List of Other semiconductor manufacturing equipment products
- classification：Other semiconductor manufacturing equipment
46～90 item / All 2030 items
We provide comprehensive support from design to manufacturing and maintenance!
- Contract manufacturing
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
CNC machining in a palm-sized format to meet the needs of special containers.
- Other semiconductor manufacturing equipment
- Processing Contract
Palm-sized machining for medical device implants.
- Other semiconductor manufacturing equipment
- Processing Contract
Leave the precision cutting of fixtures for semiconductor manufacturing to us.
- Other semiconductor manufacturing equipment
- Processing Contract
Leave the precise machining of robot exterior covers to us.
- Other semiconductor manufacturing equipment
- Processing Contract
Leave the precision machining of speaker cones for audio equipment to us.
- Other semiconductor manufacturing equipment
- Processing Contract
Leave the precision machining of custom parts for sports equipment to us.
- Other semiconductor manufacturing equipment
- Processing Contract
Leave the precision machining for palm-sized models to us.
- Other semiconductor manufacturing equipment
- Processing Contract
Please leave the palm-sized machining of hygienic components for food processing to us.
- Other semiconductor manufacturing equipment
- Processing Contract
![[Director's Blog] The Importance of...](https://image.mono.ipros.com/public/product/image/377788/IPROS3009093441792242324.png?w=280&h=280){kind=small}
The Importance of Primer - The Invisible Undercoat Determines Longevity - Part 7
- Other semiconductor manufacturing equipment
There is a track record of adopting load ports. We propose brush seals as a solution for gaps in semiconductor manufacturing equipment.
- Other semiconductor manufacturing equipment
- Semiconductor inspection/test equipment
- Molding Equipment
Just install the GEM module between the device and the host!
- Communications
- Other semiconductor manufacturing equipment
TGV Glass Microfabrication Technology LIDE (Laser Induced Deep Etching)
- Other semiconductor manufacturing equipment
Invitation to Exhibit at the Microwave Exhibition 2025
Microwave Exhibition 2025 Exhibition Overview 【Dates】November 26 (Wednesday) - 28 (Friday), 2025, 10:00-17:00 【Venue】Pacifico Yokohama Exhibition Hall 【Our Booth】Exhibition Hall D M-08 ■ Products from LPKF Laser & Electronics ■ 【Exhibits】 - High-frequency application circuit board processing machine "LPKF ProtoMat S104" A specialist for high-frequency and microwave applications. It is equipped with all the functions necessary for PCB prototyping. - LPKF glass micro-processing LIDE technology "Vitrion series" processing samples Micro-hole drilling of glass using LIDE technology = The LIDE method modifies the glass with a laser and then generates holes through an etching process, achieving a safe method without micro-cracks or chipping. Please click the related link below for pre-registration ☟ *Pre-registration is required for attendance. Feel free to reach out for technical consultations. We sincerely look forward to your visit. October 2025 Brooks Japan Co., Ltd. Contact: Toyama, Isobe
Disco SPR-101 Robot System Modification
- Other semiconductor manufacturing equipment
We provide repair and improvement services with extensive experience in peripheral equipment for semiconductor manufacturing devices.
- Other semiconductor manufacturing equipment
High-performance, cost-effective RF/DC magnetron sputtering device for research and development.
- Other semiconductor manufacturing equipment
- Sputtering Equipment
□■□【MiniLab-080】Flexible Thin Film Experimental Device□■□ Can be configured flexibly according to requirements for processes such as deposition, sputtering, EB deposition, and organic deposition.
The ML-080, with a volume of 80 liters and dimensions of 400(W)x400(D)x570(H)mm, is composed of a D-type box chamber. It has the same configuration as the 070 model but features a taller chamber, which extends the TS distance adjustment range and improves film uniformity during deposition on large-diameter substrates, making it an optimal model for vacuum deposition. It is a higher-end model than the ML-070, which can also add a load lock mechanism. Like the 070, it is compact yet supports a wide range of applications including resistance heating deposition (for metals, insulators, and organic materials), EB deposition, RF/DC/PulseDC compatible magnetron sputtering, RIE plasma etching, and annealing. - Maximum substrate size: Φ11 inch - Resistance heating deposition sources x up to 4 units - Organic deposition sources x up to 4 units - Magnetron sputtering cathodes x 4 units - Electron beam deposition - Substrate heating stage (standard 500℃, Max 1000℃) - *Plasma etching / <30W soft etching *Plasma etching can be installed in both the main chamber and the load lock chamber.
Modular remote I/O coupler unit that can efficiently configure the number of I/O points supported by EtherNet/IP.
- Other semiconductor manufacturing equipment
Modular remote I/O coupler unit that can efficiently configure the number of I/O points supported by EtherNet/IP.
- Other semiconductor manufacturing equipment
High-precision measurement of dew point, temperature and humidity, wind speed, and oxygen. Numerous compact models that are easy to integrate into devices! Ensures long-term stability for semiconducto...
- Sensors
- Sensors
- Other semiconductor manufacturing equipment
The embedded vapor barrier reduces the risk of corrosion under insulation (CUI).
- Piping Materials
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
This is a lineup of devices incorporating Rise One's precision transfer technology.
- Other semiconductor manufacturing equipment
Automatically ejects NG products after measurement! A device that measures the height of ICs in automatically loaded JEDEC trays.
- Other semiconductor manufacturing equipment
Height Inspection Device 【Automatic Measurement of ICs and Automatic Discharge of Defective Products】 - Production Achievements Introduction -
The height of ICs in the loaded JEDEC tray is measured, and defective products are ejected and unloaded, all done automatically. The lead frames stored in the slot magazine (up to 30x50) are loaded one by one onto the measurement stage for height measurement. Height measurements can be performed within a viewing angle of 10mm and a height of 0.7mm. Defective products are ejected based on inspection results, and good products are automatically filled into empty pockets. - Equipped with two 3D displacement sensors, KEYENCE WI-010. - Measurement time per piece is 0.35 seconds. - Tray replacement takes less than 0.5 seconds. - Up to 40 JEDEC trays can be automatically loaded. - After the automatic ejection of defective products, good products are automatically loaded.
A device that automatically performs UV imprinting on glass substrates and the like.
- Other semiconductor manufacturing equipment
Strong durability against ultraviolet rays and high temperatures.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
- Piping Materials
Achieving both high purity and high yield. Contributing to the purification of semiconductor materials.
- Other semiconductor manufacturing equipment
- Refining and Extraction Equipment
- Organic EL
A space-saving cleaning device that removes foreign substances and metal contamination in a single chamber! It accommodates applications from mass production to research and development through a comb...
- Other semiconductor manufacturing equipment
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[Leakage Prevention] Not a single drop of leakage will be overlooked without touching. Move to liquid leakage monitoring without tape.
- Business Intelligence and Data Analysis
- Other measurement, recording and measuring instruments
- Other semiconductor manufacturing equipment
Notice of Participation in the 'Hokuyou Bank Manufacturing Sustainability Fair'
We are pleased to announce that we will be exhibiting at the "Hokuyo Bank Manufacturing Sustainability Fair" to be held on July 22, 2026 (Wednesday) at Access Sapporo. We would like to invite you to visit us at this opportunity. <Exhibition Overview> Name: Hokuyo Bank Manufacturing Sustainability Fair Date: July 22, 2026 (Wednesday) Venue: Access Sapporo, Booth Number 86 <Exhibited Products> ■ Energy-saving Wireless Mesh Network NetNucleus LPWA We will introduce a solution that easily realizes the collection and visualization of monitoring data from manufacturing equipment using wireless devices powered by AA batteries. ■ Wind Direction and Speed IoT Sensor anemolink-2D We will showcase a wind direction and speed meter that allows for easy visualization and data collection of wind direction and speed in environments such as semiconductor clean rooms. ■ Liquid Leak Detection Algorithm Liquidseeker We will present a technology that detects liquid leaks non-contact, contributing to reduced maintenance costs by eliminating issues such as disconnection and peeling compared to traditional leak detection tape.
It is possible to generate electrolyzed ionized water using a special electrolytic cell for ultrapure water, which has low electrical conductivity.
- Other semiconductor manufacturing equipment
Automatic separation of water from solvent waste and purification of contained resist components, etc.
- Other semiconductor manufacturing equipment
It is an environmentally friendly cleaning device that does not use chemical solutions.
- Other semiconductor manufacturing equipment
A group of trade specialists! We build interactive relationships between the world and Japan.
- Other electronic parts
- Other physicochemical equipment
- Other semiconductor manufacturing equipment
![[Materials Available!] The Role of ...](https://image.mono.ipros.com/public/product/image/2094225/IPROS15454391273452869385.png?w=280&h=280){kind=small}
"Unseen particles" undermine processing quality. What are the data-driven solutions that successfully achieve precise filtration of brittle materials?
- Grinding Machine
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
The philosophy of the "trinity" that supports precision machining! From "experience" to selection based on "science."
- Grinding Machine
- Other semiconductor manufacturing equipment
- Filtration Equipment
Significantly reduce tact time with continuous dispensing! The ultra-precision dispenser device 'Quspa-LX' enables high-precision fine dispensing.
- Other semiconductor manufacturing equipment
Notice of Exhibited Products and Events for Nepcon Japan 2024
We are pleased to announce that Shinwa will be exhibiting at the Internepcon Japan, which will be held from January 24 to January 26. Date: January 24 (Wed) - January 26 (Fri) 10:00 AM - 5:00 PM Location: Tokyo Big Sight, East Hall 1 Booth Number: [E4-8B] At our booth, we will be showcasing the newly redesigned dispenser device "Quspa-LX" for the first time. You will be able to see a demonstration. Additionally, we will introduce the TXC Corporation's crystal oscillators, which hold the number one global market share, and the CMOS camera modules for automotive applications from the Foxconn Group. On January 25 (Thu), the famous YouTuber Monozukuri Taro will be appearing at our booth! He will clearly explain the appeal of our new products. There will be two sessions on that day, so don't miss this opportunity! Morning: 11:00 AM Afternoon: 3:00 PM We look forward to seeing you there. Please note that pre-registration is required for entry to Internepcon Japan this year. If you have not registered, please do so via the link.