteristics of aluminum are that it is both ecological and economical. Soldering Aluminum We have made it possible to solder aluminum, which has been difficult until now. The surface of aluminum has a strong oxide film, and common fluxes cannot remove this oxide film. No-Clean Compatibility In our tar-containing solder EAN series, we have successfully used a special fluorine compound activator to remove the strong oxide film on aluminum. Just like our previous tar-containing solders, it can be used without the need to clean flux residues. *For more details, please feel free to contact us.

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Infrared lasers are used for soldering. There is a characteristic that organic materials have a higher absorption rate than metals. As a result, during soldering, the temperature of the flux becomes higher, and phenomena such as the evaporation or degradation of the flux can be observed before the solder alloy reaches the required temperature. Laser soldering faces the following challenges associated with optical heating and rapid heating over a short period of time: - Insufficient wetting - Flux and solder scattering - Decreased laser output due to lens contamination For laser soldering materials, specialized rosin-core solder and solder paste are available. In the case of rosin-core solder, using a base material that is less volatile can help, and for solder paste, adding materials that are less prone to thermal sagging at high temperatures can address these issues. We offer solder materials tailored to various mounting forms such as point soldering, SMT, printing, and dispensing, so please feel free to contact us. *For more details, please do not hesitate to contact us.

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In the case of solder materials, halogens such as Cl and Br are used in the flux to enhance the wettability and workability of the solder. However, incinerating electronic substrates containing halogens like Cl and Br can produce harmful dioxins to living organisms. To address this issue, the regulation of halogens used in electronic substrates is what is meant by halogen-free. Our company offers a variety of rosin-containing solder and solder paste that meet various halogen-free standards, so please feel free to contact us. 【Product Introduction】 ■ Rosin-containing solder → High reliability, halogen-free standard compliant HRK series ■ Rosin-containing solder → Completely halogen-free type HFC series ■ Solder paste (bottle) → Splash prevention, halogen-free standard compliant type 8850 series ■ Solder paste (bottle) → Completely halogen-free standard compliant 7100 series *For more details, please feel free to contact us.

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