List of For Techies products
- classification:For Techies
91~105 item / All 4698 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
High accuracy in discrimination is the key! Added registration of resin types to the sensor enables efficient material discrimination for "recycling-specific substrates." *Free webinar available.
- Technical Seminar
From e-learning that supports employee skill development to personnel evaluations and internal communication! Providing a centralized solution for the functions necessary for organizational management...
- Distance learning/E-learning
- Distance learning/E-learning
- Other information systems
Learn the creation procedures and utilization points of D-FMEA/P-FMEA based on AIAG & VDA FMEA through case studies and exercises.
- Technical Seminar
Creating a system based on the comparison of differences before and after the revision, as well as the organization of documents and understanding of ISO operations.
- Technical Seminar
"CHECKROID+" × "hakaru.ai by GMO" collaboration demo available! Field operations are changing this much. Practical methods for inspection DX.
- Technical Seminar
- Plant Maintenance
- Management Skills Seminar
[Available for preview] ~ Surface activated bonding, hybrid bonding, Ag·Cu sintering bonding, conductive adhesive ~
- Technical and Reference Books
[Book] Trends in the Development of Semiconductor Device Junction Technology and Materials, and Reliability Evaluation (No. 2372) [Available for Preview]
- Surface-active bonding, hybrid bonding, Ag·Cu sintering bonding, conductive adhesives ◎ 3D semiconductors, chiplet integration, SiC power semiconductors, automotive electronic components, micro LEDs, etc. Examples of new materials and processes for the development of advanced semiconductors, their possibilities, and verification results are included! ---------------------------- ■ Table of Contents Chapter 1: Bonding and adhesive technologies for advanced semiconductor packages, their material development, and reliability evaluation Chapter 2: Development and reliability evaluation of bonding materials and processes for power semiconductors Chapter 3: Development and reliability evaluation of bonding technologies and materials in electronic devices ---------------------------- ● Publication Date: August 31, 2026 ● Format: A4 size, 387 pages ● Authors: 423 ● ISBN: 978-4-86798-164-1 ----------------------------
Explaining the technical challenges for social implementation from 3D cell printing of marbled cultured meat to automatic production systems, quality evaluation, regulations, and commercialization.
- Food Processing Equipment
- Bioinformatics
- Technical Seminar
A systematic explanation of the manufacturing process of semiconductor ICs, from the front-end and back-end processes to assembly, including the roles and necessity of the materials used in each stage...
- Other semiconductors
- Other semiconductor manufacturing equipment
- Technical Seminar
Explaining the latest technologies and market trends in plastic recycling, biomass utilization, and the provision of biodegradability, as well as future prospects.
- plastic
- Other Recycling
- Technical Seminar
Newcomers with zero experience, those in sales or administrative positions, and anyone who is feeling nothing but anxiety are welcome.
- Technical Seminar
~Practical work for the development, approval, and manufacturing of research results in pharmaceuticals and biopharmaceuticals into "products"~
- Technical Seminar
The future of personalized medicine created by multi-omics analysis and AI utilization, and the forefront of development and regulatory affairs.
- Technical Seminar
You will take the course using approximately 80 pages of text and about 20 LTspice circuit files, which are designed with consideration for practical application after the course.
- Technical Seminar
GMP-related work for beginners / new personnel
- Technical Seminar
From GAMP5 revision and CSA-based validation methods to responses for cloud, DI, and AI.
- Technical Seminar