List of Semiconductor Manufacturing Equipment products

  • classification:Semiconductor Manufacturing Equipment

46~90 item / All 5250 items

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It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...

  • Sensors

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We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!

  • Other semiconductors
  • Processing Contract
  • Wafer

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Achieves a processing capacity of 72K UPH and high-precision bonding. Supports flip chips and various processes, contributing to improved productivity in semiconductor manufacturing.

  • Bonding Equipment

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Plasma-resistant diamond

  • Etching Equipment

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Ion exchange membrane electrolytic cell that achieves both high-purity oxidant production and gas separation.

  • Other recycling systems
  • Other surface treatment equipment
  • Etching Equipment

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Selective etching of metals

  • Etching Equipment

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One unit supports 4 channels! Cost reduction and space-saving possible!

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  • Other semiconductor manufacturing equipment

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We meet the high precision needs of semiconductor manufacturing with microfabrication and diffusion bonding.

  • Special Processing Machinery
  • Heat exchanger
  • Oxidation/Diffusion Device

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We expand possibilities with microfabrication and diffusion bonding.

  • Special Processing Machinery
  • Oxidation/Diffusion Device
  • Heat exchanger

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Joining different materials without melting: A joining technology that balances precision and strength.

  • Welding Machine
  • Oxidation/Diffusion Device
  • Processing Contract

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Please use it for demonstration tests and research and development.

  • Processing Contract
  • Contract manufacturing
  • Semiconductor inspection/test equipment

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An ultra-high temperature substrate heating stage that allows for substrate elevation, rotation, and RF/DC substrate bias all in one device! 'All-In-One' component.

  • Sputtering Equipment

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Lab6 Discharge Plasma Generation Heater for Thermal Electron Gun

Vacuum Ultra-High Temperature Cylindrical Heater Unit Maximum Temperature 1800℃ (Graphite, C/C Composite) We will manufacture according to your requested specifications. This is a cylindrical heating unit that can be applied in high vacuum for various purposes. We can custom-make it for heating samples in crucibles within the cylindrical heating range, heating metal, ceramic, and wire-shaped samples, depending on the purpose. ◎ Usable Environment: In vacuum, in inert gas, etc. ◎ Heating Element: Graphite, C/C composite heater, SiC coating, PG coating, tungsten, tantalum, etc. ◎ Manufacturing Range: Heater section (up to approximately Φ150 x 100mm), introduction flange, temperature control unit ◎ Applications: Sample heating in various vacuum device process chambers, discharge plasma generation unit thermal electron gun (Lab6), rapid heating of gas supply system piping (liquid rapid vaporization) We also manufacture custom specifications according to other requests. For details, please contact us.

CVD, PVD (evaporation, sputtering, etc.) high vacuum, ultra-high temperature plate heater for wafer and small chip heating with excellent uniformity and reproducibility.

  • Other semiconductor manufacturing equipment
  • Annealing furnace
  • CVD Equipment

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Cylindrical-heater 2.jpg

Lab6 Discharge Plasma Generation Heater for Thermal Electron Gun

Vacuum Ultra-High Temperature Cylindrical Heater Unit Maximum Temperature 1800℃ (Graphite, C/C Composite) We will manufacture according to your requested specifications. This is a cylindrical heating unit that can be applied in high vacuum for various purposes. We can custom-make it for heating samples in crucibles within the cylindrical heating range, heating metal, ceramic, and wire-shaped samples, depending on the purpose. ◎ Usable Environment: In vacuum, in inert gas, etc. ◎ Heating Element: Graphite, C/C composite heater, SiC coating, PG coating, tungsten, tantalum, etc. ◎ Manufacturing Range: Heater section (up to approximately Φ150 x 100mm), introduction flange, temperature control unit ◎ Applications: Sample heating in various vacuum device process chambers, discharge plasma generation unit thermal electron gun (Lab6), rapid heating of gas supply system piping (liquid rapid vaporization) We also manufacture custom specifications according to other requests. For details, please contact us.

[Patent Obtained] Instant complete water removal of workpieces with air blow = complete drying!

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  • Other semiconductor manufacturing equipment

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Revolutionary! No need for water washing! Particles are removed with just air blow.

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  • Other semiconductor manufacturing equipment

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Are you making this mistake when draining water from your work?

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  • Other semiconductor manufacturing equipment

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Are you making this mistake with the work's drainage?

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  • Other semiconductor manufacturing equipment

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Are you making this mistake while draining water from the work?

[To those in charge who are struggling with workpiece water drainage] Are you making these mistakes with workpiece water drainage? ✓ Do you know the real reason why, even if you increase the air blow pressure, not all water droplets are blown away? ✓ Do you know the real reason why, even if you increase the number of air nozzles, water is not sufficiently drained? ✓ Do you know the real reason why, even if you change the shape of the air nozzle, it still does not drain water effectively? These mistakes are typical errors made by companies that use air blow for workpiece water drainage and droplet removal. However, these mistakes are not significant compared to a certain "fatal mistake." What is that "fatal mistake"? It is… We provide this information in a PDF file. Download it now to find out.

No more revolution! No need for washing; particles are removed with just air blowing.

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  • Other semiconductor manufacturing equipment

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Just by looking at this, you'll understand everything! We created a PR flyer (dust removal version).

Thoroughly remove dust from workpieces with air blow! We have summarized everything about the patented complete dust removal air nozzle, "Air Screw Nozzle," on a single A4 flyer. "What kind of nozzle is it?" "Why can it remove dust so effectively?" "How can it remove dust even from complex-shaped workpieces?" Just by looking at this, you can quickly understand everything about the Air Screw Nozzle. Please download and take a look.

[Patent Obtained] Complete water removal in an instant with air blow = complete drying!

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  • Other semiconductor manufacturing equipment

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If you see this, you'll understand everything! I created a PR flyer.

100% water removal with air blow! No water droplets left on the workpiece! We have summarized everything about the patented complete drying air nozzle, "Air Screw Nozzle," on a single A4 flyer. "What kind of nozzle is it?" "Can it really remove 100% of the water?" "Why is it so effective at removing water?" Just by looking at this, you can quickly understand everything about the Air Screw Nozzle. Please download it and take a look!

Achieving a processing capacity of 48,000 units per hour and 100% optical inspection. It robustly supports RFID inlay manufacturing, accommodating various web materials such as paper.

  • Bonding Equipment

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It is a high-precision top-hat beam shaper that is not limited to specific wavelengths, thanks to a smooth aspheric lens.

  • Electron beam lithography equipment

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