List of Semiconductor Manufacturing Equipment products

Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

• Other conveying machines

Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!

• Cooling system

Super sonic spraying of water droplets and vapor below 30μm effectively removes stubborn dirt such as cutting oil. Cleaning is possible even in narrow spaces.

• Other semiconductor manufacturing equipment

We apply hard DLC (diamond-like carbon) through sputtering, suitable for medical supplies and automotive parts! *Demo tests are currently being conducted.

• Sputtering Equipment

DLC film formation (film quality: ta-C domain, surface roughness Ra 0.16 nm, transmittance: 88%) achieved through sputtering, which has had many challenges in the past.

• Sputtering Equipment

It is a device that can be transitioned from a pilot line to a mass production line.

• Sputtering Equipment

There are five expansion slots, allowing for additional installation of sputter chambers, deposition devices, glove boxes, etc.

• Sputtering Equipment

Reduce damage to the substrate by over 60%! Improve film formation speed while maintaining low damage characteristics.

• Sputtering Equipment

We have achieved data digitization through our own experience and achievements, along with the cooperation of a specialized manufacturer of chip saws.

• Wafer processing/polishing equipment
• Processing Contract

Would you like to achieve efficiency in repair and maintenance inspection operations and improve customer satisfaction with the core business package "ServAir" for after-sales service?

• Semiconductor inspection/test equipment

A screen made using etching processing and metal diffusion bonding technology! Introducing with photos.

• Processing Contract
• Etching Equipment

We provide a wide range of services for precision cleaning, from large semiconductor equipment and components to small parts.

• Other semiconductor manufacturing equipment

Microfabrication for glass substrates, optical films, and various high-performance films!

• Etching Equipment
• Processing Contract

We can accommodate various quantities from small amounts to mass production! We offer a wide variety of silica sand.

• Wafer processing/polishing equipment

Ideal for processing in areas where tools cannot reach! Capable of deburring and adding radii, among other tasks.

• Wafer processing/polishing equipment

It is possible to provide a large frictional force instantaneously! Due to its high volumetric efficiency, it excels in mass production.

• Wafer processing/polishing equipment

Polishing power 10 to 15 times that of a rotary barrel! Processing can be done in a short time.

• Wafer processing/polishing equipment

Minimal grinding unevenness, minimizing damage to the product, and enabling stable precision barrels!

• Wafer processing/polishing equipment

Reproducibility in sample grinding

• Wafer processing/polishing equipment

Wire bonder for various applications such as automobiles, electric vehicles (EVs), and semiconductors, using the wedge bonding method.

• Bonding Equipment

Easily switch between wedge/ball settings! Compatible with a wide range of wire and ribbon sizes! Wedge bonding type wire bonder.

• Bonding Equipment

Adjust the height of the work holder to improve flexibility! Compatible with copper wire bonding! Wedge bonding type wire bonder.

• Bonding Equipment

We offer a tabletop manual wire bonder with over 9,000 units in operation worldwide, including wedge bonding tools. Our support system is also robust.

• Other semiconductor manufacturing equipment

Easily switch between wedge/ball settings! Compatible with copper bonding. *Over 9,000 units delivered worldwide.

• Bonding Equipment

Adjustable work holder height. Supports copper wire bonding. *24-hour online support available.

• Bonding Equipment

We create tapered capillaries with a constant inner diameter using our unique manufacturing technology.

• Analytical Equipment and Devices
• Other machine elements
• Semiconductor inspection/test equipment

[Domestic Authorized Dealer] LEVITRONIX Bearingless Pump Achieves liquid delivery performance and control performance that meet the demands of advanced processes!

• CMP Equipment

Enhance the supply pressure of pure water within the factory to eliminate pressure shortages! Furthermore, suppress fluctuations in pure water supply pressure to achieve a stable supply of pure water.

• Other semiconductor manufacturing equipment

Ideal for experiments, research, evaluation, and prototype production! Achieving high-speed, high-precision, low-damage vacuum deposition on flat substrates such as glass and metal!

• Sputtering Equipment

Adopting a unique LIA method plasma source, we achieve ultra-fast, high-quality vacuum deposition on resin films and metal foils!

• CVD Equipment

For experimental use in companies and university laboratories! A compact slit coater that accommodates various coating conditions and materials, achieving high precision in coating uniformity.

• Coater

A compact slit coater (die coater) that flexibly accommodates various coating conditions and materials, achieving high-precision coating uniformity.

• Coater

For experimental use in companies and university laboratories! A high-precision and compact slit coater (die coater) that accommodates various coating conditions and materials.

• Coater

Adopting a unique LIA method plasma source, we achieve ultra-fast, high-quality vacuum deposition on flat substrates such as glass and metal!

• CVD Equipment

It is a manual polishing device for a luminescence spectroscopic analysis apparatus.

• Wafer processing/polishing equipment

With a space-saving design, the vacuum pump module can be installed up to 18 meters away from the process module.

• CVD Equipment

Achieving high-quality polishing that retains the edge through mechanization.

• Wafer processing/polishing equipment

Achieving high-quality polishing that preserves the edge through mechanization.

• Wafer processing/polishing equipment

Achieving high-quality polishing that preserves edges through mechanization.

• Wafer processing/polishing equipment

Achieving high-quality polishing that preserves edges through mechanization.

• Wafer processing/polishing equipment

Achieving high-quality polishing that preserves the edge through automation.

• Wafer processing/polishing equipment

Supports wafers up to φ200mm! This is a plasma CVD system capable of both film deposition and etching.

• Etching Equipment

Kyoto, the ever-evolving hub of precision sheet metal! Adapting to flexible manufacturing.

• 3D CAD
• Other CAD
• Wafer processing/polishing equipment

Samples will be displayed at the exhibition. Improved separation from printed circuit boards! Chemical resistance including organic solvents and alkali.

• Photomask

The corresponding pipe sizes are OD 38.1mm to 76.2mm! Introducing our pipe outer surface polishing machine.

• Wafer processing/polishing equipment