List of Electronic Components and Modules products
- classification:Electronic Components and Modules
226~270 item / All 58819 items
Amino acid-derived natural cationic polymer that can be used in food preservatives, hygiene materials, and daily necessities. It is a safe material as it is a fermentation product produced by natural ...
- Shelf life enhancer
Introduction of the preservative polylysine / fermented polyamino acids that contribute to food poisoning prevention.
We provide easy-to-understand materials explaining the natural preservative polylysine, which prevents food poisoning. ε-Polylysine (hereafter referred to as polylysine) is an amino acid-derived preservative widely used as a food preservative. By adding polylysine, the growth of microorganisms that cause food poisoning can be prevented. Every year, food poisoning caused by microorganisms is a significant issue and is frequently reported in the news. Even foods that do not appear to be spoiled can rapidly proliferate microorganisms if the growth environment is suitable, so caution is necessary. Even if something looks clean, contamination by bacteria can progress, posing a risk of food poisoning. By ensuring hygiene management during the manufacturing process, proper storage at appropriate temperatures, and the appropriate use of the preservative polylysine, food safety can be more effectively protected. 【Features】 ■ A safe material produced through fermentation by natural microorganisms (not genetically modified organisms) ■ Provides a good image as a natural fermented product ■ Listed in the existing additive registry as a food preservative ■ A safe domestic product *Please feel free to contact us.
Can be processed into various shapes, with a wide range of application possibilities! We will polymerize the polymer according to your requirements.
- Public Testing/Laboratory
- Contract manufacturing
Presentation of technical materials on solder resist technology that contributes to server acceleration.
- Printed Circuit Board
Presented is a document summarizing the specifications for heat dissipation measures for game consoles!
- Printed Circuit Board
Specifications for terminal size, clearance, and solder mask thickness are provided.
- Printed Circuit Board
We will provide materials that include specifications such as terminal size, clearance, and solder mask thickness!
- Printed Circuit Board
Specifications such as terminal size, clearance, and solder mask thickness are listed.
- Printed Circuit Board
We present materials that are helpful for high-density smartphone circuit board design!
- Printed Circuit Board
We present materials that include specifications such as terminal size, clearance, and solder mask thickness!
- Printed Circuit Board
We are offering materials that will assist in the design of high-precision industrial robot circuit boards!
- Printed Circuit Board
We present materials on the technology for forming solder resist that enables miniaturization!
- Printed Circuit Board
Specifications such as terminal size, clearance, and solder mask thickness are included!
- Printed Circuit Board
Delivery in as short as 1 day! In addition to high-speed manufacturing with a consistent system, we significantly reduce effort with proposed evaluation jigs. We will ensure the consumption of the bud...
- Printed Circuit Board
We are currently offering materials that explain the comparison of thermal vias and copper pins in terms of thermal conductivity, as well as the effects of changing the filling materials inside TH.
- Printed Circuit Board
Chemically dissolve the unnecessary copper! After completing the conductor pattern, peel off to reveal the copper foil pattern.
- Circuit board design and manufacturing
After the finishing in the developing room and the process in the clean room, it will be developed in the developing room!
- Circuit board design and manufacturing
Quickly respond to the needs of customers in the development department who demand an early release with a short turnaround time!
- Printed Circuit Board
We will guide you through the roles, performance, and features of each process and equipment, as well as a tour of the printed circuit board manufacturing factory!
- Circuit board design and manufacturing
Check the progress of the circuit board you ordered in real-time! We are currently offering materials introducing our first circuit board process tracking service.
- Printed Circuit Board
We conduct daily equipment inspections to provide better products!
- Circuit board design and manufacturing
We will perform drilling using NC data that controls the drilling position according to the processing conditions!
- Circuit board design and manufacturing
After drilling, there is a process of resin filling and lid plating following copper plating!
- Circuit board design and manufacturing
This full-digital audio output middleware enables high sound quality, low power consumption, and low heat generation using only a microcontroller and an H-bridge circuit.
- Microcomputer
- Transistor
- Software (middle, driver, security, etc.)
[Available for preview] - Electronic components, structural components, heat dissipation components, motors, tools, batteries -
- Other metal materials
- Ceramics
- High frequency/microwave parts
[Book] Firing and Sintering Techniques and Process Development for Ceramics and Metals (No. 2237)
- Electronic components, structural components, heat dissipation components, motors, tools, batteries - ★ Development of "low-temperature processes" and "shortening of firing time" to reduce CO2 emissions generated during manufacturing ★ "Control of fine structures and organization" and "densification of sintered bodies" that lead to the performance and reliability of final products ---------------------------- ■ Table of Contents Chapter 1: Manufacturing Technology and Characteristics of Raw Powder Chapter 2: Forming Technology, Processes, and Debinding Technology Chapter 3: Characteristics, Mechanisms, and Process Optimization of Various Sintering Technologies Chapter 4: Analysis of Sintering Processes and Simulation Technologies Chapter 5: Firing Technology and Microstructure Control of Fine Ceramics Chapter 6: Sintering Technology and Densification of Metals and Magnetic Materials ---------------------------- ● Publication Date: February 29, 2024 ● Format: A4, 525 pages ● Authors: 52 ● ISBN: 978-4-86798-009-5 ----------------------------
Usable by anyone in various scenes! Equipped with multi-function and dorsal hand vein authentication.
- Other electronic parts
- Entrance and exit control system
- Other security
We have high-speed axial component inserters and high-density radial component inserters!
- Printed Circuit Board
- Circuit board design and manufacturing
New solution for copper wire theft prevention! Ultra high-strength, cut-resistant adhesive tape.
- Adhesive tape
- Other cable related products