It is a versatile and compact device that enables etching, ashing, and ion cleaning!
The "Ashing Device" is a mass production equipment capable of fully automated continuous processing of substrates up to a maximum of 12 inches in diameter. It is a versatile device that enables etching, ashing, and ion cleaning by switching gas types and plasma modes. 【Features】 ■ Switchable between RIE mode and DP mode ■ Reduced metal contamination through special surface treatment ■ Compact footprint ■ Independent application of two frequencies ■ Ultra-low temperature cooling stage Multi-chamber specifications, as well as custom designs for square substrates, can also be manufactured. *Please also refer to the PDF materials. *Feel free to contact us.
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basic information
【Specifications】 ■Board size: Maximum φ12 inches ■Plasma source: CCP type ■Vacuum exhaust ・Low vacuum process: MBP+DP ・High vacuum process: TMP+DP ■Pressure control: APC control ■Process gases: F series, Cl2, Ar, O2, others *Please also refer to the PDF materials. *Feel free to contact us.
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Applications/Examples of results
【Applications】 ■Semiconductors ■MEMS ■Electronic components *Please also refer to the PDF materials. *Feel free to contact us.
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Japan Create has been challenging cutting-edge technologies to respond to the diversification of the semiconductor industry with high precision, labor-saving, and miniaturization. We seek infinite possibilities in high technology and create reliable know-how that matches user needs with our uniqueness. We will continue to strive towards high-level technology.
![[Case Study] Plasma Analysis of "Particle-PLUS" Dual Frequency CCP](https://image.mono.ipros.com/public/product/image/aec/2000679537/IPROS56625809199193232139.jpeg?w=280&h=280)
