List of Semiconductor Manufacturing Equipment products

  • classification:Semiconductor Manufacturing Equipment

361~405 item / All 5069 items

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For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.

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  • Work gloves

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Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.

Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.

Overwhelming mass production capability at 4000 UPH. Automatic for dynamic, static, and high-temperature conditions.

  • Tester

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Introducing a 21-megapixel CoaXPress-over-Fiber (CoF) camera that supports image transmission at up to 100 Gbps!

  • Semiconductor inspection/test equipment

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Reliable solder ball repair is performed using high-speed image processing and a uniquely developed repair unit.

  • Semiconductor inspection/test equipment

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Features stable solder ball mounting and improves productivity through an inline system.

  • Other semiconductor manufacturing equipment

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Reliable solder ball repairs are performed by a repair unit that has accumulated unique image processing and proven results.

  • Semiconductor inspection/test equipment

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Compatible with SFP112/QSFP112! Can be mounted in the compact FTB-1 HPDC chassis.

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  • Tester

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Customize the optical integrated circuit you want to measure! Introducing our testing solutions.

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  • Tester

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Starting the 800GbE point-to-point test, also supporting breakout tests with 2x400GbE and 8x100GbE!

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  • Tester

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A modular measurement platform for testing optical passive components 24 hours a day, 365 days a year!

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  • Tester

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Full support for testing transmission standards of 800G/400G/200G/100G!

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  • Tester

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Customize the optical integrated circuit you want to measure! It can also be used for spectral analysis and functional testing.

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  • Semiconductor inspection/test equipment

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Air bearing cylinder with zero friction resistance.

  • Pneumatic Equipment
  • Bonding Equipment
  • Wafer processing/polishing equipment

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Notice of Participation in the 1st [Kyushu] Semiconductor Industry Exhibition

We will be exhibiting at the "1st [Kyushu] Semiconductor Industry Exhibition" to be held on September 25 (Wednesday) and 26 (Thursday), 2024. On that day, we plan to showcase electronic devices such as remote controls and cables, as well as pneumatic control equipment made by Fujikura Composite, and our self-developed product "Tofmak Non-Stick Coating." We sincerely look forward to your visit. Event Dates: September 25 (Wed) and 26 (Thu), 2024, 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka, Hall B (Booth Number: 1-19) Organizer: [Kyushu] Semiconductor Industry Exhibition Executive Committee

Non-contact, high-speed response allows for control as you wish. Custom orders are available starting from one unit!

  • Pneumatic Equipment
  • Bonding Equipment
  • Wafer processing/polishing equipment

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Notice of Participation in the 1st [Kyushu] Semiconductor Industry Exhibition

We will be exhibiting at the "1st [Kyushu] Semiconductor Industry Exhibition" to be held on September 25 (Wednesday) and 26 (Thursday), 2024. On that day, we plan to showcase electronic devices such as remote controls and cables, as well as pneumatic control equipment made by Fujikura Composite, and our self-developed product "Tofmak Non-Stick Coating." We sincerely look forward to your visit. Event Dates: September 25 (Wed) and 26 (Thu), 2024, 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka, Hall B (Booth Number: 1-19) Organizer: [Kyushu] Semiconductor Industry Exhibition Executive Committee

It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.

  • Bonding Equipment

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Manual flip chip bonder suitable for small-scale production and various experiments.

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  • Bonding Equipment

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Semi-auto FCB (Flip Chip Bonder) that meets a wide range of user needs.

  • Assembly Machine
  • Other semiconductor manufacturing equipment

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A single-layer resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from a high-pressure jet.

  • High pressure cleaner
  • Resist Device

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Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.

We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!

A sheet-type resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from high-pressure jets [testable].

  • High pressure cleaner
  • Other semiconductor manufacturing equipment
  • Resist Device

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Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.

We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!

We provide batch-type cleaning equipment that utilizes cleaning technology and transport/control technology, compatible with various chemical solutions.

  • Wafer processing/polishing equipment

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Expansion to advanced packages: Processing is possible on a 510×515mm substrate.

  • Sputtering Equipment
  • Etching Equipment
  • Annealing furnace

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I will explain in detail the differences between Teflon and fluoropolymer, which are often confused.

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  • Other semiconductor manufacturing equipment

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I will explain the differences between fluororesin and Teflon.

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  • Other semiconductor manufacturing equipment

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"We want to confirm the effectiveness of the coating in advance." To meet such needs, Yoshida SKT also offers measurements of the coated surface.

  • Resist Device

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[Presentation of Materials] We will introduce the differences in features between Teflon fluoropolymer "PTFE" and "PFA" resins and coatings.

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  • Other semiconductor manufacturing equipment

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Polish with just water! Improve productivity by reducing labor! Remove rust and dirt too!

  • Hand polishing and filing
  • Grindstone
  • Wafer processing/polishing equipment

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100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry].

  • Other semiconductor manufacturing equipment

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Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)

Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.

A compact curing device that can be used on a tabletop. It allows for both top and bottom irradiation, and its affordable price is also attractive! *Demo units available for loan.

  • Other semiconductor manufacturing equipment

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Both upper and lower surfaces can be UV irradiated. Even with an affordable version that is easy to use, we thoroughly pursue cost-effectiveness (effectiveness) in curing.

  • Other semiconductor manufacturing equipment

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Notice of Participation in "Semicon Japan 2018"

We will be exhibiting at "SEMICON Japan 2018," which will be held at Tokyo Big Sight in December 2018! We will be participating in the "SEMICON Japan 2018 (Back-End & General Zone)." ▼ Exhibited Products - "Ultrasonic Cutting Device CSX-400 Series" - "Chip 6-Sided Appearance Inspection Device CI-4000" - "Ultra-Low Load Compatible Flip Chip Bonder CB-600" - "Tabletop LED Light Source UV Irradiation Device" We sincerely invite you to visit our booth during this opportunity. 【Date】 December 12 (Wednesday) - 14 (Friday), 2018 10:00 AM - 5:00 PM 【Venue】 Tokyo Big Sight, East Exhibition Hall, Conference Hall 【Booth Number】 2009

A compact LED curing device that can be used on a tabletop. It can emit light from both the top and bottom, and its affordable price is also attractive! *Demo units available for loan.

  • Other semiconductor manufacturing equipment

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A compact LED curing device that can be used on a tabletop. It offers irradiation capabilities and is attractively priced! *Demo units available for loan.

  • Other semiconductor manufacturing equipment

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TGV Glass Microfabrication Technology LIDE (Laser Induced Deep Etching)

  • Other semiconductor manufacturing equipment

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Invitation to Exhibit at the Microwave Exhibition 2025

Microwave Exhibition 2025 Exhibition Overview 【Dates】November 26 (Wednesday) - 28 (Friday), 2025, 10:00-17:00 【Venue】Pacifico Yokohama Exhibition Hall 【Our Booth】Exhibition Hall D M-08 ■ Products from LPKF Laser & Electronics ■ 【Exhibits】 - High-frequency application circuit board processing machine "LPKF ProtoMat S104" A specialist for high-frequency and microwave applications. It is equipped with all the functions necessary for PCB prototyping. - LPKF glass micro-processing LIDE technology "Vitrion series" processing samples Micro-hole drilling of glass using LIDE technology = The LIDE method modifies the glass with a laser and then generates holes through an etching process, achieving a safe method without micro-cracks or chipping. Please click the related link below for pre-registration ☟ *Pre-registration is required for attendance. Feel free to reach out for technical consultations. We sincerely look forward to your visit. October 2025 Brooks Japan Co., Ltd. Contact: Toyama, Isobe

We have various types available, including high-load types and those that can be fixed to walls.

  • Workstation
  • Semiconductor inspection/test equipment
  • Desktop PC

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You can individually or simultaneously switch the negative pressure of the airway ON/OFF.

  • Vacuum Equipment
  • Sealing
  • Other semiconductor manufacturing equipment

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We provide repair and improvement services with extensive experience in peripheral equipment for semiconductor manufacturing devices.

  • Other semiconductor manufacturing equipment

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Introducing a tool grinder for end mills with a diameter of φ4 to 20mm, specifically for sharpening cutting edges!

  • drill
  • Wafer processing/polishing equipment

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Bottom blade 2, 3, 4 blade sharpening! The grinding wheel is a diamond #230 end mill sharpener specifically for carbide.

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  • drill
  • Wafer processing/polishing equipment

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A tabletop grinder that allows for easy re-sharpening of end mills without the need to send them out!

  • drill
  • Wafer processing/polishing equipment

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Automatic polishing makes it easy for women, achieving uniform finishing precision! Increases production efficiency, reduces costs, and improves the work environment!

  • Other surface treatment equipment
  • Wafer processing/polishing equipment

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Contributes to reducing tool costs! Easy to polish for anyone, including women and beginners!

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  • Wafer processing/polishing equipment
  • Tap

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Thin plate candle for steel frame, compatible with round swing type! Steel frame drill sharpener with a grinding range of φ12.1 to 32mm.

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  • drill
  • Wafer processing/polishing equipment

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Grinding range φ3 to 21mm! An automatic drill grinder that can automatically create conical shapes.

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  • Other surface treatment equipment
  • Wafer processing/polishing equipment

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Good hole processing is possible! You can regrind the brooch and reduce purchase costs.

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  • Wafer processing/polishing equipment

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Thin plates, candles, and steel frames only! Steel frame drill sharpening machine with a grinding range of φ12.1 to 32mm.

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  • drill
  • Wafer processing/polishing equipment

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