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High-temperature ion implantation suitable for the fabrication of devices such as SiC, as well as high-temperature annealing processes for dopant activation, are available!
Achieving high-precision overlay of approximately 30μm, as per the customer's printing conditions, through automatic correction!
An explanation of the basic knowledge and use cases of flexible hybrid electronics (FHE). Introducing technologies that are useful for the development of next-generation electronic devices.
【Production Achievements】We incorporated requests and handled design, casing, circuits, and mold arrangements!
Hollow neutrons and complex-shaped castings can be easily produced! *Catalog with case studies available.
We propose a one-of-a-kind product tailored to our customers' needs with original ideas. *Company brochure available.
【Quality UP】Improving durability by avoiding welding at stress concentration points.
Not just circuit board assembly! Fujita Seisakusho Group's circuit board design and development services.
We provide cutting and bending processing of stainless steel and titanium materials. Our state-of-the-art equipment and skilled craftsmanship strongly support our customers' needs.





























































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