List of Semiconductor Manufacturing Equipment products

Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

• Other conveying machines

Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.

• Other safety and hygiene products

High-precision pressure sensor for high-purity fluids.

• CMP Equipment

We are not an ordinary valve manufacturer! We can widely produce "unit integrated valves" that combine filters, sensors, and more, tailored to your needs!

• Other semiconductor manufacturing equipment

High-precision pressure gauge for high-purity fluids.

• CMP Equipment

For the pharmaceutical, food, beverage, biotechnology, and cosmetics industries.

• Other semiconductor manufacturing equipment

Numerous adoption results worldwide. We propose suitable solutions for automatic plating solution analysis in various electroplating and electroless plating processes, as well as in the Cu damascene p...

• Other semiconductor manufacturing equipment
• Analytical Equipment and Devices

We perform ultra-high precision inner surface polishing processing for nozzle components of injection molding machines!

• Hand polishing and filing
• Wafer processing/polishing equipment
• Processing Contract

The nano-resolution piezo positioning stage is used in various fields around the world, so you can use it with confidence.

• Optical microscope
• Electron microscope
• Semiconductor inspection/test equipment

A high-speed drawing device compatible with 300x300mm square substrates has been added to the VPG series.

• Other semiconductor manufacturing equipment

If it's about mold mirror polishing, leave it to us.

• Wafer processing/polishing equipment

It is possible to install light and power supply together.

• LAN/Optical cable
• Other semiconductor manufacturing equipment

The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders that encompasses high precision and high functionality.

• Bonding Equipment

Vibration is not transmitted to the hand, and safety is further enhanced with high efficiency from circuit optimization and heat protection features!

• Wafer processing/polishing equipment
• Ultrasonic Oscillator

From badge processing in small baskets to deburring of large parts, we manufacture a variety of automatic machines!

• Wafer processing/polishing equipment

A lineup of polishing equipment that can automatically perform everything from micro deburring to mirror polishing!

• Wafer processing/polishing equipment

We will make it possible to regrind tools with small diameters that were difficult to regrind!

• Wafer processing/polishing equipment

Comprehensive proposals for coatings that are not limited by membrane types or methods!

• Capacitor
• Other semiconductor manufacturing equipment

The high-quality shine polished by artisans! The elevator belt has been widened and the spray volume has been doubled.

• Wafer processing/polishing equipment

Dicing frame sizes 200mm and 300mm. Takt time and transport time are 180 seconds for 13 pieces or less.

• Other semiconductor manufacturing equipment

An arc spraying device boasting high productivity, simplicity, and reliability!

• Other semiconductor manufacturing equipment

Suitable for thermal spraying and fused coatings! Certain types of plastics can also be thermally sprayed, allowing for economical coating production.

• Other semiconductor manufacturing equipment

It is possible to stop production in conjunction with external automatic devices! PC control with distributed I/O.

• Other semiconductor manufacturing equipment

Highly unique compact design! The interface is equipped with an Intel Dual Atom processor!

• Other semiconductor manufacturing equipment

Equipped with an Intel Dual Atom Processor! It excels in operability, integration, and communication.

• Other semiconductor manufacturing equipment

Easy to handle! Various types of plastic materials can be sprayed, and yield rates are improved!

• Other semiconductor manufacturing equipment

We have delivered many dust collection devices ranging from small ones with a processing air volume of about 50 m³/min to those exceeding 300 m³/min!

• Other semiconductor manufacturing equipment

Easy setting of the thermal spray current! Using the patented "coaxial drive" system for metallization!

• Other semiconductor manufacturing equipment

A high-purity coating enhances the corrosion resistance, wear resistance, and impact resistance of metal components!

• Other semiconductor manufacturing equipment

Compact and easy to operate! Achieves high adhesion and a low porosity film.

• Other semiconductor manufacturing equipment

Ideal for use in the configuration of long supply packages! Provides a fast spraying speed.

• Other semiconductor manufacturing equipment

It is possible to spray molybdenum from a soft bonding film to a very hard wear-resistant film!

• Other semiconductor manufacturing equipment

Coating on parts is possible! This extension is often used for complex shapes.

• Other semiconductor manufacturing equipment

Adopting all the features of the conventional plasma and HVOF equipment's concise control and operator interface!

• Other semiconductor manufacturing equipment

Corrosion-resistant coating: Save time and costs! Flame spraying equipment using oxygen and propane as fuel.

• Other semiconductor manufacturing equipment

Introducing examples of stainless steel machining. We accommodate various parts processing across industries, not limited to machining, including turning, sheet metal work, and welding.

• Processing Contract
• Other machine elements
• Semiconductor inspection/test equipment

Multi-Wafer Handling Die Bonder (Auto)

• Bonding Equipment

Eagle AERO is a high-throughput wire bonding device.

• Bonding Equipment

CoS (Chip on Submount) is a high-precision die/flip chip bonder.

• Bonding Equipment

ICA1205 is a multi-laser dicing device that employs a multi-beam structure.

• Other semiconductor manufacturing equipment

It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.

• Bonding Equipment

AFC Plus is a flip chip bonder capable of bonding dies to wafers/substrates/dies with high precision.

• Bonding Equipment

Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.

• Bonding Equipment

We will introduce hand clean rolls made of silicone-based and non-silicone-based materials.

• Other cleaning tools
• Special labels, etc.
• Evaporation Equipment

Supports work widths of 255, 350, 450, 550, 600, and 750 mm!

• Sputtering Equipment
• Food Packaging Machinery
• Beverage Production Equipment

The CMX series is great news for those who had given up on web cleaners due to space constraints.

• Coater
• Vacuum Packaging Machine
• Processing Contract

Ideal for use in clean rooms! It is a fully automatic system for cleaning rolls.

• Sputtering Equipment
• Bag making machine/slitter
• Special labels, etc.