List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
1921～1935 item / All 5179 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Ideal for micro-machining! Achieves deburring of holes and double-sided machining in one pass, which was difficult with conventional tools!
- Other machine tools
We will be exhibiting at Mecatronics Tech Japan 2021 from October 20 (Wednesday) to October 23 (Saturday)!
Our company will exhibit at "Mechatrotech Japan 2021," which will be held at Portmesse Nagoya from Wednesday, October 20 to Saturday, October 23, 2021. We will introduce our tools, including the 'Bar Off Tool' capable of chamfering and deburring from a diameter of 0.8 mm, and the 'FEM' tool breakage detection device that reliably detects breakage. We look forward to your visit. (Booth number: 2B12)
Turbo pump compatible! Low temperature (1100°C) / high temperature (1300°C) pyrometer.
- Annealing furnace
Supports a maximum substrate size of 156mm x 156mm! Compatible with vacuum or atmospheric transport systems and can be equipped with a load lock.
- Annealing furnace
Rapid cooling mechanism after annealing! Introducing the high-speed heat treatment equipment from Annealsys.
- Annealing furnace
Compatible with SI 500-1M, SI 500 PPD-1M, etc.! The transport chamber is available in three types.
- CVD Equipment
Control of ion density by ICP power! Achieving low-temperature film formation, low damage, and high conformality.
- CVD Equipment
High-selectivity etching! Optimization of radical supply by adjusting the spacing between the ICP source and the substrate electrode.
- Other semiconductor manufacturing equipment
Top-class throughput! Flexible modular design.
- Other semiconductor manufacturing equipment
Many safety measures specifications necessary for mass production! Compact device size with a film formation temperature of 50 to 285°C.
- Other semiconductor manufacturing equipment
500℃ wafer stage! Adoption of a remote ICP source with no plasma damage.
- Other semiconductor manufacturing equipment
For research and development, for small-scale batches! Standard equipped with a simple decontamination unit ALD Shield Vapor Trap.
- Other semiconductor manufacturing equipment
Substrate bias mechanism! Introducing our microwave PECVD/etching equipment.
- Etching Equipment
Introducing the ion beam sputtering device equipped with a maximum of 5 targets (220mm diameter) or 4 targets (300mm diameter)!
- Sputtering Equipment
Maximum 200mm diameter substrate! Double ring magnetron (Fraunhofer FEP)
- Sputtering Equipment
Mechanical clamp or electrostatic chuck compatible! Sub-nanometer etching mechanism.
- Etching Equipment
Supports wafers up to 150 or 200 mm! Etching angle and stage tilt/rotation mechanism.
- Etching Equipment