List of Materials products
- classification：Materials
4966～4980 item / All 37789 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Epoxy resin that enhances heat dissipation and improves the reliability of semiconductor devices.
- Other polymer materials
- Other consumables
It is possible to control the porous structure with a spiny morphology like that of a porcupine!
- Chemicals
It is an adhesive that is expected to have strong adhesion to materials such as silicone rubber and foam.
- Other polymer materials
Added silicone adhesive and sealant "TSE382" to AD-Chemi.
Momentive's "TSE382" is a one-component, oxime-based condensation RTV (Room Temperature Vulcanizing) silicone that reacts with moisture in the air to promote crosslinking reactions. In its uncured state, it is a low-viscosity paste, and after curing, it becomes an elastic rubber that forms a highly crosslinked siloxane network structure. Since it employs an oxime-based condensation reaction, it is a "neutral curing type" that does not release corrosive by-products such as acetic acid during the curing process. It exhibits high adhesion strength to aluminum, stainless steel, zinc die-cast, and various engineering plastics (such as ABS, PC, PBT, epoxy, etc.) without the need for surface treatment. In particular, due to the flexibility of the siloxane chains and their low surface energy, it spreads and wets the fine irregularities of the substrate surface, demonstrating a cohesive failure type of adhesion mode with high interfacial adhesion. For more details, please visit our website.
This is a thin film coating agent designed to protect electronic printed circuit boards (PCBs). It protects substrates and components from mechanical and environmental corrosion.
- Rubber
- Other polymer materials
Added silicone adhesive and sealant "TSE322S" to AD-Chemi.
Momentive's "TSE322S" is a one-component, heat-curing silicone adhesive sealant optimized for assembly applications where thermal, mechanical, and environmental stresses act in combination, such as in electronic devices and optical modules. This material forms a silicone network with excellent heat resistance, flexibility, and electrical insulation based on a siloxane backbone, achieving high adhesion strength and dimensional stability through heat curing. Since it does not generate by-products during curing, the risk of gas corrosion and void formation is low even in sealed structures and around electronic components, making it suitable for applications requiring long-term reliability. A major feature of TSE322S is its interface formation technology that does not require a primer. The formulation design is less dependent on the polarity and surface energy of the substrate surface, allowing it to exhibit a chemical and physical composite adhesion mechanism to metals such as aluminum, copper, and stainless steel, engineering plastics such as PPS, PBT, and epoxy, as well as inorganic materials like glass and ceramics. This ensures high adhesion stability even in complex module structures that combine dissimilar materials. For more details, please check our website.
We propose silicone adhesives, potting materials, and encapsulants that can also be used for conventional general-purpose devices requiring heat dissipation.
- Rubber
- Other polymer materials
The heat-dissipating gap filler "TIA268GF" has been added to AD-Chemi.
We propose Momentive's SILCOOLTIA268GF as a material that meets the increasing "difficulty of thermal design" associated with the high performance and high density of electronic devices. TIA268GF is a thermally conductive gap filler that can be applied with high precision using liquid dispensing, addressing complex shapes and fine clearances that traditional sheet-type gap fillers cannot handle. With a high thermal conductivity of 6.8 W/m·K and silicone properties that maintain flexibility even after curing, it minimizes temperature rise in heat-generating components while reducing stress on substrates and components. Additionally, TIA268GF features excellent processability with a simple 1:1 mixing ratio, a working time of 1 hour at 23°C, and rapid curing in 1 hour at 70°C, enabling stable dispensing application on mass production lines. Its highly non-sagging paste form allows it to "stay in place" on vertical surfaces and wide gaps, making it suitable for thermal management in a wide range of fields such as automotive ECUs, communication devices, and industrial equipment. At Adachi New Industry, we provide comprehensive support for optimizing thermal design, examining application conditions, and prototype assistance using TIA268GF.
Controlling the bubbles changes the quality.
- Other polymer materials
Added silicone adhesive and sealant "TSE382" to AD-Chemi.
Momentive's "TSE382" is a one-component, oxime-based condensation RTV (Room Temperature Vulcanizing) silicone that reacts with moisture in the air to promote crosslinking reactions. In its uncured state, it is a low-viscosity paste, and after curing, it becomes an elastic rubber that forms a highly crosslinked siloxane network structure. Since it employs an oxime-based condensation reaction, it is a "neutral curing type" that does not release corrosive by-products such as acetic acid during the curing process. It exhibits high adhesion strength to aluminum, stainless steel, zinc die-cast, and various engineering plastics (such as ABS, PC, PBT, epoxy, etc.) without the need for surface treatment. In particular, due to the flexibility of the siloxane chains and their low surface energy, it spreads and wets the fine irregularities of the substrate surface, demonstrating a cohesive failure type of adhesion mode with high interfacial adhesion. For more details, please visit our website.
Supports wafer manufacturing process! 300℃ heat-resistant RoHS compliant silicone rubber sheet.
- Rubber
Heat management for electronic devices! Silicone rubber sheet with a heat resistance of up to 300℃.
- Rubber
We will introduce the products that will be exhibited at the 39th Nepcon Japan from January 22 to January 24 (Tokyo Big Sight).
- Engineering Plastics
- Other polymer materials
- plastic
Exhibited at the 40th NePCON Japan from January 21 to January 23 (Tokyo Big Sight).
Nepcon Japan is an electronics development and assembly exhibition that showcases electronic components and materials, as well as manufacturing, assembly, and inspection equipment that support the multifunctionality and high performance of electronic devices.
Stretchable conductive material with conductivity imparted to acrylic elastomer.
- Other polymer materials
Stretchable conductive material with conductivity imparted to acrylic elastomer.
- Other polymer materials