List of Other electronic parts products
- classification：Other electronic parts
5356～5400 item / All 8139 items
The purpose depends on your ideas! A small swivel bearing "Rakkaru" that allows you to easily and lightly rotate heavy objects!
- Metal bearings
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
Remote control evaluation board for wireless modules
- Other electronic parts
- Other machine elements
Free release of circuit diagrams in the instruction manual! Easy evaluation and experimentation with the IM radio HAT for Raspberry Pi.
- Other electronic parts
- Other machine elements
Reliable boot-up storage and DRAM modules, etc. Actual exhibits at the Embedded Systems Development Technology Exhibition.
- Storage Backup
- Memory
- Other electronic parts
This is a compact surface mount package designed with environmental considerations, featuring an overvoltage protection device that supports industry-leading maximum impulse voltage.
- Other electronic parts
Built-in proportional amplifier, freely programmable PLC.
- Other electronic parts
- Hydraulic Equipment
- Remote Control
Due to changes in international standards, the voltage range has been expanded and the testing conditions have become stricter. The protective element SM8SF-Q is compliant with the new standards and i...
- Other electronic parts
The SMD type comes in two varieties: low voltage (3-170V) and medium voltage (14-385V), with a surge current tolerance of 30-1,200A.
- Other electronic parts
This is a proposal for overcurrent and overvoltage protection for USB Power Delivery in the product lineup offered by Bones Corporation.
- Other electronic parts
Direct connection to a through-hole type metal oxide varistor! Reduces the aging deterioration, which is a weakness of MOVs.
- Other electronic parts
Taiwan TOKEN Corporation's high voltage divider 【high precision, high voltage, high power】
- Other electronic parts
We offer our manufacturing and processing facilities to fabless companies! Let us introduce our SMT business.
- Contract manufacturing
- Processing Contract
- Other electronic parts
We can accommodate from a single prototype! We have a diverse inventory of parts and can also handle short delivery times!
- Processing Contract
- Other electronic parts
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High reliability with stable and strong joints! The shield cover can be easily removed, improving workability.
- Other electronic parts
High-temperature applications up to 150℃ are possible! Based on our extensive experience in developing press-fit products, we can propose specifications suitable for your application.
- Other electronic parts
- Crimp Terminal
- Optical Connector
Achieving high performance and high quality! In-house integrated production from mold design to modularization.
- Other electronic parts
- Other machine elements
- Contract manufacturing
Ultra-small satellite, CubeSat, with AIS receiver
- Other electronic parts
- others
A variety of products are available, including SPXO crystal oscillators that can withstand high temperatures!
- Other electronic parts
It is possible to arrange numerous fine holes of 0.01 to 0.03 mm on the surface! Applicable to custom-shaped products according to specifications.
- Heat exchanger
- Other electronic parts
- air conditioning
Solid-phase diffusion bonding refers to [WELCON Corporation].
Capable of manufacturing complex fine three-dimensional structures! We have a proven track record in various fields such as aerospace and chemical plants. Solid-state diffusion bonding is a method of directly bonding materials together, which is significantly different from techniques like welding or brazing. This technology promotes atomic movement at the bonding interface by heating and applying pressure to the materials being joined, allowing for bonding without melting the materials, thus expanding the range of possible manufacturing methods and functions. With the solid-state diffusion bonding method, it is possible to create fluid devices with microchannel structures and complex fine three-dimensional structures. 【Features】 ■ Lamination bonding of thin plates is possible ■ Bonding strength comparable to the base material can be achieved ■ Complex hollow components can be manufactured ■ Precise bonding with minimal deformation is possible ■ Bonding of dissimilar materials is possible *For more details, please refer to the PDF document or feel free to contact us.
Thin rib shape allows for internal cooling circuits to be placed even in narrow areas! Suitable for application in molds designed for high cycles.
- Heat exchanger
- Other electronic parts
- air conditioning
Solid-phase diffusion bonding refers to [WELCON Corporation].
Capable of manufacturing complex fine three-dimensional structures! We have a proven track record in various fields such as aerospace and chemical plants. Solid-state diffusion bonding is a method of directly bonding materials together, which is significantly different from techniques like welding or brazing. This technology promotes atomic movement at the bonding interface by heating and applying pressure to the materials being joined, allowing for bonding without melting the materials, thus expanding the range of possible manufacturing methods and functions. With the solid-state diffusion bonding method, it is possible to create fluid devices with microchannel structures and complex fine three-dimensional structures. 【Features】 ■ Lamination bonding of thin plates is possible ■ Bonding strength comparable to the base material can be achieved ■ Complex hollow components can be manufactured ■ Precise bonding with minimal deformation is possible ■ Bonding of dissimilar materials is possible *For more details, please refer to the PDF document or feel free to contact us.
By miniaturizing, it is also possible to reduce flow rate! Introducing microchannel heat exchangers.
- Heat exchanger
- Other electronic parts
- air conditioning
Efforts to miniaturize heat exchangers
By miniaturizing, it is also possible to suppress flow rate! Introducing microchannel heat exchangers. We would like to introduce our efforts in miniaturizing heat exchangers. Heat exchangers that implement flow paths using microchannels can be miniaturized without compromising heat exchange performance compared to conventional heat exchangers. Additionally, miniaturization allows for the suppression of flow rate. At WELCON, we have reduced the volume to one-hundredth while maintaining the same performance using microchannels. You can find more details through the related links. [Overview] ■ Microchannel heat exchangers ■ Increased heat transfer area due to microchannel technology ■ High corrosion resistance and heat resistance through solid-phase diffusion bonding *For more details, please refer to the PDF materials or feel free to contact us.
Capable of manufacturing complex fine three-dimensional structures! We have a proven track record in various fields such as aerospace and chemical plants.
- Heat exchanger
- Other electronic parts
- air conditioning
Solid-phase diffusion bonding refers to [WELCON Corporation].
Capable of manufacturing complex fine three-dimensional structures! We have a proven track record in various fields such as aerospace and chemical plants. Solid-state diffusion bonding is a method of directly bonding materials together, which is significantly different from techniques like welding or brazing. This technology promotes atomic movement at the bonding interface by heating and applying pressure to the materials being joined, allowing for bonding without melting the materials, thus expanding the range of possible manufacturing methods and functions. With the solid-state diffusion bonding method, it is possible to create fluid devices with microchannel structures and complex fine three-dimensional structures. 【Features】 ■ Lamination bonding of thin plates is possible ■ Bonding strength comparable to the base material can be achieved ■ Complex hollow components can be manufactured ■ Precise bonding with minimal deformation is possible ■ Bonding of dissimilar materials is possible *For more details, please refer to the PDF document or feel free to contact us.
It is possible to cool uniformly without temperature variation! We offer customization of standard products and prototype development from scratch.
- Heat exchanger
- Other electronic parts
- air conditioning
[Explanatory Material] What is a Water-Cooled Microchannel Heat Sink? *Free Distribution
Fresh refrigerant is evenly distributed within the plane! It is possible to reduce temperature variations, improve cooling efficiency, and achieve low thermal resistance. A heat sink is a component used to cool absorbed heat, commonly used when dissipating heat from heat sources like CPUs, often utilizing a structure called "fins" to release heat into the air or to absorb heat by flowing water inside. Our company designs, manufactures, and sells water-cooled heat sinks, referred to as "microchannel heat sinks." The "water-cooled microchannel heat sink" allows fresh refrigerant to be evenly distributed within the plane, reducing temperature variations, improving cooling efficiency, and achieving low thermal resistance. [Structure] - Matrix structure - Distribution flow path - Microchannel flow paths arranged across the entire cooling surface - Internal structure that ensures refrigerant is evenly distributed across all flow paths *For more details, please refer to the PDF document or feel free to contact us. https://www.ipros.jp/product/detail/2000726009
Achieves high heat exchange performance and miniaturization! Reduces coolant usage, and fittings can be connected from both sides.
- Heat exchanger
- Other electronic parts
- air conditioning
Constructed with a core and core plate! Introducing a composite material that achieves both thermal conductivity and low thermal expansion rate.
- Heat exchanger
- Other electronic parts
- air conditioning
Smooth the walls of the resin channel (internal) to reduce flow resistance! It can be applied to injection molding molds and more.
- Heat exchanger
- Other electronic parts
- air conditioning
Solid-phase diffusion bonding refers to [WELCON Corporation].
Capable of manufacturing complex fine three-dimensional structures! We have a proven track record in various fields such as aerospace and chemical plants. Solid-state diffusion bonding is a method of directly bonding materials together, which is significantly different from techniques like welding or brazing. This technology promotes atomic movement at the bonding interface by heating and applying pressure to the materials being joined, allowing for bonding without melting the materials, thus expanding the range of possible manufacturing methods and functions. With the solid-state diffusion bonding method, it is possible to create fluid devices with microchannel structures and complex fine three-dimensional structures. 【Features】 ■ Lamination bonding of thin plates is possible ■ Bonding strength comparable to the base material can be achieved ■ Complex hollow components can be manufactured ■ Precise bonding with minimal deformation is possible ■ Bonding of dissimilar materials is possible *For more details, please refer to the PDF document or feel free to contact us.
Joining different metals is possible! We will propose prototypes suitable for the desired combination of materials and sizes.
- Heat exchanger
- Other electronic parts
- air conditioning
Solid-phase diffusion bonding refers to [WELCON Corporation].
Capable of manufacturing complex fine three-dimensional structures! We have a proven track record in various fields such as aerospace and chemical plants. Solid-state diffusion bonding is a method of directly bonding materials together, which is significantly different from techniques like welding or brazing. This technology promotes atomic movement at the bonding interface by heating and applying pressure to the materials being joined, allowing for bonding without melting the materials, thus expanding the range of possible manufacturing methods and functions. With the solid-state diffusion bonding method, it is possible to create fluid devices with microchannel structures and complex fine three-dimensional structures. 【Features】 ■ Lamination bonding of thin plates is possible ■ Bonding strength comparable to the base material can be achieved ■ Complex hollow components can be manufactured ■ Precise bonding with minimal deformation is possible ■ Bonding of dissimilar materials is possible *For more details, please refer to the PDF document or feel free to contact us.
Samples with internal pressure applied to hollow joint components, and reactors that also have the function of heat exchangers!
- Heat exchanger
- Other electronic parts
- air conditioning
The realization of fine 3D structures is WELCON.
The realization of fine 3D structures is at WELCON! It is possible to create fine hole shapes with a high aspect ratio. Shapes that are difficult or impossible to produce with conventional machining can be manufactured. Parts can be made using machining, etching, pressing, etc. If you provide the specifications (quantity, material, dimensional accuracy, etc.), we will assist you from the design stage. 【Features】 ○ Round cross-section holes with curvature can be produced ○ Fine hole shapes with a high aspect ratio can be produced ○ Square cross-section holes can be produced For more details, please contact us or download the catalog.
It is possible to stack and join accurately, allowing for holes to be penetrated! Pressure loss can be controlled.
- Heat exchanger
- Other electronic parts
- air conditioning
For those looking for an automatic machine for radial taping!
- Other electronic parts
- Taping Machine
This is an automatic machine for taping radial-shaped electronic components! 【Radial Type Forming Taping Machine CFT-450】
This machine converts electronic components (LEDs and others) supplied to Panasonic machines and other mounting machines into taped products at high speed. It is a dedicated machine that aligns the polarity of the lead wires of radial electronic components, forms them into tape, and stores them in a specially designed box in a zigzag manner. 【Features】 - High-speed stabilization of supply through indexing and belts. - Possibility of visual inspection of the shape after taping. - Equipped with a mechanism for ejecting defective products before taping. - Increases the operating rate of the box automatic exchange device installation process. * For other functions and details, please refer to the PDF materials. Feel free to contact us for inquiries.
Accommodating a wide range of needs, including complex large units! PCB assembly and equipment manufacturing are available from a single unit.
- EMS
- Contract manufacturing
- Other electronic parts
CEI manufactured camera link HS cable
- Other electronic parts
I/O cable for Allied Vision MAKO manufactured by CEI Corporation
- Other electronic parts
CEI manufactured industrial I/O (GigE) cable
- Other electronic parts
I/O cable for Teledyne Dalsa Z-TRACK 3D Laser Profile manufactured by CEI.
- Other electronic parts
We respond to our customers' needs by utilizing a variety of methods such as insert molding, outsert molding, and ultrasonic welding.
- Press Dies
- Other electronic parts
Design and manufacturing of ultra-precision molds for mass production from a single component.
- Other electronic parts
- Other semiconductors
- Processing Jig
Expanding the next generation with trading company functions and manufacturing! We respond to needs with reliable technical expertise.
- Other machine elements
- Other food machinery
- Other electronic parts
I/O cable for Teledyne Dalsa PIRANHA ES manufactured by CEI.
- cable
- Other optical parts
- Other electronic parts
Midopt Color Filters
- filter
- Other optical parts
- Other electronic parts
Unbelievably low price! Japanese-made solenoids at a low cost!
- Other electronic parts
A high-performance image input board that can continuously capture a large amount of image data.
- Other electronic parts
- Other optical parts
Low frequency use, 2.0mm height, low profile! Compatible with standard 4.88mm pitch crystal oscillators during mounting.
- Other electronic parts
Ultra-compact and ultra-thin! Achieved high stability, high reliability, and excellent heat resistance and environmental resistance.
- Other electronic parts