List of Electronic Components and Modules products
- classification：Electronic Components and Modules
3886～3900 item / All 61261 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Support from product planning to filling, processing, and shipping for additives, cleaning agents, chemicals, deodorizing and disinfecting agents, etc.! For those who have raw materials but no place t...
- Other consumables
- Processing Contract
We provide advanced technology and prompt service by skilled staff!
- Power Supplies
- EMC countermeasure products
- Control Panel
From the smallest batch of one part to large-scale re-implementation! Please leave it to us!
- Other semiconductors
Safely recover and regenerate semiconductor ICs from existing substrates. Solve component supply and cost issues with high-precision rework technology! If you're struggling with delivery times, contac...
- Other semiconductors
30 years of experience in prototype board assembly! An explanation of the advantages and disadvantages of prototype component assembly, along with know-how. Technical materials on underfill BGA rework...
- Circuit board design and manufacturing
【Technical Data Presentation】Achieving 3,000 cases annually! Capable of supporting both eutectic and lead-free! Packed with technical information such as BGA reballing that regenerates solder balls!
- Circuit board design and manufacturing
Especially for substrates that warp significantly, warping suppression is essential! Reproduce the condition of the BGA when warping occurs!
- Other semiconductors
Explaining the basics of "BGA," "reflow," "REACH regulations," and "RoHS directive" in an easy-to-understand manner, which you might be hesitant to ask about now!
- Printed Circuit Board
Using top-class high-performance equipment in the industry! Providing ultra-high-precision machining solutions tailored to customer needs.
- lens
Composite of metal and resin possible with heat alone!
- converter
We will exhibit the resin film and metal laminate "Alset" at the "2024 Automotive Technology Exhibition in Nagoya."
We will be exhibiting our resin film and metal laminated material "Alset" at the "2024 Automotive Technology Exhibition in Nagoya." Since the film is laminated onto the metal, the following functions can be achieved: - Omission of the insulation film lamination process - Omission of the metal painting process - Miniaturization and space-saving of components (reduction of insulation distance) - Compatibility of insulation and heat dissipation (when compared to resin) Expected applications: Capacitor cases, cases for batteries and electronic components, bus bars If the film layer of Alset and the resin to be molded are compatible for thermal welding, the film and molded resin will thermally weld together in the mold, resulting in the following functions after cooling: - Composite of metal and resin using only heat - Weight reduction of metal - Electromagnetic wave shielding capability of resin - Improved heat dissipation Expected applications: ECU and PCU enclosures and components, general automotive components such as battery parts Event dates: July 17 (Wednesday) to July 19 (Friday), 2024 Opening hours: All three days: 10:00 AM to 5:00 PM Venue: Aichi Sky Expo (Aichi Prefectural International Exhibition Center) Booth: 9 Please feel free to stop by!
It is a composite material that strongly laminates metal and resin film without using adhesives. It is suitable for insulation of metal and bonding between metal and resin.
- inverter
Notice of Exhibition Participation: "Automotive Technology Exhibition 2024" (Resin Film and Metal Laminated Material "Alset")
We will be exhibiting our resin film and metal laminated material "Alset" at the "2024 Automotive Technology Exhibition." Since the film is laminated to the metal from the start, it offers the following advantages: - Omission of the insulation film lamination process - Omission of the metal coating process - Miniaturization and space-saving of components (reduction of insulation distance) - Compatibility of insulation and heat dissipation (when compared to resin) Expected applications: Capacitor cases, cases for batteries and electronic components, etc. When the film layer of Alset and the resin to be molded are compatible for thermal welding, the film and molded resin will thermally weld together in the mold and become integrated after cooling. - Composite of metal and resin using only heat - Weight reduction of metal - Electromagnetic wave shielding capability of resin - Improved heat dissipation Expected applications: ECU and PCU enclosures and components, general automotive components such as battery parts Date: May 22 (Wednesday) to May 24 (Friday), 2024 Day 1 and Day 2: 10:00 AM to 6:00 PM Day 3: 9:00 AM to 4:00 PM Location: Booth 244 Please feel free to stop by.
Contributes to the omission of the insulating film lamination process, miniaturization of metal parts, and the addition of electromagnetic wave shielding properties to resins! Development of laminated...
- Capacitor
We will exhibit the resin film and metal laminate "Alset" at the "2024 Automotive Technology Exhibition in Nagoya."
We will be exhibiting our resin film and metal laminated material "Alset" at the "2024 Automotive Technology Exhibition in Nagoya." Since the film is laminated onto the metal, the following functions can be achieved: - Omission of the insulation film lamination process - Omission of the metal painting process - Miniaturization and space-saving of components (reduction of insulation distance) - Compatibility of insulation and heat dissipation (when compared to resin) Expected applications: Capacitor cases, cases for batteries and electronic components, bus bars If the film layer of Alset and the resin to be molded are compatible for thermal welding, the film and molded resin will thermally weld together in the mold, resulting in the following functions after cooling: - Composite of metal and resin using only heat - Weight reduction of metal - Electromagnetic wave shielding capability of resin - Improved heat dissipation Expected applications: ECU and PCU enclosures and components, general automotive components such as battery parts Event dates: July 17 (Wednesday) to July 19 (Friday), 2024 Opening hours: All three days: 10:00 AM to 5:00 PM Venue: Aichi Sky Expo (Aichi Prefectural International Exhibition Center) Booth: 9 Please feel free to stop by!
Capable of responding to high value-added applications utilizing high oxidation power.
- Other electronic parts
Water-soluble cerium compounds used as oxidizing agents and catalyst precursors.
- Fine chemicals (compounds, derivatives, catalysts, etc.)
- Other electronic parts
Support for streamlining parts management! Easy data integration with reading logs from the RFID reading app.
- IC tag