List of Polymer Materials products
- classification：Polymer Materials
1696～1710 item / All 16050 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Ideal for micro-machining! Achieves deburring of holes and double-sided machining in one pass, which was difficult with conventional tools!
- Other machine tools
We will be exhibiting at Mecatronics Tech Japan 2021 from October 20 (Wednesday) to October 23 (Saturday)!
Our company will exhibit at "Mechatrotech Japan 2021," which will be held at Portmesse Nagoya from Wednesday, October 20 to Saturday, October 23, 2021. We will introduce our tools, including the 'Bar Off Tool' capable of chamfering and deburring from a diameter of 0.8 mm, and the 'FEM' tool breakage detection device that reliably detects breakage. We look forward to your visit. (Booth number: 2B12)
Hints for developing calibration curve models for quality control using near-infrared analysis in the manufacturing processes of gasoline, petroleum, diesel oil, and lubricating oil.
- Spectroscopic Analysis Equipment
- plastic
- Composite Materials
Quantification of diethylene glycol, isophthalic acid, intrinsic viscosity, and acid value in PET resin, a type of polyester, using near-infrared spectroscopy.
- plastic
- Other polymer materials
- Spectroscopic Analysis Equipment
Technical document introducing the analysis of cetane index, total acid number (TAN), bromine number, aromatics, and sulfur in petroleum products using near-infrared analyzers.
- Near-infrared spectrophotometer
- Rubber
- Spectroscopic Analysis Equipment
Thermal adhesive film with a proven track record for semiconductor applications. Features include high insulating properties and heat resistance, making it suitable for ensuring insulation around IC c...
- Other semiconductors
- Other polymer materials
Achieves both high thermal conductivity and ease of use. Contributes to the performance improvement of industrial robots.
- Other polymer materials
- Other consumables
High thermal conductivity epoxy resin contributing to the improvement of automotive cooling performance.
- Other polymer materials
- Other consumables
Achieving both high thermal conductivity and ease of use. We solve the heat dissipation challenges of semiconductors.
- Other polymer materials
- Other consumables
Low-viscosity epoxy resin that solves the heat dissipation problem of high-output robots.
- Other polymer materials
- Other consumables
It enhances heat dissipation and contributes to the efficiency of power electronics.
- Other polymer materials
- Other consumables
Low viscosity, high thermal conductivity epoxy resin that contributes to improving the cooling performance of automobiles.
- Other polymer materials
- Other consumables
Epoxy resin that enhances heat dissipation and improves the reliability of semiconductor devices.
- Other polymer materials
- Other consumables
It is an adhesive that is expected to have strong adhesion to materials such as silicone rubber and foam.
- Other polymer materials
Added the heat-dissipating gap filler "TIA225GF" to AD-Chemi.
Momentive's "TIA225GF" is a two-component addition reaction type liquid silicone material for heat dissipation. The main agent (Component A) and the curing agent (Component B) are mixed in a weight ratio of 1:1 and cured by heating (70°C for 0.5 hours) or at room temperature (23°C for 24 hours). After curing, it becomes a rubber-like elastomer with a thermal conductivity of 2.5 W/(m·K), forming an excellent heat path. This product is a liquid material with excellent thixotropic properties (shape retention), resulting in minimal dripping or smudging after application, making it easy to fill complex-shaped parts and gaps. It ensures stable thermal contact with high followability even on uneven bonding surfaces and narrow gaps, which are difficult to address with conventional thermal interface materials. By containing high-fill fillers, it achieves both high thermal conductivity and electrical insulation, making it suitable for applications requiring high reliability, such as power modules and communication boards.
This is a thin film coating agent designed to protect electronic printed circuit boards (PCBs). It protects substrates and components from mechanical and environmental corrosion.
- Rubber
- Other polymer materials
Added the heat-dissipating gap filler "TIA225GF" to AD-Chemi.
Momentive's "TIA225GF" is a two-component addition reaction type liquid silicone material for heat dissipation. The main agent (Component A) and the curing agent (Component B) are mixed in a weight ratio of 1:1 and cured by heating (70°C for 0.5 hours) or at room temperature (23°C for 24 hours). After curing, it becomes a rubber-like elastomer with a thermal conductivity of 2.5 W/(m·K), forming an excellent heat path. This product is a liquid material with excellent thixotropic properties (shape retention), resulting in minimal dripping or smudging after application, making it easy to fill complex-shaped parts and gaps. It ensures stable thermal contact with high followability even on uneven bonding surfaces and narrow gaps, which are difficult to address with conventional thermal interface materials. By containing high-fill fillers, it achieves both high thermal conductivity and electrical insulation, making it suitable for applications requiring high reliability, such as power modules and communication boards.
We propose silicone adhesives, potting materials, and encapsulants that can also be used for conventional general-purpose devices requiring heat dissipation.
- Rubber
- Other polymer materials
Added the heat-dissipating gap filler "TIA225GF" to AD-Chemi.
Momentive's "TIA225GF" is a two-component addition reaction type liquid silicone material for heat dissipation. The main agent (Component A) and the curing agent (Component B) are mixed in a weight ratio of 1:1 and cured by heating (70°C for 0.5 hours) or at room temperature (23°C for 24 hours). After curing, it becomes a rubber-like elastomer with a thermal conductivity of 2.5 W/(m·K), forming an excellent heat path. This product is a liquid material with excellent thixotropic properties (shape retention), resulting in minimal dripping or smudging after application, making it easy to fill complex-shaped parts and gaps. It ensures stable thermal contact with high followability even on uneven bonding surfaces and narrow gaps, which are difficult to address with conventional thermal interface materials. By containing high-fill fillers, it achieves both high thermal conductivity and electrical insulation, making it suitable for applications requiring high reliability, such as power modules and communication boards.