List of Other semiconductors products
- classification：Other semiconductors
61～75 item / All 2693 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.
- Other Pumps
Decision to exhibit at the 1st Chubu Food Industry Creation Exhibition '26!
We will be exhibiting at the "1st Chubu Food Industry Creation Exhibition '26" to be held at Port Messe Nagoya from November 4 (Wednesday) to November 6 (Friday), 2026. As a new addition to our lineup, we will showcase the "Cordless Sanitary Handy Pump," which is a product we started selling in April last year, alongside our "Compact Sanitary Handy Pump Model MHS." - Cordless! Portable anywhere! Easy to use! Simple cleaning! It is compatible with standard 18L cans and BIB (Bag-in-Box) and features a structure that allows for easy disassembly and cleaning. We would like to invite you to visit us at this opportunity. - Venue: Port Messe Nagoya - Our exhibition booth: Hall 1 "C-66"
A comprehensive manufacturer of spacers handling round pins, square pins, pin sockets, and more for pin headers.
- Printed Circuit Board
- PCB terminal blocks
- Other semiconductors
A comprehensive manufacturer of spacers handling round pins, square pins, pin sockets, and more for pin headers.
- Printed Circuit Board
- PCB terminal blocks
- Other semiconductors
Providing high-performance GaN epitaxial wafers! Ensuring high reliability even during long hours of continuous operation.
- Other semiconductors
- Wafer
Explaining semiconductor encapsulation materials in the AI era. Learning about the latest trends in low dielectric, high thermal conductivity, and optoelectronic integration technologies.
- Other semiconductors
- plastic
- Technical Seminar
11/11 Webinar on Sealing Material Technology for Data Centers
■Title: "Technological Trends in Packaging for Data Centers and Design/Evaluation Techniques for Encapsulation Materials" This presentation will explain the packaging technologies and encapsulation materials that support semiconductor devices for data centers, which continue to evolve with the proliferation of AI. We will organize the trends of the latest packaging technologies, such as chiplets and wafer-level packaging, while systematically learning the design requirements and evaluation techniques for encapsulation materials, including high purity, moisture resistance, low stress, low dielectric loss, and high thermal conductivity. Additionally, we will introduce the latest trends in optoelectronic integration technologies that support next-generation data centers. - Technical trends in packaging for data centers - Design techniques for semiconductor encapsulation materials - Evaluation techniques for semiconductor encapsulation materials - Wafer-level packaging and chiplet technology - Latest trends in optoelectronic integration technology - Designers of semiconductor encapsulation materials - Engineers using semiconductor encapsulation materials - Developers of epoxy resins and hardeners - R&D personnel from semiconductor material manufacturers
An overview of advanced packaging technologies from 2.5D/3D chiplets to thermal management, reliability evaluation, and PFAS compliance.
- Other semiconductor manufacturing equipment
- Other semiconductors
- Technical Seminar
11/10 Webinar Advanced Semiconductor Packaging Technology
■Title: "The Complete Picture of Advanced Semiconductor Packaging Technology - From 2.5D/3D and Chiplets to Thermal and Power Solutions, Reliability Evaluation, and PFAS Compliance -" ――A systematic explanation of advanced packaging technologies that support the evolution of AI semiconductors. In addition to the latest technological trends in 2.5D/3D packaging, chiplets, CoWoS, TSV, and glass core substrates, you will learn broadly about manufacturing processes, yield improvement, failure analysis, reliability evaluation, PFAS regulatory compliance, and thermal and power design. Practical case studies and evaluation analysis techniques directly related to work will also be explained in detail. - Basics of semiconductor packaging technology and the evolution of trends - Latest trends in 2.5D/3D and chiplet technology - Reliability testing and failure analysis techniques - Key points for yield improvement - PFAS regulatory compliance and sustainable materials - Thermal and power design technologies for advanced packaging aimed at AI - Engineers and researchers from chemical, electronics, electrical, and automotive manufacturers - Personnel involved in semiconductor backend processes and assembly technologies - Personnel involved in materials and equipment development - Those who want to systematically learn about advanced packaging technologies
We provide comprehensive support from semiconductor design to embedded software development!
- Other semiconductors
- Other services
- Embedded system design service
AssetCore Technology Inc. Company Profile
Asset Core Technology Co., Ltd. provides comprehensive support from semiconductor design to embedded software development. Our "semiconductor design services" feature reliable achievements and expertise in LSI design and verification technology. In "system design development," we offer a one-stop service through collaborative design of hardware and software. Additionally, we conduct "model-based development," where engineers well-versed in MBD assist our clients' operations, as well as "embedded software development," which is grounded in an understanding of hardware.