List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
616～630 item / All 5048 items
For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.
- Work gloves
Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.
Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.
Extremely low Rc system design in the industry and the highest level of inter-wafer reproducibility!
- Sputtering Equipment
- Etching Equipment
Higher productivity for PLP! More process possibilities. Optimized for advanced packaging.
- Sputtering Equipment
- Etching Equipment
Introducing the BAK deposition platform that allows for various chamber sizes and process automation options.
- Evaporation Equipment
It can handle various bonding strength tests in the assembly process of various semiconductor components and electronic parts, as well as in the mounting process on substrates, all with one machine!
- Tester
The versatile bond tester DAGE4000 has been completely redesigned, becoming more multifunctional and achieving higher precision, thus being reborn!
- Tester
A unique LED UV curing solution with numerous patents obtained! Applying UV resin curing in electronics, industry, medical, and optics!
- Other semiconductor manufacturing equipment
- LED Module
- Ultraviolet irradiation equipment
Expanding UV LED products to strengthen response to the growing and diversifying needs for ultraviolet curing.
Excelsius Noble Light Japan Co., Ltd. (Headquarters: Bunkyo-ku, Tokyo, President: Masahiko Suzuki, hereinafter referred to as "the Company") will expand its product portfolio of UV LEDs, one of the light sources for UV curing, and strengthen the provision of UV curing process solutions in new growth areas. In January 2024, the Company was absorbed by Excelsius Technologies, headquartered in the United States (hereinafter referred to as "Excelsius"), and is now handling UV LED products previously managed by its predecessor, Heraeus Noblelight Japan Co., Ltd., and Foseon Technology Japan Co., Ltd., as well as Excelsius. These products encompass a wide range of UV LED light sources for line and area irradiation as well as spot irradiation, regardless of cooling methods. As market demands become increasingly diverse, the Company has established a system that enables more detailed proposals to a broad range of industries through this product expansion.
Achieving thin film coating in micrometer units with a coater head (slot coat) application device.
- Coater
Used for temporary fixing and bonding with hot melt adhesive!
- Molding Equipment
We provide high-quality circuit processing and wiring processing services using FIB. We achieve a high processing yield!
- Semiconductor inspection/test equipment
- Semiconductors and ICs
- Microcomputer
Supply disruptions from semiconductor manufacturers, the electrification of the automotive industry, and the spread of 5G communication. Are you keeping up with the urgent need for alternative product evaluations, authenticity assessments, and failure analysis?
The spread of 5G communication, the electrification of the automotive industry, the intensification of US-China trade friction represented by certain semiconductor manufacturers leading to supply stoppages, and the rapid increase in digital products due to the impact of the COVID-19 pandemic are various social phenomena that are increasing the demand for semiconductors. Along with these developments, the acceleration of semiconductor supply risks is progressing. In addition to the adoption of new products, evaluation of existing and distributed products is also necessary... However, the personnel involved in new adoption and product evaluation are limited. Do you have any of these concerns? - Lack of know-how to evaluate semiconductor components - Want to evaluate alternative products but lack personnel and equipment - Want to use stock items and market products but have concerns about reliability - Unable to determine whether the delivered semiconductor products are counterfeit or genuine At Eurofins FQL, we leverage our years of experience in component evaluation and failure analysis to provide not only semiconductor evaluations but also failure analysis services. Additionally, we offer evaluations of distributed products to assist in determining the authenticity of counterfeit, imitation, or long-term stored items. Please feel free to contact us.
Processing S45C quenched and tempered steel using high-precision CNC machining technology. Manufacturing ring components for semiconductor manufacturing equipment.
- Other semiconductor manufacturing equipment
- Processing Contract
Using SUS304 stainless steel and utilizing NC lathes, machining centers, and cylindrical grinding, we manufacture high-precision ring components for semiconductor manufacturing equipment.
- Other semiconductor manufacturing equipment
- Processing Contract
Max 1000℃, MFC maximum 3 systems, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)
- Annealing furnace
- Heating device
- Electric furnace
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Handling electronic assembly products such as solder balances and stirrers, as well as soldering equipment and semiconductor devices!
- Soldering Equipment
- Other semiconductor manufacturing equipment
Inspection is possible only on the surface of the double-sided implementation substrate! Also compatible with 3D tomography inspection. *Detailed explanatory materials will be provided.
- Semiconductor inspection/test equipment
- X-ray inspection equipment
Automatically inspect crystal defect voids inside silicon wafers!
- Semiconductor inspection/test equipment
- X-ray inspection equipment