List of Analysis Services products
- classification：Analysis Services
121～135 item / All 586 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
Analysis of inorganic compounds such as metal oxides is also possible!
- Analysis Services
- Contract Analysis
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
Examples of analysis using EBSD, such as 'Observation/Elemental Analysis' and 'Analysis by EBSD'!
- Contract Analysis
- Analysis Services
Applying advanced sample preparation techniques and failure analysis equipment for semiconductors! Investigating the causes of non-lighting and brightness degradation.
- Contract Analysis
- Analysis Services
Examples of semiconductor observation using mechanical polishing.
In the methods for cross-section preparation in semiconductor structure observation and defect analysis, CP, FIB, and mechanical polishing are mentioned, each having its own advantages and disadvantages, making it necessary to consider which method to use. In recent years, CP and FIB have become more common, and it seems that the use of mechanically polished methods, which require technical skill, is decreasing. However, it is still not something to be dismissed. While there are merits and demerits, it is possible to achieve cross-section preparation with mechanical polishing that is on par with FIB and CP. At our company, based on years of accumulated know-how, we propose the most appropriate processing method according to the observation purpose, sample composition, and structure.
Back grinding is possible with various types of semiconductors! You can observe the elements and the condition of defects.
- Analysis Services
- Semiconductor inspection/test equipment
![[Data] Whisker Analysis by EBSD](https://image.mono.ipros.com/public/product/image/dcb/2000552755/IPROS61764853026228393387.png?w=280&h=280){kind=small}
Introducing a case study analyzing whiskers that occurred on the lead terminals of an IC package!
- Other contract services
- Contract Analysis
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
At Omron's Yasu facility, which has a maximum 8-inch MEMS line, we respond to various customer requests from prototype to mass production in the wafer process!
- Analysis Services
- Contract Analysis
With our advanced technology, we can also create cross-sections of highly challenging samples!
- Analysis Services
- Contract Analysis
Observation of tracking camera cross-section by mechanical grinding.
I would like to introduce "Cross-sectional observation of tracking camera using mechanical polishing." Regarding the structure of the tracking camera components, when viewed from above, the lens can be identified. Although it cannot be clearly seen in the X-ray image, the lens is incorporated into the convex part. Additionally, the cross-sectional structure is similar to that of an RGB sensor, featuring a back-illuminated CMOS structure. However, since color information is not necessary for the tracking camera, there is no color filter layer. A jagged uneven shape was observed on the surface of the photodiode.
![[Analysis Example by EBSD] Kanikan](https://image.mono.ipros.com/public/product/image/ada/2000560445/IPROS24200233374735850115.jpeg?w=280&h=280){kind=small}
Here is an example of analysis regarding the broken part of a crab claw that was damaged due to long-term use!
- Analysis Services
- Contract Analysis
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
Solid samples can leach ionic components into pure water! Trace ionic components in the aqueous solution can be detected with high sensitivity.
- Analysis Services
- Other contract services
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
Accurately grasping defects! It is possible to conduct extensive bulk observations as well as partial magnifications, accommodating various types of observations.
- Analysis Services
- Other contract services
We undertake contract processing and manufacturing of cross-sections of various parts and materials.
- Analytical Equipment and Devices
- Analysis Services
Confirmation of chiplet package structure by mechanical polishing.
Regarding the chip mounted on the main circuit board of the VR goggles manufactured by Company A, upon visual observation, it was inferred that it has a chiplet structure with multiple chips integrated. To examine the structure in more detail, we created a cross-section using X-ray CT observation and mechanical polishing, and we will introduce the structural confirmation results. *For more details, please download the PDF or feel free to contact us.*
We conduct surface analysis, foreign substance analysis, and organic composition analysis.
- Analytical Equipment and Devices
- Analysis Services
Analysis of organic-inorganic composite materials using FT-IR and EDX.
We will introduce an example of analyzing organic-inorganic composite materials using FT-IR and SEM-EDX. FT-IR measurements were conducted on the glossy and non-glossy areas of a PET bottle label, and the IR spectra differed between the glossy and non-glossy areas. Since the non-glossy area resembles the spectrum of acrylic resin, it is considered that the main component is acrylic resin. Additionally, SEM-EDX measurements were performed on both the glossy and non-glossy areas, and EDX spectra and backscattered electron images were obtained, revealing that the non-glossy area contained sulfur (S) and barium (Ba), which were not detected in the glossy area.
Transitional thermal measurement possible power cycle testing, with a customized luminescence/OBIRCH analysis device, where a skilled team thoroughly evaluates and analyzes power devices!
- Analytical Equipment and Devices
- Analysis Services
Rubber heat aging test
Our company conducts "rubber thermal aging tests" that help evaluate the properties of materials in actual usage environments. Using a method compliant with JIS K6257 (Method for determining thermal aging characteristics of vulcanized rubber and thermoplastic rubber), rubber test pieces are suspended in a gear oven to create specimens with varying heat treatment times. Additionally, tensile tests are performed on heated natural rubber (NR) to investigate changes in mechanical properties, while hardness is measured simultaneously. Changes in the characteristics of the rubber are also examined, confirming that rubber elasticity is lost and the material becomes harder with heating.
![[Example of analysis using EBSD] Ch...](https://image.mono.ipros.com/public/product/image/9e0/2000533345/IPROS08836877231324882336.png?w=280&h=280){kind=small}
I will introduce an example of analysis using EBSD where orientation was observed in the Al wiring.
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
![[Example of analysis using EBSD] Pi...](https://image.mono.ipros.com/public/product/image/897/2000533372/IPROS07160873482234831807.png?w=280&h=280){kind=small}
I will introduce an example of analysis using EBSD for pipes (austenitic).
- Analytical Equipment and Devices
- Analysis Services
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.