List of Semiconductors and ICs products

  • classification:Semiconductors and ICs

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.

  • Other Pumps

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Decision to exhibit at the 1st Chubu Food Industry Creation Exhibition '26!

We will be exhibiting at the "1st Chubu Food Industry Creation Exhibition '26" to be held at Port Messe Nagoya from November 4 (Wednesday) to November 6 (Friday), 2026. As a new addition to our lineup, we will showcase the "Cordless Sanitary Handy Pump," which is a product we started selling in April last year, alongside our "Compact Sanitary Handy Pump Model MHS." - Cordless! Portable anywhere! Easy to use! Simple cleaning! It is compatible with standard 18L cans and BIB (Bag-in-Box) and features a structure that allows for easy disassembly and cleaning. We would like to invite you to visit us at this opportunity. - Venue: Port Messe Nagoya - Our exhibition booth: Hall 1 "C-66"

Super-thin film fluorine coating with excellent water and oil repellency!

  • Other semiconductors

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An ultra-thin fluorine coating with excellent liquid repellency for water and oil that surpasses PFA coatings.

  • Other semiconductors

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USB flash memory for industrial/embedded systems with lifespan confirmation, Swissbit "unitedCONTRAST-II series"

  • Memory
  • Embedded Board Computers
  • Storage

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Supports vertical mounting. Clip-on heat sink for TO-220 with black anodized finish.

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  • Other semiconductors

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Black anodized heat sink for TO-220. Compact design supports heat dissipation of semiconductors.

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  • Other semiconductors

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Clip-type heat sink that can be attached to TO-218 package transistors without screws.

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  • Other semiconductors

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Clip-type heatsink for TO-220 package semiconductors that can be mounted without screws.

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  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Copper clip-on heat sinks compatible with TO-218, TO-220, TO-247, TO-248, etc.

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  • Other semiconductors

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Not missing even the faintest fluctuations in heat! The secret of Toyota's highly sensitive thermal flow sensor "Energy flow" with low thermal resistance.

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  • Sensors
  • Other thermal analysis and measurement equipment
  • Other semiconductors

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The idea of designing heat based on heat flow rather than temperature. Towards the development of an efficient thermal management system with heat flow sensors!

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  • Sensors
  • Other thermal analysis and measurement equipment
  • Other semiconductors

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From margin design that protects by looking at temperature to confident design that attacks by looking at heat flow.

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  • Dedicated IC

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We have various press-fit pins in stock. From prototypes to mass production, leave the copper pins and sleeves for IGBT and SiC to us!

  • Other semiconductors

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We handle everything from mass production to small lot prototypes. Leave your prototype parts without molds to us!

  • Other semiconductors

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We will exhibit high-frequency related products produced in-house.

  • Peltier element
  • Other semiconductors
  • Other machine elements

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Continuous recording for long periods. Prevents frame drops and sudden card failures during 24-hour writing of AI image analysis and dash cameras.

  • Memory

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Compatible with 2 to 12-inch wafers. Customizable for each item.

  • Other cleaning machines
  • Other semiconductor manufacturing equipment
  • Other semiconductors

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Best cost performance! Shortest delivery time! A six-sided appearance inspection machine for chip-type multilayer ceramic capacitors utilizing artificial intelligence (AI).

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  • Wafer
  • Visual Inspection Equipment
  • Inductor Coil

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A comprehensive manufacturer of spacers that handles round pins, square pins, pin sockets, and more for pin headers.

  • Printed Circuit Board
  • PCB terminal blocks
  • Other semiconductors

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A comprehensive manufacturer of spacers dealing with round pins, square pins, pin sockets, and more for pin headers.

  • Printed Circuit Board
  • PCB terminal blocks
  • Other semiconductors

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Introducing the LED 2-stage and 3-stage stacked mounting spacer "LDZ-R" and the 45° type "LDZ-T"!

  • Printed Circuit Board
  • PCB terminal blocks
  • Other semiconductors

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Easily cut to any number below 10P! Continuous installation, vertical and horizontal compatible LED mounting spacer.

  • Printed Circuit Board
  • PCB terminal blocks
  • Other semiconductors

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A comprehensive manufacturer of spacers handling round pins, square pins, and pin sockets for pin headers.

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  • Printed Circuit Board
  • PCB terminal blocks
  • Other semiconductors

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A comprehensive manufacturer of spacers that handles round pins, square pins, pin sockets, and more for pin headers.

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  • Printed Circuit Board
  • PCB terminal blocks
  • Other semiconductors

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A comprehensive manufacturer of spacers handling round pins, square pins, pin sockets, and more for pin headers.

  • Printed Circuit Board
  • PCB terminal blocks
  • Other semiconductors

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A comprehensive manufacturer of spacers handling round pins, square pins, pin sockets, and more for pin headers.

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  • Printed Circuit Board
  • PCB terminal blocks
  • Other semiconductors

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A comprehensive manufacturer of spacers handling round pins, square pins, pin sockets, and more for pin headers.

  • Printed Circuit Board
  • PCB terminal blocks
  • Other semiconductors

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A comprehensive manufacturer of spacers that handles round pins, square pins, pin sockets, and more for pin headers.

  • Printed Circuit Board
  • PCB terminal blocks
  • Other semiconductors

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A comprehensive manufacturer of spacers handling round pins, square pins, pin sockets, and more for pin headers.

  • Printed Circuit Board
  • PCB terminal blocks
  • Other semiconductors

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A comprehensive manufacturer of spacers handling round pins, square pins, pin sockets, and more for pin headers.

  • Printed Circuit Board
  • PCB terminal blocks
  • Other semiconductors

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A comprehensive manufacturer of spacers handling round pins, square pins, pin sockets, and more for pin headers.

  • Printed Circuit Board
  • PCB terminal blocks
  • Other semiconductors

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New CVS analysis device "894 Professional CVS" for measuring organic additives in copper sulfate plating baths and tin/lead baths.

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  • Analytical Equipment and Devices
  • Plating Equipment
  • Wafer

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"894 Professional CVS Analyzer" capable of multi-sample continuous automatic analysis by combining a sample changer and an electric burette.

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  • Analytical Equipment and Devices
  • Plating Equipment
  • Wafer

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HI-6139 Application Development Kit For MIL-STD-1553

  • Evaluation Board
  • Dedicated IC

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Providing high-performance GaN epitaxial wafers! Ensuring high reliability even during long hours of continuous operation.

  • Other semiconductors
  • Wafer

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Hybrid sintering die attach adhesive as a replacement for lead solder and epoxy adhesive.

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  • Dedicated IC

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Explaining semiconductor encapsulation materials in the AI era. Learning about the latest trends in low dielectric, high thermal conductivity, and optoelectronic integration technologies.

  • Other semiconductors
  • plastic
  • Technical Seminar

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20261111 データセンター向けパッケージの技術動向と 封止材の設計・評価技術.png

11/11 Webinar on Sealing Material Technology for Data Centers

■Title: "Technological Trends in Packaging for Data Centers and Design/Evaluation Techniques for Encapsulation Materials" This presentation will explain the packaging technologies and encapsulation materials that support semiconductor devices for data centers, which continue to evolve with the proliferation of AI. We will organize the trends of the latest packaging technologies, such as chiplets and wafer-level packaging, while systematically learning the design requirements and evaluation techniques for encapsulation materials, including high purity, moisture resistance, low stress, low dielectric loss, and high thermal conductivity. Additionally, we will introduce the latest trends in optoelectronic integration technologies that support next-generation data centers. - Technical trends in packaging for data centers - Design techniques for semiconductor encapsulation materials - Evaluation techniques for semiconductor encapsulation materials - Wafer-level packaging and chiplet technology - Latest trends in optoelectronic integration technology - Designers of semiconductor encapsulation materials - Engineers using semiconductor encapsulation materials - Developers of epoxy resins and hardeners - R&D personnel from semiconductor material manufacturers

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