List of Electronic Components and Modules products
- classification:Electronic Components and Modules
1081~1125 item / All 61751 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
For ventilation at construction sites! A portable fan that can be carried with one hand.
- fan
- Ventilation and Exhaust
As a specialized manufacturer of wiring accessories, we respond to a wide variety of needs with reliable products and technology backed by proven results.
- Wiring materials
A workplace where humans and robots collaborate. A safety support system that balances safety and operational efficiency. "N Sensing"
- Other safety equipment
- Safety Sensors
- IC tag
Isn't that AGV stopping too much? Introducing N Sensing, which balances "safety" and "operational rate"!
In smart factories that operate numerous AGVs and AMRs, there is a challenge where increased stops for safety reasons lead to a decrease in productivity. N Sensing is a safety measure system that achieves a balance between "safety" and "productivity" by decelerating or stopping only when an operator approaches. It can also be retrofitted to existing AGVs and has contributed to reducing unnecessary stops in factories where it has been implemented. By combining magnetic fields and radio waves, it reliably detects operators even through obstacles. Since it can identify only individuals carrying tags, it enables operations that minimize unnecessary stops. The detection area can be adjusted from 0.5 to 3 meters, and control signals are output in two stages—outer and inner—depending on the approach situation. This prevents a decrease in operational efficiency due to excessive safety measures. *For more details, please refer to the PDF document or contact us.*
It warns of a 'dangerous' situation when heavy machinery like forklifts gets too close to people.
- Safety Sensors
- IC tag
- Other security
Eliminate unnecessary opening and closing, reducing the number of times the seat shutter opens and closes by up to 90%! Introducing the seat shutter opening and closing eco system!
The eco system for opening and closing sheet shutters, utilizing W Alert technology, automatically detects only authorized vehicles (such as forklifts, AGVs, and carts) and operators, controlling the sheet shutters. By reducing unnecessary openings and closings, it enhances air conditioning efficiency, reduces energy costs, improves the work environment, and simultaneously contributes to the SDGs through the reduction of greenhouse gas emissions. *For more details, please contact us for confirmation.*
The harness alert is a system that alerts workers wearing fall arrest equipment (safety harnesses) to the unused hooks through an alarm.
- IC tag
A high-quality, small-lot specialized EMS partner responsible for the manufacturing of circuit boards for fishing equipment!
- Circuit board design and manufacturing
- EMS
It is a domestic EMS service specialized in high quality, small lots, and low cost, accommodating a variety of products.
- EMS
A super hydrophilic coat that washes away dirt with rain. A curved mirror that reduces cleaning effort and maintains visibility.
- mirror
Check out products and technologies suitable for each field! We offer free materials that are helpful for selecting and designing/developing connection components.
- Other Connectors
Adding new value to beacons. Collecting not only location information but also "work notifications" and "temperature and humidity logs" directly with existing beacon systems.
- Other electronic parts
USB extension and switching
- Web/Video Conference
- LAN construction and wiring work
- Other electronic parts
Flat yet wide-angle. A mirror that can be installed at eye level with zero protrusion.
- mirror
Select the configuration according to measurement items, circuit methods, current capacity, and management scale. It can be gradually expanded from partial introduction of important circuits to manage...
- Sensors
- Chiller
- Injection Molding Machine
A nanofiber manufacturing device capable of producing fibers with a diameter of 50 to 800 nm.
- others
- Other metal materials
- Lithium-ion battery
1.27mm pitch 2-piece connector / flexible stack type
- Other Connectors
1.27mm pitch 2-piece connector / SMT compatible product
- Other Connectors
1.27mm pitch 2-piece connector / low profile type
- Other Connectors
1.27mm pitch 2-piece connector / low profile type
- Other Connectors
1.27mm pitch 2-piece connector 8832E-FS series
- Other Connectors
1.27mm pitch 2-piece connector 8832E-FS series
- Other Connectors
Change "go see," "search," and "wire" on-site with wireless IoT.
- Dedicated IC
1.27mm pitch 2-piece connector, 8806/8807 series
- Other Connectors
Solving technical challenges for large-scale deployment of IoT sensors! We propose low-cost dataization for society as a whole.
- Printed Circuit Board
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
We expand the possibilities of product design with flexible substrates! FHE enhances design freedom and creates new applications.
- Printed Circuit Board
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
Wireless communication sends data to smartphones and the cloud! FHE system configuration that allocates roles appropriately.
- Printed Circuit Board
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
Reduce manufacturing processes by applying functional ink only where necessary! A new manufacturing technology that contributes to energy savings and material waste reduction.
- Printed Circuit Board
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
We realize electronics with thin, lightweight, and flexible substrates. The design philosophy of flexible hybrid electronics in response to changes in social structure.
- Printed Circuit Board
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
We can respond to the design and implementation of prototype (small quantity) boards for LSI testing at a low cost and with a short delivery time!
- Circuit board design and manufacturing
- others
Frequent cutting troubles with the chains used in the conveyor for transportation. Here is an example of the introduction of a magnetic proximity switch!
- switch
- Sensors
- Sensors
Scribner expands the possibilities of battery evaluation from fuel cells to secondary batteries.
- Fuel Cells
- Secondary Cells/Batteries
- Lithium-ion battery
Adopts a conductive material blended body, Bluetooth-connected wireless laser barcode scanner with ESD-compatible body.
- Handheld barcode reader
- Other electronic parts
- Other semiconductors
Adopts a body with embedded electrostatic discharge prevention material, an ESD-compatible laser barcode scanner capable of continuous high-speed reading.
- Printed Circuit Board
- Other semiconductors
- Other clean room equipment and facilities
Adopts a body with embedded electrostatic discharge prevention material, ESD-compatible two-dimensional barcode scanner capable of reading QR codes.
- Printed Circuit Board
- Other semiconductors
- Other clean room equipment and facilities
2 antenna ports, compact and low-cost, fixed-type UHF band RFID reader RS200
- IC tag
- IC tag reader/writer
- Communications
High-performance UHF band RFID reader module based on Impinj R2000 chip.
- IC tag
- IC tag reader/writer
- Communications
On March 22, 2013, we will launch the UHF RFID module RM300 that supports the new frequency band.
Unitech Japan Co., Ltd. will launch the industry's first high-output UHF RFID module, RM300. Orders are scheduled to begin on April 1, 2013. Starting from January 2013, the frequency band for UHF RFID will be transitioned and reorganized, leading to the development of devices such as handheld readers, fixed readers, and printers that utilize UHF RFID, with expectations for market expansion. UHF RFID devices are wireless equipment, and even if products are developed, it is necessary to obtain type certification from the Ministry of Internal Affairs and Communications or construction design certification, which involves costs and time. The RM300 has already obtained construction design certification as a high-output module with 1W, so devices using this module do not need to obtain these certifications again or can do so easily. The RM300 supports and has obtained certification for frequency bands usable not only in Japan but also in the United States, Europe, China, and Taiwan (some are planned). For more details, please refer to the materials.
Maximum reading distance approximately 25 m | Integrated UHF band RFID reader | 6700mAh, hot-swappable battery adopted
- Industrial PCs
- IC tag reader/writer
- IC tag
MFi certification obtained, supports iOS apps and app development SDK | Compatible with specific low-power radio stations (output below 250mW)
- Industrial PCs
- IC tag reader/writer
- IC tag
The era when AI crimping image inspection devices verify continuous terminal crimping with AI.
- Harness
- Inspection robot
- Image Processing Equipment
We thoroughly examined over 1,000 types of wire harness products and developed with the concept of "AI that is easy to handle on-site."
- Harness
- Image Processing Equipment
The repeat accuracy of the work cutting machine is not as expected! Here is an example of the introduction of a linear encoder system!
- encoder
- Distance measuring device
Free distribution of know-how materials on common troubles and countermeasures for waterproof and underwater harnesses, such as water ingress into connectors, poor contact, and disconnection!
- Harness
Achieved a 20% reduction in size compared to conventional products! High reliability capable of withstanding the harsh environments of motorsports!
- Other Connectors
We will be exhibiting at DSEI Japan 2027.
DSEI Japan is one of the largest international exhibitions in Japan focused on the defense and security sector, held every two years. Reflecting the growing interest in the defense industry in recent years, it will be held on a larger scale than ever before. This time, we will focus on showcasing products from manufacturers of defense-related components and materials, who are also our partners. Our booth is located in Hall 2, H2-144. We look forward to your visit.