List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
4501～4545 item / All 4993 items
IC bonding device
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Tabletop semi-automatic machine for cell production use.
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
LCD substrate terminal cleaning device
- Other semiconductor manufacturing equipment
- Surface treatment contract service
High-density plasma is generated over a large area by a unique reactor head!
- Plasma surface treatment equipment
- Molding Equipment
- Circuit board processing machine
Announcement of the start of sales for the "Atmospheric Pressure Air Plasma Device" that requires no gases such as argon or nitrogen, by Well Corporation.
Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/
High-density plasma is generated over a large area by the unique reactor head!
- Plasma surface treatment equipment
- Molding Equipment
- Circuit board processing machine
Announcement of the start of sales for the "Atmospheric Pressure Air Plasma Device" that requires no gases such as argon or nitrogen, by Well Corporation.
Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/
High-density plasma is generated over a large area by the unique reactor head!
- Molding Equipment
- Circuit board processing machine
- Plasma surface treatment equipment
Announcement of the start of sales for the "Atmospheric Pressure Air Plasma Device" that requires no gases such as argon or nitrogen, by Well Corporation.
Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/
High Power LED Aging Tester
- Semiconductor inspection/test equipment
- Optical Measuring Instruments
- Contract measurement
Implementation Solution Service
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Notice of Participation in the 22nd Fine Tech Japan - Low Power Atmospheric Pressure Plasma Device with Reduced Ozone and Nitrogen Oxide Emissions
Well, Inc. (Location: Shinagawa, Tokyo; CEO: Naoyuki Eda), a provider of advanced semiconductor packaging solutions centered around test chips, will exhibit at the 22nd Fine Tech Japan, which will be held at Tokyo Big Sight from April 11 (Wednesday) to April 13 (Friday), 2012. Well's atmospheric pressure plasma equipment is characterized by its environmental friendliness, featuring low power consumption (CO2 reduction) while suppressing the generation of ozone and nitrogen oxides. Additionally, it does not require a vacuum chamber like conventional equipment, combining low capital investment with low running costs, which is its greatest economic advantage. On the day of the event, we will conduct a demonstration using the compact tabletop MyPL-Auto150, allowing you to experience actual large-area plasma irradiation. We sincerely look forward to your visit. 【Contact Information for Inquiries】 Well, Inc. Packaging Solutions Sales Department Tel: 03 (5715) 3501 Email: info@welljp.co.jp http://well-plasma.jp/
Real-time monitoring system for semiconductor packaging process anomalies
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Dispenser & UV irradiation device
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Ultrasonic flip chip bonder
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Binary code signal input MP3 127ch audio playback board
- Other semiconductor manufacturing equipment
It is a 16-channel contact control type board compliant with RoHS.
- Other semiconductor manufacturing equipment
The sound quality achieves that of a music CD!!
- Other semiconductor manufacturing equipment
It is compatible with recent wireless devices equipped with modular plugs (condenser microphones).
- Other semiconductor manufacturing equipment
High-quality stereo audio playback board
- Other semiconductor manufacturing equipment
High-performance limiting amplifier for sound collection
- Other semiconductor manufacturing equipment
Amateur radio microphone compressor (limiting) amplifier
- Other semiconductor manufacturing equipment
Business radio microphone compressor (limiting) amplifier
- Other semiconductor manufacturing equipment
Sale of inexpensive metal mask storage shelves compatible with Irector spacers.
- Other semiconductor manufacturing equipment
- Other mounting machines
- cabinet
Remove dust with a low-cost, ultra-cheap clean booth that ensures clean quality. No clogging.
- Other semiconductor manufacturing equipment
- Air purifiers
- Clean Booth
Pressure sensors for various integrated gas systems.
- Semiconductor inspection/test equipment
- CVD Equipment
- Circular Connectors
Next-generation point solder.
- Other physicochemical equipment
- Other semiconductor manufacturing equipment
Resistance rate / Sheet resistance measuring instrument [CRESBOX]
- Semiconductor inspection/test equipment
- Other measurement, recording and measuring instruments
ONE DAY RESCUE. We will shape it on that day. Express service. Short delivery time.
- Prototype Services
- Other machine elements
- Semiconductor inspection/test equipment
Next-generation point solder.
- Other physicochemical equipment
- Other semiconductor manufacturing equipment
Aluminum cutting processing
- Other processing machines
- Etching Equipment
- Processing Contract
Stainless steel machining
- others
- Semiconductor inspection/test equipment
- Processing Contract
Resin cutting processing
- Tester
- Semiconductor inspection/test equipment
- Processing Contract
The future-oriented desolderer chosen by engineers (you)!
- Other physicochemical equipment
- Other semiconductor manufacturing equipment
We provide gas equipment design, manufacturing, and construction, total management of gas usage sites, supply of high-pressure gases, special gases, and standard gases, as well as gas-related analysis...
- Chemicals
- Other semiconductor manufacturing equipment
- Gas recovery/treatment equipment
Unblocking!
- Other surface treatment equipment
- Coater
- Other food machinery
Improved version of the powder removal device using permanent magnet to enhance iron removal performance.
- Other processing machines
- Other physicochemical equipment
- Other semiconductor manufacturing equipment
This electro-polishing is precisely the technology that Akita Chemical excels at the most!!
- Wafer processing/polishing equipment
Usable at a maximum of 90°C! Circulating heating heater suitable for heating NaOH aqueous solution.
- Other heaters
- Heating device
- Other semiconductor manufacturing equipment
The control circuits are fully electronic, with excellent safety in the electrical system and a long lifespan.
- Other semiconductor manufacturing equipment
It has excellent exposure stability and reproducibility.
- Other semiconductor manufacturing equipment
Please request our surface treatment for industrial and decorative use.
- Wafer processing/polishing equipment
Please request our surface treatment for industrial and decorative use.
- Wafer processing/polishing equipment
We take full responsibility for providing consistent service.
- Evaporation Equipment