テクニスコ List of Products and Services

We would like to introduce our products by category. Our company handles metal products and glass products, providing "heat sinks" for optical communication and high-power semiconductor lasers, as well as "medical glass products" for imaging equipment and sensors. Additionally, by performing cross-edge processing, we offer products that match our customers' needs from element development to prototyping. 【Products We Handle】 ■ Metal Products - Carriers/Mounts - Various Submounts - Seamless Heat Sinks ■ Glass Products - Glass Microfabrication Products - BT Products *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Contract
• Other processing machines

The "Mount/Carrier" is a heat sink that can be used in markets and applications such as industrial lasers, optical communications, and digital devices. Our company can manufacture carriers of various qualities tailored to your needs, utilizing advanced technologies in-house, including shape processing, plating, vapor deposition, and soldering, from general-purpose C-mounts to fully customized products. 【Precision】 ■ Surface roughness: Ra<0.4 ■ Warpage: 5μm or less ■ Edge R: 10μm or less, 50μm or less, 80μm or less *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements

The "High Pressure Resistant Seamless Microchannel" is a heat sink with a monolithic structure that has no joints. By applying coatings such as plating to the fine internal flow paths, corrosion resistance is improved, allowing for a longer lifespan as a module. Additionally, it can be utilized as an efficient heat conductor by circulating solutions or gases. Furthermore, leveraging its ultra-pressure resistance, it can also be used as a mixing device or analytical device in the bio-medical field. 【Features】 ■ Compatible with 3D flow paths ■ Realization of plating treatment for internal flow paths ■ Customization of external dimensions and flow path design ■ Seamless (no joints) construction *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements

The glass substrate product "Microchannel Glass" uses glass with excellent heat resistance and chemical resistance. It allows for highly flexible 3D channel design. 【Features】 ○ Supports 3D channels ○ Custom design for channels is possible ○ Uses glass instead of PDMS resin → Employs glass with excellent heat resistance and chemical resistance ○ Achieves transparent processing of channel machining surfaces → Measurement and observation from the top, bottom, and sides of the microchannel glass are possible *For more details, please contact us or download the catalog.

• Glass

High-precision cavities are formed inside the glass substrate. The window section can be made thin and transparent, allowing laser light and LED light to pass through without distortion, making it suitable for applications such as observation with an immersion microscope through the window. By shielding the glass sidewalls, unnecessary light can also be blocked. By implementing three-dimensional wiring from the bottom to the top of the glass, reliability can be improved while maintaining transparency. This also allows for a review of the assembly process, leading to space-saving solutions. 【Features】 - Transparent processing of the cavity bottom is possible - Metallization on the sidewalls is possible - Three-dimensional wiring shapes are possible *For more details, please contact us or download the catalog.

• Glass
• Processing Contract
• Surface treatment contract service

"Small diameter hole glass" is processed using glass chipping-free processing technology. In hard glass substrates such as borosilicate glass, chipping of several tens of micrometers can easily occur on the processing surface during groove or hole processing, which poses a significant quality issue. By using Technisco's chipping-free processing technology, it is possible to keep the chipping level below 10 micrometers when using glass substrates as WLP (wafer-level packaging) along with semiconductor substrates or when dicing at the device level. Furthermore, it is possible to eliminate chipping through post-processing. 【Features】 ○ Small diameter hole processing ・Achieves a minimum diameter of 0.1 mm ○ Compatible with wafers up to 300 mm in diameter (For some processing, compatibility is up to 200 mm) ○ Suppresses burrs around the hole area ○ Reduces chipping ・Can accommodate chipping levels of ≤10 μm *For more details, please download the catalog or contact us.

• Glass

"Spacer glass" is processed using glass chipping-free processing technology. In hard glass substrates such as borosilicate glass, chipping of several tens of micrometers can easily occur on the processing surface during notching or hole processing, which poses a significant quality issue. By using Technisco's chipping-free processing technology, it is possible to keep the chipping level below 10 micrometers when using glass substrates as WLP (Wafer Level Packaging) along with semiconductor substrates, or when dicing at the device level. Furthermore, post-processing can eliminate chipping. [Features] - Suppression of flaring around holes - Reduction of chipping - Capable of handling chipping down to ≦10μm - Removal of microcracks generated during glass processing, controlling particles - Reduces operational failures caused by particles after bonding with MEMS devices *For more details, please download the catalog or contact us.

• Glass

The "Cu-AlN-Cu submount" is a submount designed for high-power semiconductor lasers. The three-layer structure of Cu-AlN-Cu achieves both high thermal conductivity and insulation. Additionally, by optimally controlling the thickness of the Cu plating layer in terms of thermal expansion rate, it enables CTE matching with LD elements, facilitating higher power output and longer lifespan. Moreover, the design allows for a high degree of freedom in shape. 【Features】 ■ Ensures high thermal diffusion and insulation through the composite structure of Cu plating and AlN ■ Controls the coefficient of thermal expansion (CTE) ■ No pullback required at the critical edge of the LD mounting surface ■ Compatible with AuSn and AuGe solder deposition ■ Sharp edges improve the alignment of LDs ■ Thick Cu application possible (less than 100μm) *For more details, please refer to the PDF document or feel free to contact us.

• alloy

The "CuW Submount" is a submount for heat sink applications of high-output LD modules. It allows for control of sharp edges and warping to achieve alignment during LD bonding and efficient heat dissipation. Additionally, it enables control of excess solder during AuSn deposition in the LD bonding area. 【Features】 ■ Control of sharp edges and warping is possible ■ Control of excess solder is possible ■ Suitable for high-output semiconductor lasers *For more details, please refer to the PDF document or feel free to contact us.

• Solder

Multiple through holes of 0.2mm square were processed into 0.5t Pyrex glass, creating a mesh-like structure. This processing technology was developed for mass production and can accommodate various quantities. 【Features】 ○ Numerous through holes processed at 0.1mm × 0.1mm ・ (Example) 150,000 holes on a 3-inch wafer ○ Selection of through hole shapes possible with a high aspect ratio (1:8 to 10) ・ Supports straight and tapered shapes ○ Achieves chip-on-glass ・ Improved contact performance during anodic bonding with Si *For more details, please download the catalog or contact us.

• Glass

"Cross-edge microfabrication" refers to a processing method that combines two or more different types of processing within the manufacturing of a single product. The five core processing techniques are "cutting, grinding, polishing, metallizing, and joining." At our company, we propose solutions that match our customers' needs by considering "quality, cost, and mass production" through composite processing technology that crosses these five advanced techniques. [Features] ■ Maintains stable quality ■ Achieves processing with short lead times ■ Provides cost-effective services ■ Solves customer challenges by developing innovative products through the combination of multiple processes *For more details, please refer to the PDF document or feel free to contact us.

• Glass
• Other processing machines
• Processing Contract

Glass microchannels (minimum 50μm) can be produced using borosilicate glass and quartz glass. The bottom surface is transparent, and sharp edge shapes can be achieved. Furthermore, since it is made solely of glass without the use of any organic materials such as adhesives, it excels in transparency, chemical resistance, and heat resistance. 【Main Features】 - Can be produced using borosilicate glass and quartz glass - The bottom surface is transparent, and sharp edge shapes can be achieved - Made solely of glass without the use of any organic materials such as adhesives - Excellent transparency, chemical resistance, and heat resistance For more details, please download the catalog or contact us.

• Processing Contract
• Other processing machines

Our company is engaged in the development and manufacturing of products using composite processing technology that combines techniques such as cutting, grinding, polishing, metallizing, and bonding. Among these, the "Undercut Bottom Transparent Processing" can finish the undercut bottom surfaces of glass materials such as Pyrex, Tempax, and quartz to a mirror-like state. The improvement in transparency allows for clearer observation from the outside, making it useful in fields such as bio and medical applications. 【Features】 ■ Metallization on side walls prevents light interference and absorption ■ Hole diameter, hole shape, and undercut depth can be freely set ■ Compatible with wafers up to φ200mm ■ Glass thickness can be set from 0.1 to 0.15mm to match the focal length of liquid immersion lenses *We are currently offering materials introducing our microfabrication technology! You can view more details from the 【PDF Download】. ★ We will be exhibiting at "CEATEC JAPAN 2018" ★

• Processing Contract
• Other processing machines

This is an announcement from Technisco Co., Ltd. regarding the "Cross Edge Micro Machining [Micro Channel Cooler]."

• others

This is an announcement from Technisco Co., Ltd. regarding the "Cross Edge Micro Machining [Ultra Pressure Resistant Compact Water-Cooled Heat Sink]."

• others

Teknisco specializes in fine chip processing at the level of 200μm□ to several millimeters□. We can achieve sharp edges and finish burrs to a level of less than a few micrometers, as well as perform complex cutting processes on special metals known as difficult-to-cut materials, such as CuW, Kv, Ag, Mo, and Cu. Additionally, we can accommodate Ni/Au plating, AuSn deposition, partial plating, and pattern metallization. 【Features】 - Realization of ceramic coating treatment on metal materials - Solder bonding of various components - Support for AuSn and AuGe deposition on various heat sinks (ceramic, metal parts, assembled parts) - Burrs < 5μm *For more details, please refer to the PDF document or feel free to contact us.

• others
• Processing Contract
• Other metal materials

We use a material with the same thermal expansion rate as silicon wafers to reduce slip occurrence on the wafers.

• others

This product features numerous electrically conductive metal via-holes formed within borosilicate glass substrates such as Pyrex and Tempax. It can accommodate substrates up to a maximum diameter of 8 inches. It has good flatness and airtightness, making it suitable for anodic bonding for sealing silicon-based devices. 【Features】 ○ Capable of anodic bonding with silicon wafers Solves outgassing issues by enabling anodic bonding without the use of adhesives. ○ Excellent high-frequency characteristics - Ensures low stray inductance and low electrical resistance of vias. - Achieves high insulation compared to silicon by using glass as the base material. ○ Designed to function as a heat sink - Allows the vias to serve as thermal vias by incorporating silicon. ○ Transmits visible light - Enables confirmation of bonding points and transmission of optical signals. ○ Compatible with wafers up to Φ200mm. *For more details, please download the catalog or contact us.

• Glass

Our company offers glass processing that excels in transparency, chemical resistance, and heat resistance. The glass we recommend includes high-transparency quartz glass, Tempax glass, and others. 【Features】 ◎ Ultra-thin polishing possible from 0.1 to 0.15 mm → Enables observation of previously unobservable cells, proteins, DNA, etc. ◎ Enables analyses and liquid delivery to microchannels that were previously impossible 【PDMS (silicone resin)】 ◎ Anodic bonding (adhesive-free) with Si (silicon) is possible 【Tempax glass】 → No concerns about adverse effects on cells, etc., caused by adhesives ◎ Capable of producing microchannel products with groove widths of 30 to 50 μm, high aspect ratio channel products (width 100 μm, depth 800 μm), and channel products with vias (which allow for electrical control through electrophoresis by embedding vias) 【Channel products】 　　＼Please make use of the wonderful properties of glass in your bioanalysis and research／ *For more details, please contact us or download the catalog (PDF).

• Glass
• Processing Contract
• Surface treatment contract service