ズース・マイクロテック List of Products and Services

【Features】 ■ Supports all wafer bonding processes including metal diffusion bonding, eutectic bonding, TLP bonding, adhesive bonding, fusion bonding, anodic bonding, and glass frit bonding. ■ Compatible with wafers and substrates ranging from 100mm to 200mm in diameter, and stacking thicknesses up to 6mm. ■ Achieves high-precision post-bond alignment accuracy through the combination of a high-precision bond aligner module XBS200 and an innovative transport mechanism. ■ Control of the bonding environment through vacuum or gas atmosphere control.

• Sensors
• Memory

The ZUSE Microtech high-load wafer bonder XB8 is the latest wafer bonder with a maximum load of 100 kN, capable of processing various sizes and materials of wafers and substrates up to 200 mm. It flexibly accommodates various bonding processes such as metal diffusion bonding, eutectic bonding/TLP bonding, adhesive bonding, and fusion bonding, making it an ideal wafer bonder for a wide range of applications including advanced MEMS, LEDs, and 3D integration.

• Bonding Equipment
• Wafer processing/polishing equipment

【Features】 - Supports all wafer bonding processes including metal diffusion bonding, eutectic bonding, TLP bonding, adhesive bonding, fusion bonding, anodic bonding, and glass frit bonding. - Accommodates wafers and substrates up to 200mm in diameter and stacking thicknesses up to 6mm. - Achieves high-precision post-bond alignment accuracy through the combination of a transport fixture with a clamping mechanism and the SUSS BA6/8 bond aligner. - Control of the bonding environment through vacuum or gas atmosphere control.

• Other processing machines

■ This is a wafer detachment device necessary for thin wafer transport/process. ■ It supports various wafer sizes from 3" to 300mm, with room temperature and mechanical wafer detachment.

• Wafer processing/polishing equipment
• Bonding Equipment

■ This is a wafer detachment device necessary for the transport/process of thin wafers. ■ It supports various wafer sizes up to 300mm, using room temperature and laser-based wafer detachment.

• Sensors
• Memory

In-house developed diffraction light reduction optical system, adopting WEC system.

• Other processing machines

In-house developed diffraction light reduction optical system, adopting WEC system.

• Other processing machines

In-house developed diffraction light reduction optical system, adopting WEC system.

• Other processing machines

By docking our mask aligner module with the full-area exposure method, it can be used as the Ring Graphy Cluster LithoFab200.

• Other processing machines

Wafer-level packaging for mass production and 3D integration.

• Other processing machines