ソーラーリサーチ研究所 List of Products and Services

A non-contact tweezers that transports wafers and chips to a designated location without contact by attaching a handle with a valve to a Bernoulli chuck that transports wafers by ejecting gas, allowing for manual operation of the valve like a pair of tweezers. Since it is non-contact, it does not scratch the wafers and allows for easy non-contact transportation.

• Other semiconductor manufacturing equipment
• Substrate transport device (loader/unloader)
• Other assembly machines

The "SRL Float Chuck PF Type" preform lens transfer device is a system that retrieves preform lenses from a press machine in a completely non-contact manner during the press molding process. By ejecting air, it generates negative pressure through the ejector effect and Bernoulli effect, as well as positive pressure through the pressure chamber type air cushion effect and the airflow cushion effect, allowing the lens to be suspended and transported in a non-contact state while floating in the air. This non-contact loading and unloading device for preform lenses, "SRL Float Chuck PF Type," does not come into contact with the lens surface or the lens edge. As a result, it does not scratch or dirty the lens surface and side edges, and it also prevents dust generation.

• lens
• Other physicochemical equipment
• Semiconductor inspection/test equipment

Transfer and handle the φ300mm high refractive index glass wafer non-contact using tweezers through manual operation, without bending, applying stress, or causing scratches and dirt.

• Other semiconductor manufacturing equipment
• Wafer
• Wafer processing/polishing equipment

The non-contact tweezers for proto carriers remove or store thin wafers and warped wafers from or to the proto carrier without contact.

• Other conveying machines
• Semiconductor inspection/test equipment
• Pneumatic Equipment

◎Features 1. Sends out laminated films one by one. 2. Transports without the tip drooping. 3. Laminates with high precision. 4. Prevents scratches and dirt from adhering. 5. Does not apply stress. 6. Does not generate static electricity.

• Other conveying machines

We have developed a non-contact transfer device for microchips, the "Float Chuck SA-□1.0 type," which handles micro wafer chips ranging from 1.0mm to 15mm without contact. This device generates negative pressure through the ejector effect and Bernoulli effect, as well as positive pressure via a pressure-type air cushion, allowing small cut wafer chips to be suspended in the air in a non-contact state for handling and storage in trays. It is capable of transporting, flipping, and tilting the chips without contamination, damage, or pad marks. Features: 1. Capable of non-contact handling and storage of micro wafer chips ranging from 1 to 15mm in size. 2. Chips can be retrieved from the tray without contact. 3. No scratches or dirt will be attached to the chips. 4. No pad marks will be left on the chips.

• Other semiconductor manufacturing equipment
• Pneumatic Equipment
• Other physicochemical equipment

The newly developed "Float Chuck Type C" series further adds and maximizes the effects of inertial force. It adopts a new mechanism for the gas ejection system, significantly increasing the suspension capability compared to conventional technology, while reducing gas consumption by nearly half. As a result, it is being considered for use with heavy loads that were previously avoided due to air consumption issues, particularly for the 8th generation large glass substrates (2200mm x 2200mm) and PDP large glass substrates (2000mm x 2000mm) for non-contact transport. Additionally, the reduction in exhaust gas makes it suitable for use in clean rooms. It excels in holding stability, is resistant to impact, and does not put stress on glass substrates. It is also widely used for the non-contact transport of thin semiconductor wafers.

• Other industrial robots
• Other semiconductor manufacturing equipment
• Other machine elements

The solar cell solar wafers, silicon solar cells, amorphous solar cells, and thin-film solar cell cells are transported non-contact by blowing gas or air. A nozzle is equipped to ensure that the high-speed airflow emitted does not directly collide with the solar cells, and the mechanism prevents damage to the thin, fragile solar cells due to the high-speed airflow. Additionally, the "non-contact transport device for solar cell wafers" uses a small amount of air and is efficient. Furthermore, its structure does not discharge exhaust flow into the surrounding environment, thus preventing pollution.

• Other semiconductor manufacturing equipment
• Other environmental equipment
• Packaging materials

The non-contact transport device for ceramic green sheets, "Float Chuck SAG Type," holds and transports ceramic green sheets in a non-contact manner by blowing air through gas. The "Float Chuck SAG Type" is equipped with a nozzle that prevents high-speed air flow from directly colliding with the green sheet, thereby protecting the thin and fragile green sheets, which are 120μm thick, from damage and breakage due to the high-speed air flow. Additionally, the "Float Chuck SAG Type" uses a small amount of air, making it efficient. ◎ Features 1. Transports and handles ceramic green sheets without contact. 2. Capable of transporting through-hole and perforated sheets. 3. Does not damage or break thin ceramic green sheets of 120μm thickness. 4. Can transport ceramic green sheets without bending them. 5. Low air consumption. 6. Does not pollute the environment.

• Other conveying machines
• Circuit board processing machine
• Pneumatic Equipment

The "Micro 2.0mm Wafer Chip Non-Contact Chuck" generates negative and positive pressure in the gap between the mu chip and the cushion chamber created on the bottom surface by ejecting gas, allowing for the non-contact gripping and transport of micro 2.0mm square IC mu chips. During chip suction, maintaining parallelism between the working surface and the chip is operationally difficult due to the small gap, so this device is designed with a gas ejection nozzle that efficiently generates negative pressure in the small cushion chamber. ◎ Features 1. Capable of non-contact chucking of 2.0mm chips. 2. Non-contact transport of diced wafer chips. 3. Non-contact retrieval of chips from trays. 4. Non-contact holding allows for flipping and tilting of the chip. ◎ Applications 1. Embedded tag IC chips. 2. Event personnel management tag IC chips. 3. Fine wafer chips. 4. Micro lenses. 5. Micro optical devices.

• Other industrial robots
• Wafer processing/polishing equipment
• Wafer

We supply stacked solar cell wafers one by one at high speed without causing damage. By ejecting air from our developed non-contact transport device "Float Chuck SK Type" (patented) installed above the stacked solar cells, a negative pressure is generated in the space with the topmost solar cell wafer, allowing it to be suctioned and floated. The floated solar cell wafer is then moved forward one by one by a transfer mechanism synchronized with the "Float Chuck SK Type." ◎ Adaptability - Multicrystalline silicon solar cell wafers (□125mm, □156mm, □200mm) - Monocrystalline silicon solar cell wafers (□125mm, □156mm, □200mm) - Thin-film solar cells - Amorphous solar cells - Dye-sensitized solar cells - Film-type solar cell paper ◎ Features - Supplies wafers stacked one by one. - No scratches, dirt, or damage. - High-speed delivery (0.5 seconds per wafer). - No double feeding. - Compatible with wafers of any size or thickness.

• Other conveying machines
• Other semiconductor manufacturing equipment
• Pneumatic Equipment

By blowing air toward the workpiece, a negative pressure is generated due to the Bernoulli effect, allowing the workpiece to be held in a non-contact state and transported. It can grip and transport soft and flexible materials such as through-hole substrates, ceramic green sheets, FPC printed circuit boards, and soft, flexible materials like foams, non-woven fabrics, films, and paper.

• Other conveying machines
• Other semiconductor manufacturing equipment
• Paper and pulp products

Can be operated by hand like tweezers. Grabs and transports wafers without contact. Does not allow scratches or dirt to adhere.

• Other semiconductor manufacturing equipment

The wafer is grasped and transported non-contact through manual operation. There are no scratches, dirt, or damage.

• Other semiconductor manufacturing equipment

The "non-contact end effector" generates negative pressure through the Bernoulli effect by ejecting gas, allowing the wafer to be suspended in a non-contact state in mid-air. This hand is designed to be slim, making it ideal for loading and unloading wafers onto carriers. It is equipped with an exhaust recovery device (patented), allowing it to be used in clean rooms. Additionally, it has a positioning mechanism, enabling the transport of aligned wafers.

• Other industrial robots
• Other semiconductor manufacturing equipment
• Pneumatic Equipment

The device is designed to stack sheets such as amorphous solar cells, polarizers, films, sheets, wafers, glass, and paper using a non-contact transport system called "Float Chuck" (patented), which feeds out the stacked sheets one by one while ensuring that no drooping occurs at the leading edge, allowing for precise stacking. In the film feeding section, an "air flow feeding mechanism" (patented) is employed to reliably feed out the films one by one. The transport section utilizes the "Float Chuck," enabling transport without causing drooping at the leading edge of the film during the process. This allows for defect inspection of film reflection and transmission using sensors. The stacking section consists of a "non-contact suspended conveyor" formed by the non-contact transport device "Float Chuck," which drops thin, flexible films in a horizontal state and stacks them accurately at high speed.

• Other conveying machines
• Other semiconductor manufacturing equipment
• Other packaging machines

The new mechanism adopts the "vertical gas jet method." This method allows the gas flow ejected from the nozzle to create a vertical gas jet in the cushion chamber, reducing friction losses of the gas flow within the chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capacity compared to conventional types. This results in improved stability of the holding mechanism, increased resistance to shocks, and nearly halving the gas consumption. The "float chuck" generates negative pressure through the ejector effect and Bernoulli effect by ejecting gas, as well as positive pressure through the pressure-type air cushion effect, allowing the workpiece to be suspended in a non-contact state while floating in the air, enabling transportation, inversion, and tilting.

• Wafer
• CVD Equipment
• Articulated Robot

The Float Chuck LE type suspends and transports lenses and spheres in a non-contact state by blowing air, allowing them to float in the air. This prevents scratches and contamination on the lens surface, as well as dust generation. Additionally, the "Float Chuck LE type" is equipped with an adjuster, which allows for the chucking of lenses with different curvatures in a non-contact state using a single model. As a result, there is no need to change models based on lens curvature, significantly improving productivity and enabling cost-effective equipment proposals.

• Other conveying machines
• Chuck
• lens

Transport the workpiece non-contact. The air consumption is one-third of the conventional amount. The holding force is strong. It has excellent holding stability.

• Other semiconductor manufacturing equipment
• Chuck
• Plasma Generator

We will suspend and transport micro lenses for camera-equipped mobile phones, digital cameras, medical cameras, and industrial compact cameras in a non-contact state, floating in the air. No scratches or dirt will be attached.

• lens

A "non-contact tweezers" designed for high-temperature operation that allows for the non-contact removal of wafers from a hot susceptor after epitaxial film deposition on semiconductor wafers using a CVD apparatus. It features a handle equipped with a manual valve, enabling gas supply ON-OFF control through valve operation with a hand holding the handle, similar to using tweezers, while the wafers are suspended and transported by a "float chuck" that holds them non-contact by ejecting gas.

• CVD Equipment
• Other machine elements
• Laser marker

●Suction and holding for transport without contact. ●No scratches, dirt, or pad marks will be left. ●Can be used in a clean room. ●Compatible with breathable workpieces, perforated workpieces, and ultra-thin flexible workpieces. ●Can also be used manually.

• Other semiconductor manufacturing equipment
• Wafer
• lens

◎ Features 1. Non-contact handling and transport of ultra-thin warped wafers and plate-like bodies 2. Does not damage the wafer 3. Does not leave any dirt ◎ Applications 1. Warped wafers 2. GaSa wafers 3. Ultra-thin wafers 4. Surface-treated wafers

• Other semiconductor manufacturing equipment
• CVD Equipment
• Heating device